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The world’s largest tech companies have descended on the Las Vegas Convention Center to showcase their latest innovations at Consumers Electronics Show (CES) 2024. Dubbed “the world’s most powerful tech event”, CES 2024 opened its doors on January 9 and is welcoming more than 4,000 exhibitors and thousands of visitors through January 12.

Figure 1. SK Wonderland features various amusement park-themed attractions

Alongside six other SK Group affiliates, SK hynix is inviting guests to SK Wonderland, an amusement park-themed showroom where visitors can experience a net-zero world free from climate change. Within SK Wonderland stands SK hynix’s booth, which features industry-leading AI solutions and an innovative AI fortune teller.

Fueling the Generative AI Revolution With Next-Generation Memory Solutions

Figure 2. The AI fortune teller sits at the center of SK hynix’s booth

As AI continues to advance and permeate various aspects of our daily lives, demand is increasing for high-performance memory which can handle the growing requirements of these AI systems. In response, SK hynix developed groundbreaking memory solutions including the world’s best performing HBM3E, the fifth generation of High Bandwidth Memory¹ (HBM).

Figure 3. SK hynix’s leading HBM3E solution presented at CES 2024

At CES 2024, visitors to SK hynix’s booth can discover the vast potential and applications of HBM3E. Offering the industry’s highest data processing speed of 1.18 terabytes (TB) per second, HBM3E satisfies the AI market’s need to rapidly process vast amounts of data. Compared to its predecessor HBM3, HBM3E is 1.3 times faster and provides 1.4 times more data capacity. The product also offers a 10% improvement in heat dissipation by adopting cutting-edge Advanced MR-MUF² technology. SK hynix is set to mass produce HBM3E in the first half of 2024, allowing customers to soon realize the full potential of their AI systems.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
²Advanced Mass Reflow-Molded Underfill (MR-MUF): MR-MUF is a process in which semiconductor chips are stacked and a liquid protective material is injected into the space between the chips and then hardened to protect the chips and the surrounding circuitry. Advanced MR-MUF offers advantages in terms of controlling the thickness of wafers, evenly splicing chip bumps, and filling spaces between chips.

Figure 4. SK hynix’s groundbreaking AI memory technology on display

Alongside HBM3E, SK hynix also presented its Compute Express Link³ (CXL) interface, a test Computational Memory Solution⁴ (CMS) product, and its Accelerator-in-Memory based Accelerator⁵ (AiMX). In particular, CXL has been in the spotlight for its ability to enable memory expansion and improve the performance of AI applications, and is set to play a key role alongside HBM3E in the age of AI.

³Compute Express Link (CXL): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
⁴Computational Memory Solution (CMS): A product that integrates computational functions into CXL memory.
⁵Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card product that specializes in large language models using GDDR6-AiM chips.

Dealing the AI Tarot Cards of Destiny

Figure 5. Visitors find out their fortunes for 2024 at the AI fortune teller exhibit

The centerpiece of SK hynix’s booth is the AI fortune teller. Inspired by the animatronic fortune telling machines found in U.S. amusement parks, SK hynix’s fortune teller brought the concept into the AI era. The AI fortune teller scans a visitor’s face before printing out a cartomancy tarot card featuring their animated image. The interactive exhibition allows visitors to discover their new year’s fortunes and experience first-hand the potential of AI.

Sharing the Future of AI

Figure 6. SK hynix’s President and CEO Kwak Noh-Jung gives a presentation at the company’s CES 2024 press conference

In addition to showcasing its groundbreaking AI memory products, SK hynix also shared its thoughts on the future of AI. At a press conference held a day before CES 2024 kicked off, SK hynix’s President and CEO Kwak Noh-Jung gave a presentation on the company’s vision for the upcoming memory-centric AGI⁶ era.

Kwak opened by underlining how the performance and advancement of AI systems is largely reliant on the memory which supports them. As AI technology accelerates the transition to a data-centric age, memory solutions need to offer higher capacity, faster processing, and lower power consumption. SK hynix is responding to this move toward a memory-centric market by continuing to develop world-best products which will cement its industry leadership. These solutions include the upcoming HBM4 and HBM4E which will offer increased bandwidth, as well as LPCAMM⁷, CXL, and PIM⁸ and CIM⁹ products.

⁶Artificial General Intelligence (AGI): A theoretical form of AI research that aims to create software with human-like intelligence and the ability to self-teach.
⁷Low Power Compression Attached Memory Module (LPCAMM): A compact memory module standard used in laptops, PCs, and data centers which offers improvements in performance and power efficiency.
⁸Processing-In-Memory (PIM): A next-generation technology that adds computational capabilities to semiconductor memories to solve the problem of data movement congestion in AI and big data processing.
⁹Computing-in-Memory (CIM): A memory management solution that aims to improve speed and efficiency by performing computations directly in the memory.

Rounding off his presentation, Kwak announced that the company is developing a new custom memory platform which will harness its AI memory technology and research capabilities to create optimized solutions tailored for each customer’s strengths.

A Trailblazer During the Rise of AI

At CES 2024, SK hynix has cemented its position as the world’s leading AI memory provider. SK hynix’s booth gives visitors a glimpse into the significant possibilities of its industry-leading solutions, and the company will continue to demonstrate how its products can build a brighter future for all over the coming year.

The post SK hynix Envisions an AI-Powered World at CES 2024 first appeared on SK hynix Newsroom.

• SK hynix to highlight role of memory chips in AI era
• Ultra-high performance of HBM3E, interactive AI fortuneteller to be displayed
• Company to solidify AI memory leadership, seek acceleration of business turnaround

Seoul, January 3, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will showcase the technology for ultra-high performance memory products, the core of future AI infrastructure, at CES 2024, the most influential tech event in the world taking place from January 9 through 12 in Las Vegas.

SK hynix said that it will highlight its future vision represented by its Memory Centric¹ at the show and promote the importance of memory products accelerating the technological innovation in the AI era and its competitiveness in the global memory markets.

¹Memory Centric: An SK hynix vision where memory products play a pivotal role in ICT devices

The company will run a space titled SK Wonderland jointly with other major SK Group affiliates including SK Inc., SK Innovation and SK Telecom, and showcase its major AI memory products including HBM3E.

SK hynix plans to provide HBM3E, the world’s best-performing memory product that it successfully developed in August, to the world’s largest AI technology companies by starting mass production from the first half of 2024.

At SK Group’s space with an amusement-park theme, SK hynix will display an AI Fortuneteller where the generative AI technology based on HBM3E is applied. The AI fortuneteller is expected to give visitors fresh fun by creating an image of their cartoon characters based on their own faces and reading New Year fortunes.

SK hynix’s leading AI technology will also be displayed at the SK ICT Family Demo Room jointly run by other SK ICT companies. The company will showcase Compute Express Link (CXL²), next-generation interface, a test product of Computational Memory Solution (CMS), memory solution that integrates the computational functions of CXL, and Accelerator-in-Memory based Accelerator (AiMX³), a processing-in-memory chip-based accelerator card with low-cost and high-efficiency for generative AI.

²CXL (Compute Express Link): a PCIe-based next-generation interconnect protocol, on which high-performance computing systems are based
³AiMX (Accelerator-in-Memory based Accelerator): SK hynix’s accelerator card product that specializes in large language models using GDDR6-AiM chips

Particularly, CXL memory, along with HBM, is one of the core products in the limelight with the rise of AI technology. SK hynix plans to commercialize 96GB and 128GB CXL 2.0 memory solutions based on DDR5 in the second half for shipments to AI customers.

“We are thrilled to showcase our technology, which has risen to the core of the AI infrastructure in the U.S., home to AI technology,” said Justin Kim, President (Head of AI Infra) at SK hynix. “SK hynix will step up its efforts for collaboration with global players, while seeking to accelerate a turnaround in business with its leadership in the AI memory space.”

Disclaimer

These materials are not an offer for sale of the securities of SK hynix Inc. in the United States. The securities may not be offered or sold in the United States absent registration with the U.S. Securities and Exchange Commission or an exemption from registration under the U.S. Securities Act of 1933, as amended. SK hynix Inc. does not intend to register any offering in the United States or to conduct a public offering of securities in the United States.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

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