SK hynix’s booth at DTW 2024

SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024 in the heart of Las Vegas from May 20–23. Hosted annually by Dell Technologies, DTW welcomes some of the world’s biggest tech companies to highlight their latest developments, strategies, and visions. In line with DTW 2024’s theme “Accelerate AI Adoption to Unlock Innovation,” SK hynix is showcasing its advanced AI memory and demonstrating these solutions with Dell Technologies’ systems—underlining its strong partnership with the host.

SK hynix showcasing its next-generation AI memory solutions at the event

AI Solutions Set to Lead the Future Memory Ecosystem

Having participated in DTW since 2019, SK hynix has returned to emphasize the power of its high-performance AI memory products including its SSD, HBM¹, and CXL^®2 solutions.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.

SK hynix’s cSSDs which show good compatibility with Dell PCs

The company is displaying its leading enterprise SSD (eSSD) solutions with Dell Technologies’ systems. These include the PCle³ Gen5-based PS1010 and PEB110, which showed positive results with Dell PowerEdge servers. SK hynix is also presenting its latest power-efficient and rapid server DRAM solutions, MCR DIMM⁴ and RDIMM⁵, which are suited for AI computing in high-performance servers.

Regarding client SSD (cSSD) products, PCB01⁶ boasted strong performance with Dell Alienware gaming PCs. Compared to the previous generations of cSSDs that includes PC801 and PC711, PCB01 offers significant enhancements in speed, quality, and power efficiency.

³Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.
⁴Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁵Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁶PCB01: A PCIe fifth-generation SSD that doubles the speed specifications of its previous generation, enabling the loading of large language models required for AI learning and inference in less than one second.

SK hynix’s latest memory products including LPCAMM2 and HBM3E on display

In addition to demonstrations, SK hynix is displaying some of its other next-generation AI memory products. These include LPCAMM2⁷, a solution optimized for on-device AI which offers performance levels equivalent to two DDR5⁸ SODIMMs⁹. The company’s industry-leading HBM3E, which provides exceptional processing speed, capacity, and heat dissipation, is also being presented alongside its corresponding device—H100 GPU.

⁷Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁸Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁹Small Outline Dual Inline Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s CXL^® product CMM-DDR5 can expand system bandwidth and capacity

As another key technology for the AI era, CXL^® is highlighted through a demonstration of the company’s CXL^® Memory Module-DDR5 (CMM-DDR5) with Intel’s server. CMM-DDR5 has attracted attention for its ability to expand system bandwidth and capacity compared to systems only equipped with DDR5 DRAM.

“Dell Technologies is a strong supporter of the CXL^® ecosystem and an advocate of driving CXL^®-based memory standards throughout the industry,” said a Dell Technologies official. “We believe that CXL^®-based memory will prove to be valuable for systems providers and customers, and we are therefore excited to see the product demonstrations of SK hynix’s CMM-DDR5.”

Additionally, the synergy between SK hynix and its U.S. subsidiary Solidigm is highlighted as Solidigm’s SSD is also on display at the booth, which is operated by both companies.

Eung-bo Shim presenting about the impact of CXL^® memory solutions on the memory ecosystem

On the first day of the conference, Technical Leader Eung-bo Shim of the Next-Gen Memory & Storage team gave a talk on how CXL^® memory solutions will pave the way to the future memory ecosystem infrastructure. Such presentation sessions are expected to further the dialogue between SK hynix, its partners, and fellow industry players as the company aims to realize a memory-centric world in the AI era.

Advancing the Partnership With Dell Technologies in the AI Era

As leaders in their respective fields, SK hynix and Dell Technologies have formed a strong partnership that promises more advanced innovations in the future. Both companies are strengthening their efforts in the AI era, building anticipation for further collaborations that will realize faster AI adoption. Looking ahead, SK hynix remains committed to strengthening partnerships that will solidify its AI memory leadership.

The post DTW 2024: SK hynix & Dell Technologies Present the Future of AI Memory first appeared on SK hynix Newsroom.

SK hynix participated in Dell Technologies World (DTW) 2023 in Las Vegas, USA for four days between May 22-25 to showcase its latest memory technologies and products.

SK hynix’s booth at DTW 2023

DTW is the largest annual event hosted by Dell Technologies that brings together various global IT companies to unveil their latest developments that will drive future technology trends. This year’s slogan from SK hynix “Don’t bet on luck, bet on our Tech!” evokes the spirit of the host city Las Vegas and emphasizes the message that the company will continue creating and exploring diverse technologies for the new era of big data.

SK hynix, which has participated in the event since 2019, presented a variety of its latest technologies and products. First, the company unveiled PS1010, a PCIe¹ Gen5-based eSSD that will be applied to Dell Technologies’ server products. The company also demonstrated the performance of its new cSSD, PC801, in a Dell desktop to showcase the company’s evolving technology.

¹ Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.

SK hynix showcasing its CXL memory and HBM3

In addition, SK hynix displayed its CXL² memory through a demonstration on a real server and held a joint exhibition of its HBM3³ and NVIDIA’s H100 GPU. Used for AI chatbots, NVIDIA’s H100 GPU has adopted HBM3 to realize next-generation performance levels.

² Compute Express Link (CXL): A PCIe-based, next-generation interconnect protocol to effectively establish high-performance computing systems.

³ High Bandwidth Memory (HBM): A high-value, high-performance memory solution that vertically interconnects multiple DRAM chips with TSV to dramatically increase the data processing speed in comparison to traditional DRAM products. HBM3 is the fourth-generation product, succeeding the previous generations HBM, HBM2 and HBM2E.

Throughout the event, SK hynix provided visitors with a look at its diverse portfolio of solutions including several DRAM product lines such as its DDR5 modules for servers and PCs, LPDDR5X for mobile devices, and GDDR6 graphics memory. Other products included eSSDs with various form factors like E1.S, U.2, M.2 22110, and M.2 2280. New cSSDs such as PC801 and BC901 were on display as well, while Consumer SSDs such as P31 and P41 were also featured in the booth. Additionally, SK hynix presented PCIe Gen4 NVMe⁴-based enterprise and cSSDs from its subsidiary company, Solidigm.

⁴ Non-Volatile Memory Express (NVMe): As a communication protocol for storage devices based on the PCIe interface, NVMe can achieve speeds of up to six times or more compared to the existing SATA interface—making it suitable for ultra-high speed, large data processing tasks.

Eung-bo Shim, a technical leader in charge of next-generation memory development, presenting the concept and strengths of CXL memory

SK hynix went on to hold a breakout session that introduced the role and future of its CXL memory technology. “CXL memory is a solution that increases the bandwidth compared to existing DRAM products to improve performance. This technology enables the capacity to be expanded more easily than ever before and will soon become commercially available,” said Eung-bo Shim,  a technical leader responsible for next-generation memory development at SK hynix. “As a product that has strengths in reliability, security and maintenance, it will be used in various servers in the future.”

By attending global events like DTW down the road, SK hynix plans to continue strengthening its partnerships with key customers and introducing its new products on the world stage.

The post SK hynix Showcases Its Next-Generation Technologies at Dell Technologies World 2023 first appeared on SK hynix Newsroom.

The companies’ joint sponsorship of Dell Technologies World underscored their partnership and resolve to pool their capabilities to address customers’ most pressing storage needs and strengthen synergies in the global memory solutions market. This is Solidigm’s first conference appearance. Having launched as a new company at the end of 2021, Solidigm’s name reflects its intent to be a new paradigm in solid-state storage, delivering customer-inspired solutions.

Image 1. Shared booth of SK hynix and Solidigm at Dell Technologies World 2022

At the shared booth (#408), SK hynix highlighted its data center solutions and green technology, displaying an array of HBM3, GDDR, DDR5-based DIMM, PCIe Gen4 NVMe client SSD, and PCIe Gen5 NVMe enterprise SSD.

Image 2. SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022

The booth also showcased SK hynix’s corporate ESG activities and eco-friendly memory lines to enable stronger performance with less power, reflecting a commitment to sustainable business and environmentally responsible products.

Image 3. Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022

Nearby, Solidigm promoted its industry-leading QLC portfolio, spanning client and data center. “Solidigm was honored to share a booth with SK hynix at Dell Technologies World and to showcase our industry-leading products together,” said Paul Obsitnik, Solidigm’s Chief Marketing and Communications Officer. “The joint team educated attendees about our partnership and the strength of our combined portfolio. We heard a lot of enthusiasm for what we will create together going forward.”

Image 4. Jin Lim, Vice President at SK hynix presenting at Dell Technologies World 2022

The companies also took the stage together during breakout sessions. SK hynix presented its Solidigm partnership strategy and ESG journey, and Solidigm explained its vision and technological readiness for meeting the diverse requirements of SSDs tailored to specific workloads.

“It has been a satisfying experience for us to closely collaborate with Solidigm as one team to prepare the joint participation at Dell Technologies World 2022 for the past months,” said SK hynix manager who organized the exhibition of the shared booth. “We are excited and expect to deliver more to our audience in the future, together.”

Together, SK hynix and Solidigm will continue to maximize synergies and forge ahead as leaders of a new memory and storage paradigm.

The post SK hynix and Solidigm Make First Joint Appearance at Dell Technologies World 2022 first appeared on SK hynix Newsroom.