hynix Semiconductor Inc. (‘hynix’, www.hynix.com) and ProMOS Technologies Inc. (‘ProMOS’) today announced the signing of the Amendment to strengthen their existing strategic alliance.

According to the Amendment, hynix licenses to ProMOS 50 nanometer-class DRAM stack process technology, while ProMOS offers to hynix such DRAM products from its 300mm fab capacity. To achieve timely technology transfer, hynix plans to commence the government filing process immediately.

Additionally, hynix plans to cooperate with some financial investors to buy 8%-10% portion of shares in ProMOS through private placement to strengthen their long-term cooperation relationship.

About hynix Semiconductor Inc.

hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (“DRAMs”) and Flash memory chips to a wide range of established international customers. The Company’s shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about hynix is available at www.hynix.com.

Media Contact

CORPORATE COMMUNICATIONS
Assistant Manager
Seong-Ae Park
Phone: +82-2-3459-5325
Fax: +82-2-3459-5333
e-Mail: seongae.park@hynix.com

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hynix Semiconductor Inc. (www.hynix.com) and ProMOS Technologies Inc. today announced the signing of a memorandum of understanding (MOU) to initiate a long term strategic alliance in technology licensing, foundry service and development of new generation memory production processes.

The new alliance will represent nearly one quarter of the world DRAM output. According to the MOU, hynix licenses to ProMOS certain proprietary technology for DRAM stack process, while ProMOS offers to hynix its 300mm fab capacity. hynix and ProMOS also plan to collaborate in the development of next-generation process technologies.

The world’s third largest DRAM maker, hynix excels in the development, sales, marketing and distribution of high quality semiconductor products, including DRAM, SRAM, Flash Memory, and system IC devices, making it an industry leader, and valuable alliance partner. ProMOS, renowned for its manufacturing quality and high wafer output yield rate, plans on building a second 300mm fab in Taiwan, to be integrated into its existing 300mm and 200mm fabs. In addition to technology licensing and capacity sharing, hynix and ProMOS have left open the possibility of more mutually beneficial projects in the future.

“We are happy to join forces with ProMOS in sharing its premium technology capability and manufacturing competence,” said C.S. Oh, Senior Vice President and Memory COO of hynix Semiconductor, “This partnership will further enhance our DRAM manufacturing capacity, allowing us to quickly deliver high-quality products to the market.” “hynix has been one of the world’s first-rate providers of DRAM. Its success comes from outstanding production efficiency, sustainable R & D investment, and a highly dedicated management team with a clear focus on semiconductors,” said Min-liang Chen, President of ProMOS. “The alliance forged between hynix and ProMOS advances both parties into a new phase of viable long-term growth. We envision enormous benefits to both our clients and ourselves.”

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hynix Semiconductor Inc.(KSC:00660.KS) and Micron Technology, Inc.(NYSE:MU) announced today they will engage in discussions regarding a possible strategic alliance or other transaction. These discussions will be exploratory in nature.

Mr. Steve Appleton, Chairman and CEO of Micron and Mr. C.S. Park, Chairman and CEO of hynix said: “Both companies are evaluating a broad array of strategic options.” Mr. Park further commented, “ This effort represents a part of hynix’s ongoing evaluation of possible steps to maximize stakeholder value in the face of an unprecedented downturn in the semiconductor industry.”

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SEOUL, South Korea, May 15, 2001

hynix Semiconductor Inc. (formerly Hyundai Electronics Industries Co. Ltd.), an industry leader in high-quality semiconductors, today announced the system-on-a-chip (SOC) alliance of leading intellectual property (IP), library and design service partners to facilitate and accelerate SOC development by application specific integrated circuit (ASIC) and customer-owned tooling (COT) customers.

SOC alliance partners 3DSP, e-MDT, FTD, LEDA Systems, picoTurbo, VeraTest, and Wipro will offer hynix customers special input/output (I/O), mixed-signal, micro processor unit/micro controller unit (MPU/MCU), digital signal processing (DSP), bus interface, peripheral and consumer cores and design services. These offerings will complement the hynix portfolio that includes IP licensed from ARM, DSP Group, inSilicon, WDC, Artisan, and Mentor Graphics, as well as library cells, analog Ips, and embedded memory blocks developed in-house. hynix will assist customers in making all IP requirement decisions quickly and easily by providing IP lists classified by verification level (product proven, silicon proven) and by making partner introductions for additional resources and expertise. In addition, partners will have free fabrication access for IP verification, as well as opportunities to conduct joint promotional activities with hynix. Easy access to more silicon- and product-verified IPs will allow hynix customers to develop better SOC designs more quickly. Additional companies will be invited to join the alliance to better meet changing customer demands and industry trends. “With competitive pricing, hynix achieved 300 percent foundry revenue growth from 1999 to 2000,” said Channy Lee, executive director and general manager of Semiconductor Manufacturing Service Business Unit (SMS BU) responsible for foundry, ASIC and COT services. “We expect revenue growth to continue this year. The SOC Alliance program will serve as a catalyst to provide more business opportunities for our customers, partners and hynix. We look forward to building our partner relationships and increasing the total number of customer designs using this path to silicon.” About hynix Semiconductor Inc. hynix Semiconductor Inc., with its principal place of business in Ichon, Korea, is an industry leader in the development, sales, marketing and distribution of high-quality semiconductors including DRAM, SRAM, Flash memory and System IC products. It is the world’s largest DRAM supplier with twelve semiconductor manufacturing facilities worldwide. In addition, hynix is aggressively expanding its System IC business. hynix plans to derive 25% of it’s revenue from System IC products in 2003 by focusing on foundary services and standard products including LCD Display ICs, MCUs and Image Sensor ICs. More information on hynix Semiconductor Inc. and its products is available from the company’s web site at http://www.hynix.com.

About 3DSP

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry’s only fully configurable DSP architecture, backed by a robust environment and application-based intellectual property to speed complex system-on-a-chip (SoC) implementations to silicon with first time success. 3DSP’s capabilities are used by Internet, broadband, wireless and multimedia designers to implement next generation products. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Road, Irvine, CA 92618 (phone: (949)435-0600; fax: (949)435-0700). About e-MDT e-MDT specializes in the design of sub-micron, ASIC and ASSP integrated circuits along with intellectual property (IP) necessary to design the new innovative products for the emerging markets. While e-MDT typically provides the traditional, back-end design services, (Netlist into ASIC) we also provide full turn-key, front-end design services, (Architecture to ASIC). e-MDT’s strength lies in the experience of our engineering team and in the alliances we have formed with our foundry partners and tool suppliers. e-MDT with innovative ASIC designs coupled with the foundry services provided by our foundry partners is committed to delivering you the most cost-effective ASIC design solutions in the shortest period of time. More information on e-MDT is available at http://www.e-MDT.com.

About FTD

Operating from its headquarters in Singapore, Future Techno Designs Pte Ltd (FTD) is a leading design solution and IP provider in the Asia-Pacific region. The company provides design flow solutions (IC/PCB design and Software Modeling), customer support, design, training and consultancy services and IP licensing. FTD has representative offices in Malaysia and Philippines as well as an associate office in India with four other marketing offices. More information on FTD is available at http://www.ftdpl.com.sg.

About LEDA Systems

LEDA Systems, Inc. is a privately held company specializing in design, development, marketing and sales of analog intellectual property (IP) blocks, special I/Os and RF CMOS circuits. Company’s product is distributed directly to semiconductor manufacturers, ASIC and COT design houses, foundries and captive fabs, as well as other companies who use analog IP, special I/Os and RF IP. Strategic alliances formed with customers and partners enable LEDA Systems to develop and qualify products in a timely manner, gaining time-to-market and enhancing the offered product portfolio. More information on LEDA Systems is available at http://www.ledasystems.com.

About picoTurbo

picoTurbo is a leading CPU alternative for 16/32-bit RISC microprocessor cores in the mobile, wireless and embedded markets. With synthesizable high-performance cores and Turn-key IP solutions, picoTurbo offers design flexibility, lower development costs and maximum manufacturing freedom for semiconductor manufacturers, fabless companies, ASIC vendors and system OEMs. picoTurbo’s innovations reduce time-to-market and increase performance by enhancing microprocessor capabilities and enabling new applications, while leveraging industry standard legacy software. picoTurbo is based in Silicon Valley (U.S.), with a Taiwan design center and worldwide distributors. For more information, visit www.picoturbo.com or call (408) 586-8801. picoTurbo, picoTurbo logo and Turn-key IP are trademarks of picoTurbo, Inc. About VeraTest VeraTest, Inc. is a technology oriented company which is dedicated to Design-for-Test (DFT) technologies to electronics industries in order to improve the product quality of system IC and full-custom IC designs by developing a set of world-class DFT solutions, which can be further customized to user-specific design and test environment. Another important mission of VeraTest is to provide high quality consulting services in the area of structured design-for-test and test verification of system LSI designs. The engineering staffs in VeraTest have been exposed to wide variety of test design and verification area, which total over 30 years’ of combined test design experience. VeraTest guarantees the highest levels of engineering services and responsibilities for our customers with the Pride in Excellence. For more information on VeraTest, please visit our web site http://www.veratest.com or send us an email to info@veratest.com or call +82-2-522-9097 (Korea office), +82-2-522-9020 (fax).” About Wipro Wipro Technologies is a part of Wipro Limited (NYSE: WIT), and is a leading global provider of high end IT solutions. The IT solutions provided include application development services to corporate enterprises and hardware and software design services to technology companies. Our top clients include Lucent, NCR, Nortel, Transco, Thomas Cook and Compaq. Wipro Technologies was the first IT services provider in the world to be awarded the SEI-CMM Level 5 quality certification, a standard widely accepted in the software industry to measure the maturity and effectiveness of software processes. For further information, visit http://www.wipro.com.

### These materials are not an offer for sale of the Securities in the United States. The Securities may not be sold in the United States absent registration or an exemption from registration under the U.S. Securities Act of 1933, as amended. hynix Semiconductor Inc. does not intend to register any portion of the offering in the United States or to conduct a public offering of Securities in the United States.”

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Hyundai Electronics (CEO: Young-Whan Kim) announced on the 11th that it concluded a strategic alliance saying it would load ‘TeaPot’, the JAVA operational system by Aroma Soft (CEO: Hyun-Jin Lee) into the JAVA chip for the use of its home information electronics products to be launched in January 2000.

The JAVA chip which Hyundai developed and released last September for the first time is a core product in the field of non-memory and it is the first commercial ‘JAVA’ processor product with remarkable functions. It displays CPU function with keeping its two-dimensional graphic engine, NTSC-type encoder, and CRT controller functions. It can be also applied to various information and communication applied products such as internet, digital set top box, screen phone with 100 MHz CLUK speed.

Particularly, the ‘TeaPot’ operational system to be loaded into the ‘JAVA’ chip has been produced in such a way that it is possible to operate it basically with the minimum memory ROM 2 Mega bite and RAM 4 Mega bite so that it is suitable for the small and light home information electronics products and information communication appliances (ex: set top box, web phone, smart phone, and POS terminal). And since the system was developed by a domestic specialized venture capital with its own technology, it is highly evaluated that the company is able to secure competitiveness for the product with low cost.

Aroma Soft Co., LTD that has concluded the strategic alliance with Hyundai Electronics has developed the commercial JAVA operational system ‘TeaPot’ for the use of Embedded System in Korea and is such a promising venture capital that has been paid attention by the industry. In 1998, it was paid attention in the fall Comdex by loading ‘TeaPot’ into the early version of ‘JAVA’ chip.

Aroma Soft has also developed personal information terminal PDA (code name: Hazelnut) with a combined use of set top box that fully assists the JAVA environment for the first time, and is scheduled to release it in the fall Comdex November. Both Hyundai Electronics and Aroma Soft expect to secure the perfect solutions to JAVA technology in the field of Internet related information and home electronics and information communications through the strategic alliance for JAVA chip. Expected demand in the world market for the JAVA chip in the upcoming year is more than $1.7 billion worth in the field of information terminal equipment such as Internet set top box and screen phone. And prosperity in the field of non memory is anticipated hereafter.

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HEI(President: Kim Young Hwan) today announced that it has signed an agreement with NEC Corporation (NEC) and its subsidiary, NEC Electronics Inc., to jointly promote the widespread use of the Virtual Channel Memory (VCM) technology. VCM is a memory core technology designed to greatly improve the performance of personal computers, workstations and other systems. Under the accord, HEI and NEC will announce plans for joint development, production, and marketing of this high performance SDRAM memory standard. Work on exchanging technologies will begin this month. This development takes VCM another major step toward becoming the de facto memory core technology standard. Already accepted by the Joint Electron Device Engineering Council (JEDEC)* as a standard for memory designs, and supported by ARM, Siemens, ALi, SiS and VIA. HEI and NEC are very excited about the potential market for this advanced VCM technology DRAM. Current testing of HEI’s VCM engineering samples show that they can improve performance of systems by more than 30 percent over PC-100 memories now in use. Also, with the leading 3-4 chipset makers supporting VCM technology, the future of the VCM market looks positive. Such agreements are considered key to introducing devices based on new technologies to the marketplace and guaranteeing supply. Virtual Channel SDRAMs can quickly accelerate the rate at which they can send and receive data, and therefore, better accommodate increasing demands from multimedia applications, as well as increased performance of microprocessors. HEI is pursuing VCM technology in parallel with other emerging high-performance core memory technologies such as DDR SDRAMs and RambusR DRAMs. Just last month, HEI announced it’s entry into the RambusR DRAM marketplace further positioning itself as a global supplier of a full spectrum of advanced memory to the world market. The new VCM product improves the performance of systems by 20 – 30 percent by storing data temporarily in the chip for intensive data processing applications. In addition, it reduces power consumption by 30 percent through modern packaging and high-speed capabilities. The VCM memory SDRAM uses current controllers, so it is compatible with PC systems, PDAs, and color printers in use today. Moreover, these VCM SDRAMs can be manufactured on existing SDRAM fab lines, significantly reducing the overall capital equipment investment and process change requirements. A spokesperson from HEI commented, ” The strategic alliance for technical collaboration in the memory semiconductor field is meaningful in that the two firms are moving forward collectively to support a common market demand for high performance memory”. A spokesperson from NEC remarked, ” The meaning of this alliance is expected to contribute a great deal to both firms in the long-run by combining the strengths of both firms. In addition, this alliance will benefit the customers with higher performance, high quality, and cost competitive upper-end memory products”.

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