• Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled
• Mass production of products with best-in-class bandwidth and capacity to start in 2H 2025 following certification process
• Enhancement of position as front-runner in AI ecosystem follows years of efforts to overcome technological limitations

Seoul, March 19, 2025

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.

The samples were delivered ahead of schedule based on SK hynix’s technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.

The 12-layer HBM4 provided as samples this time feature the industry’s best capacity and speed which are essential for AI memory products.

The product has implemented bandwidth¹ capable of processing more than 2TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5GB each) in a second, which is more than 60 percent faster than the previous generation, HBM3E.

¹Bandwidth: In HBM products, bandwidth refers to the total data capacity that one HBM package can process per second.

SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat dissipation.

Following its achievement as the industry’s first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024, SK hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner.

“We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands,” said Justin Kim, President & Head of AI Infra at SK hynix. “We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry’s largest HBM provider.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong, Minseok Jang, Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers first appeared on SK hynix Newsroom.

• Various memory products for AI data centers, on-device, automotive businesses on display

Seoul, March 19, 2025

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled “Memory, Powering AI and Tomorrow”.

The company will present HBM and other memory products for AI data centers and on-device¹ and memory solutions for automotive business essential for AI era.

¹On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device’s direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service

Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM², a new memory standard for AI servers.

²SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server

At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.

Following the industry’s first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.

“We are proud to present our line-up of industry-leading products at GTC 2025,” President & Head of AI Infra Juseon (Justin) Kim said. “With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider³ forward.”

³Full Stack AI Memory Provider: SK hynix’s vision to be a provider of a full-range of AI memory products and technologies

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong, Minseok Jang, Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix Showcases Industry-Leading Memory Technology at GTC 2025 first appeared on SK hynix Newsroom.