• SK hynix to showcase technological capabilities, participating in the world’s largest consumer electronics show, CES 2025, from January 7-10
• Featuring a wide range of products driving the AI era, from HBM, the core of AI infrastructure, to next-gen memories like PIM
• Company to present new possibilities in the AI era through technological innovation and provide irreplaceable value

Seoul, January 3, 2025

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).

A large number of C-level executives, including CEO Kwak Noh-Jung, CMO (Chief Marketing Officer) Justin Kim and Chief Development Officer (CDO) Ahn Hyun, will attend the event. “We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES,” said Justin Kim. “Through this, we will publicize our technological competitiveness to prepare for the future as a ‘Full Stack AI Memory Provider¹’.”

¹Full Stack AI Memory Provider: Refers to an all-round AI memory provider, which provides comprehensive AI-related memory products and technologies

SK hynix will also run a joint exhibition booth with SK Telecom, SKC and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” The booth will showcase how SK Group’s AI infrastructure and services are transforming the world, represented in waves of light.

SK hynix, which is the world’s first to produce 12-layer HBM products for 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry’s highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance.

In addition, the company will display high-capacity, high-performance enterprise SSD products, including the ‘D5-P5336’ 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power and space efficiency, has been attracting considerable interest from AI data center customers.

“As SK hynix succeeded in developing QLC²(Quadruple Level Cell)-based 61TB products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market” said Ahn Hyun, CDO at SK hynix. The company will also showcase on-device AI products such as ‘LPCAMM2³’ and ‘ZUFS 4.0⁴,’ which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX⁵, designed to be core infrastructures for next-generation data centers.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.
³Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.
⁴Zoned Universal Flash Storage (ZUFS): A NAND Flash product that improves efficiency of data management. The product optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS, a flash memory product for various electronic devices such as digital camera and mobile phone.
⁵Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card product that specializes in large language models using GDDR6-AiM chips

In particular, CMM-Ax is a groundbreaking product that adds computational functionality to CXL’s advantage of expanding high-capacity memory, contributing to improving performance and energy efficiency of the next-generation server platforms⁶.

⁶Platform: Refers to a computing system that integrates both hardware and software technologies. It includes all key components necessary for computing, such as the CPU and memory.

“The changes in the world triggered by AI are expected to accelerate further this year, and SK hynix will produce 6^th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers,” said Kwak Noh-Jung, CEO at SK hynix. “We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”), and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix to Unveil ‘Full Stack AI Memory Provider’ Vision at CES 2025 first appeared on SK hynix Newsroom.

When streaming movies, users can feel as if they are the only one using the service even when logging in at peak hours. This is made possible in part by virtualization¹ technology, which plays a key role in enabling the stable performance of cloud-based services such as streaming platforms.

¹Virtualization: A technology which uses software to divide a single physical machine’s hardware resources such as servers and networks between multiple virtual machines. Each virtual machine runs its own operating system, enabling it to operate like an independent system despite sharing the hardware of a single machine.

In recent years, however, companies which offer such services have faced challenges in ensuring consistent quality due to the growing demands on cloud systems. Moreover, the advent of the AI era has only increased the complexity of the cloud environment. Amid these changes, attention has turned to advancing virtualization technology and applying it to not only server systems but also enterprise SSDs² (eSSDs) to better serve customer needs. SK hynix has been leading the charge in this respect, implementing its outstanding virtualization technology to its eSSD lineup.

²Enterprise SSDs (eSSDs): High-performance storage drives designed specifically for enterprise applications, such as data centers and cloud storage.

This episode of Rulebreakers’ Revolutions will focus on how, despite being a latecomer to the SSD market, SK hynix rose above the competition to apply virtualization technology at the eSSD level.

The Mission: Optimizing eSSD Performance in the Data Explosion Era

Over the last decade, the applications of cloud services have greatly expanded to various areas from file storage to banking and defense. The proliferation of online services and the recent AI boom has further driven the growth of the cloud environment. This has sparked a data explosion as more users access various cloud resources, significantly increasing the likelihood of bottlenecks in data centers. As a result, there is a growing need for improved system-wide performance, including optimizing and broadening the use of virtualization technology.

Originating at the end of 1960s, virtualization technology has played a key role in the evolution of data centers which utilize cloud computing. By enabling multi-tenancy³ systems to run on a single physical machine, virtualization leads to more efficient use of hardware resources compared to systems operating single-tenancy⁴ environments.

³Multi-tenancy: A software architecture where a single instance of an application or software serves multiple users, but each tenant’s data remains independent.
⁴Single-tenancy: A software architecture where a single instance of an application or software serves an individual user.

Through virtualization, computing resources can be used more efficiently in a multi-tenancy environment

While virtualization technology was previously applied primarily to host systems such as servers, eSSDs must now also support virtualization to store and retrieve data for multiple virtual machines. In addition, eSSDs need to deliver high levels of performance, security, and quality of service (QoS)⁵ as more tasks are offloaded from the host system. In response to this demand, SK hynix looked to optimize its lineup of eSSDs with the highest level of virtualization technology. However, the company faced obstacles as a latecomer to the SSD market and lacked a test environment that supported input/output (I/O) virtualization⁶.

⁵Quality of service (QoS): For an SSD, QoS refers to the consistency and predictability of the latency and input/output (I/O) performance while servicing a read/write workload.
⁶Input/output (I/O) virtualization: A technology that allows multiple virtual machines to efficiently share I/O devices, such as SSDs, by managing data flow between the virtual environment and physical hardware.

Tasked with improving the performance of eSSDs with limited experience in the field, SK hynix tapped into its broader SSD expertise to develop products with groundbreaking virtualization technology.

Flexibly Applying Virtualization Tech to eSSDs With cSSD Knowhow

To develop eSSD products which support best-in-class virtualization, SK hynix changed its traditional approach to SSD development. While the eSSD and client SSD⁷ (cSSD) teams had previously only worked separately, they closely collaborated on the eSSD development. For the cSSD team, its strengths lie in achieving power efficiency, while the eSSD team has expertise in performance stabilization and optimization. Through their joint efforts based on a common architecture, the teams were able to harness their respective expertise and secure top-tier technological capabilities.

⁷Client SSDs (cSSDs): Storage device designed for consumer devices such as PCs, tablets, and laptops.

SK hynix developed eSSDs with leading virtualization technology to help tackle bottlenecks in data centers

These technological developments include securing leading I/O virtualization and enhancing the PCIe⁸ multi-physical function, which helps to reduce the overhead of the hypervisor⁹. The addition of the ATS¹⁰ feature was also key as it improves performance by offloading address translation—the primary cause of bottlenecks in the hypervisor—and alleviating bottlenecks across the entire system. Moreover, the application of low-power characteristics already established in cSSDs, such as improved throttling¹¹ performance, crucially improved power efficiency.

⁸Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.
⁹Hypervisor: Also known as a virtual machine monitor (VMM), a hypervisor allocates the physical computing resources such as the CPU and memory to individual virtual machines as required, supporting the optimal use of hardware.
¹⁰Address Translation Service (ATS): A mechanism often used in hardware-based virtualization which allows PCIe storage devices to request memory address translations from the Input/Output Memory Management Unit (IOMMU). ATS enhances performance by enabling devices to cache translations, reducing the latency associated with memory access.
¹¹Throttling: A deliberate reduction in the performance of an SSD when it reaches certain temperature thresholds, typically to prevent overheating and damage to the drive.

As well as the eSSD and cSSD teams, other teams also worked together on this project to address issues. Although SK hynix lacked a test environment that supported I/O virtualization, the company was able to overcome this problem by establishing a taskforce involving the design, verification, and firmware teams. This taskforce brought together the necessary resources and expertise of the respective teams, enabling them to soon establish a suitable test environment.

Coupled with this pooling of resources, SK hynix was also quick to adapt to any changes in the development process. The company focused on flexible architecture design which can quickly reflect the development direction and customer needs by expanding customer communication channels in collaboration with its U.S. subsidiary, Solidigm. This close contact also enabled SK hynix to provide tailored solutions for each customer.

Through this collaborative, flexible and customized approach, SK hynix was able to develop leading I/O virtualization technology for eSSDs which supports a stable multi-tenancy environment. This means that, when streaming a film for example, one’s experience is not impacted when another user downloads a movie.

Supporting Virtualization & Multi-Tenancy: SK hynix’s eSSD Lineup for Today’s Data Centers

As a result of its differentiated approach, SK hynix developed flagship eSSDs such as the PE9010 and PEB110 equipped with I/O virtualization technology. These products not only meet the performance, security, and QoS demands required by data center companies and cloud service providers, but also contribute to reducing data center cooling costs due to their low-power characteristics.

The company’s high-performance eSSD lineup meets power, security, and QoS demands from data centers

Having already been commercialized, the eSSDs are currently adopted by global technology companies operating on cloud platforms. These customers which leverage SK hynix’s virtualization technology can offer independent services with consistent performance, an essential aspect of multi-tenancy systems. Notably, by offloading part of the virtualization overhead to devices, these customers can deliver high-quality services without the need for additional system expansion.

Beyond simply supplying products, SK hynix actively communicates with customers to provide solutions that go beyond SSD-only options to address their entire system. Moreover, the company makes it a priority to effectively respond to various cases at the highest level. Consequently, customers now recognize SK hynix as a trusted partner despite the fact it was a latecomer in the SSD market. The company will continue to engage in ongoing communication with its customers and secure firmware flexibility to address customer needs even after product development.

Rulebreaker Interview: Gijo Jeong, SSD Design

To find out more about the company’s rulebreaking mentality for virtualization, the SK hynix Newsroom spoke with Gijo Jeong of SSD Design. Jeong, who leads the team in designing controllers¹², discussed the challenges the team faced when working on the eSSDs and the company’s unique approach to development.

¹²Controller: An SSD controller is the central processor of an SSD. It manages all operations, including reading and writing data, handling error correction, managing flash memory, and optimizing performance.

<Other articles from this series>

[Rulebreakers’ Revolutions] How MR-MUF’s Heat Control Breakthrough Elevated HBM to New Heights

[Rulebreakers’ Revolutions] How SK hynix Broke Barriers in Mobile DRAM Scaling With World-First HKMG Application

[Rulebreakers’ Revolutions] Innovative Design Scheme Helps HBM3E Reach New Heights

[Rulebreakers’ Revolutions] How SK hynix’s Server DRAM Validation Process Succeeds in a Diverse Server CPU Market

[Rulebreakers’ Revolutions] How SK hynix’s Design Innovations Pushed GDDR7 to New Limits of Speed

The post [Rulebreakers’ Revolutions] Flexible & Collaborative eSSD Virtualization Development for Today’s Data Centers first appeared on SK hynix Newsroom.

SK hynix’s booth at SC24

Returning for its second year, SK hynix is underlining its AI memory leadership through a display of innovative memory products and insightful presentations on AI and HPC technologies. In line with the conference’s “HPC Creates” theme which underscores the impact of supercomputing across various industries, the company is showing how its memory solutions drive progress in diverse fields.

Showcasing Advanced Memory Solutions for AI & HPC

At the booth, SK hynix is demonstrating and displaying a range of groundbreaking products tailored for AI and HPC. The products being demonstrated include its CMM (CXL^®1 Memory Module)-DDR5²,  AiMX³ accelerator card, and Niagara 2.0 among others.

¹Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
²CXL Memory Module-DDR5 (CMM-DDR5): A next-generation DDR5 memory module utilizing CXL technology to boost bandwidth and performance for AI, cloud, and high-performance computing.
³Accelerator-in-Memory Based Accelerator (AiMX): SK hynix’s specialized accelerator card tailored for large language model processing using GDDR6-AiM chips.

Live demonstrations of CMM-DDR5 and AiMX at the booth

The live demonstration of CMM-DDR5 with a server platform featuring Intel^® Xeon^® 6 processors shows how CXL^® memory technology accelerates AI workloads under various usage models. Moreover, visitors to the booth can learn about the latest CMM-DDR5 product with EDSFF⁴ which offers improvements in TCO⁵ and performance. Another live demonstration features AiMX integrated in an ASRock Rack Server to run Meta’s Llama 3 70B, a large language model (LLM) with 70 billion parameters. This demonstration highlights AiMX’s efficiency in processing large datasets while achieving high performance and low power consumption, addressing the computational load challenges posed by attention layers⁶ in LLMs.

⁴Enterprise and Data Center Standard Form Factor (EDSFF): A collection of SSD form factors specifically used for data center servers.
⁵Total cost of ownership (TCO): The complete cost of acquiring, operating, and maintaining an asset, including purchase, energy, and maintenance expenses.
⁶Attention layer: A mechanism that enables a model to assess the relevance of input data, prioritizing more important information for processing.

SK hynix’s Niagara 2.0, customized HBM, OCS, and SSD products

Among the other technologies being demonstrated is Niagara 2.0. The CXL pooled memory solution enables data sharing to minimize GPU memory shortages during AI inference⁷, making it ideal for LLM models. The company is also demonstrating an HBM with near-memory processing (NMP)⁸ which accelerates indirect memory access⁹, a frequent occurrence in HPC. Developed with Los Alamos National Laboratory (LANL), the solution highlights the potential of NMP-enabled HBM to advance next-generation technologies.

Another demonstration is showcasing SK hynix’s updated OCS¹⁰ solution, which offers significant improvements in analytical performance for real-world HPC workloads compared to the iteration displayed at SC23. Co-developed with LANL, OCS addresses performance issues in traditional HPC systems by enabling storage to independently analyze data, reducing unnecessary data movement and improving resource efficiency. Additionally, the company is demonstrating a checkpoint offloading SSD¹¹ prototype that improves LLM training resource utilization by enhancing performance and scalability.

⁷AI inference: The process of using a trained AI model to analyze live data for predictions or task completions.
⁸Near-memory processing (NMP): A technique that performs computations near data storage, reducing latency and boosting performance in high-bandwidth tasks like AI and HPC.
⁹Indirect memory access: A computing addressing method in which an instruction providing the address of a memory location that contains the actual address of the desired data or instruction.
¹⁰Object-based computational storage (OCS): A storage architecture that integrates computation within the storage system, enabling local data processing and minimizing movement to enhance analytical efficiency.
¹¹Checkpoint offloading SSD: A storage solution that stores intermediate data during AI training, improving efficiency and reducing training time.

SK hynix presented various data center solutions, including HBM3E, DDR5, and eSSD products

In addition to running product demonstrations, SK hynix is also displaying a robust lineup of data center solutions, including its industry-leading HBM3E¹². The fifth-generation HBM provides high-speed data processing, optimal heat dissipation, and high capacity, making it essential for AI applications. Alongside HBM3E are the company’s rapid DDR5 RDIMM and MCR DIMM products, which are tailored for AI computing in high-performance servers. Enterprise SSDs (eSSDs) including the Gen 5 PS1010 and PEB110 are also on display. Offering ultra-fast read/write speeds, these SSD solutions are vital for accelerating AI training and inference in large-scale environments.

¹²HBM3E: The fifth-generation High Bandwidth Memory (HBM), a high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).

Highlighting the Potential of Memory Through Expert Presentations

During the conference, Jongryool Kim, research director of AI System Infra, presented on “Memory & Storage: The Power of HPC/AI,” highlighting the memory needs for HPC and AI systems. He focused on two key advancements including near-data processing technology using CXL, HBM, and SSDs to improve performance, and CXL pooled memory for better data sharing across systems.

(From first image) Research Director Jongryool Kim presenting on advancements in memory and storage for HPC and AI systems; Technical Leader Jeoungahn Park delivering a presentation on OCS

Technical Leader Jeoungahn Park of the Sustainable Computing team also took to the stage for his talk on “Leveraging Open Standardized OCS to Boost HPC Data Analytics.” Park explained how OCS enables storage to automatically recognize and analyze data, thereby accelerating data analysis in HPC. He added how OCS enhances resource efficiency and integrates seamlessly with existing analytics systems, as well as how its analysis performance has been verified in real-world HPC applications.

At SC24, SK hynix is solidifying its status as a pioneer in memory solutions which are driving innovations in AI and HPC technologies. Looking ahead, the company will continue to push technological boundaries with support from its partners to shape the future of AI and HPC.

The post SK hynix Presents Innovative AI & HPC Solutions at SC24 first appeared on SK hynix Newsroom.

SK hynix’s booth at HPE Discover 2024

SK hynix has returned to Las Vegas to showcase its leading AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise’s (HPE) annual technology conference. Held from June 17–20, HPE Discover 2024 features a packed schedule with more than 150 live demonstrations, as well as technical sessions, exhibitions, and more. This year, attendees can also benefit from three new curated programs on edge computing and networking, hybrid cloud technology, and AI.

Under the slogan “Memory, The Power of AI,” SK hynix is displaying its latest memory solutions at the event including those supplied to HPE. The company is also taking advantage of the numerous networking opportunities to strengthen its relationship with the host company and its other partners.

The World’s Leading Memory Solutions Driving AI

SK hynix’s booth at HPE Discover 2024 consists of three product sections and a demonstration zone which showcase the unprecedented capabilities of its AI memory solutions.

SK hynix’s AI memory solutions on display including its HBM3E and CMM-DDR5

The first section features the company’s groundbreaking memory solutions for AI, including HBM¹ solutions. In particular, the industry-leading HBM3E has emerged as a core product to meet the growing demands of AI systems due to its exceptional processing speed, capacity, and heat dissipation. A key solution from the company’s CXL^®2 lineup, CXL Memory Module-DDR5³ (CMM-DDR5), is also on display in this section. In the AI era where high performance and capacity are vital, CMM-DDR5 has gained attention for its ability to expand system bandwidth by up to 50% and capacity by up to 100% compared to systems only equipped with DDR5 DRAM.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
³Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.

SK hynix’s server DRAM products are optimized for AI computing

In the second section of the booth, SK hynix is presenting its leading server DRAM solutions. The company’s power-efficient and rapid DDR5 RDIMM⁴ and MCR DIMM⁵ are featured, showcasing their ability to support AI computing in high-performance servers. Equipped with 1bnm, the fifth generation of the 10 nm process technology, DDR5 RDIMM can reach speeds of up to 6,400 megabits per second (Mbps), while MCR DIMM boasts speeds of up to 8,800 Mbps. Additionally, SK hynix is displaying its LPCAMM2⁶, a module solution that is increasingly being applied in AI PCs due to its low-power and high-performance features.

⁴Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁵Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁶Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.

SK hynix presents its SSD portfolio including products supplied to HPE

Visitors could also see some of SK hynix’s latest enterprise SSDs (eSSD) in the third section of the booth. These include the PCle Gen5-based PS1010 and PS1030, which are recognized to be ideal for AI, big data, and machine learning applications due to their rapid sequential read speeds. Within the same section, SK hynix’s U.S. subsidiary Solidigm is presenting its QLC⁷-based eSSDs such as D5-P5430, D5-P5316, and D5-P5336. Offering industry-leading performance and massive capacity, these products will serve as optimal solutions for various customers that require immense storage space.

⁷Quadruple Level Cell (QLC): A form of NAND flash memory that can store up to 4 bits of data per memory cell.

Sharing the Latest Innovations and Trends in AI Memory

SK hynix hosted sessions on how its memory solutions are fueling innovation in AI

During the presentation sessions at the conference, SK hynix held talks that focused on how the company’s memory products are fueling innovation in AI. On June 18, Technical Leader Brian Yoon of DRAM Technology Planning at SK hynix America provided an overview of CXL and discussed enabling memory expansion with CMM-DDR5. Yoon also touched on the features of HMSDK⁸, a software that supports CMM-DDR5. Hours later, Director Santosh Kumar of NAND Technology Planning at SK hynix America and Technical Leader Seonjae Kim of SSD Enablement at SK hynix covered SSD technology trends and how SK hynix and Solidigm can meet future SSD demands. During the talk, the pair shared how the companies’ SSD products are optimized for AI storage and modern data center workloads.

⁸Heterogeneous Memory Software Development Kit (HMSDK): A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.

Embracing the Memory Community to Power the Future of AI

At HPE Discover 2024, SK hynix has underlined how it is spearheading innovations in the AI memory sector. The event is not only a chance for the company to showcase its industry-leading solutions, but also a time to strengthen its partnership with HPE and other industry players.

“SK hynix is maintaining a close partnership with HPE based on its industry-leading memory technology, including securing contracts to supply high-capacity DDR5 and 16-channel Gen5 eSSD products,” said Vice President Myoungsoo Park, head of US/EU Sales at SK hynix. “We will continue to strengthen our cooperation with global partners to further solidify our technological leadership as the world’s number one AI memory provider.”

The post SK hynix Showcases Power of Its Groundbreaking AI Memory Solutions at HPE Discover 2024 first appeared on SK hynix Newsroom.

Figure 1 . SK hynix’s exhibition booth at SC23

Displaying Advanced HPC & AI Products

At SC23, SK hynix showcased its products tailored for AI and HPC to underline its leadership in the AI memory field. Among these next-generation products, HBM3E attracted attention as the HBM¹ solution meets the industry’s highest standards of speed, capacity, heat dissipation, and power efficiency. These capabilities make it particularly suitable for data-intensive AI server systems. HBM3E was presented alongside NVIDIA’s H100, a high-performance GPU for AI that uses HBM3 for its memory.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Figure 2. HBM3E, an HBM solution applicable to data-intensive AI server systems

SK hynix also held a demonstration of AiMX², the company’s generative AI accelerator³ card which specializes in large language models (LLM) using GDDR6-AiM chips that leverage PIM⁴ technology. This product is set to play a key role in the advancement of data-intensive generative AI inference systems as it significantly reduces the AI inference time of server systems compared to systems with GPUs, while also offering lower power consumption.

²Accelerator-in-Memory Based Accelerator (AiMX): SK hynix’s accelerator card product that specializes in large language models (AI that learns with large amounts of text data such as ChatGPT) using GDDR6-AiM chips.
³Accelerator: A special-purpose hardware device that uses a chip designed specifically for processing and computing information.
⁴Processing-In-Memory (PIM): A next-generation technology that adds computational capabilities to semiconductor memories to solve the problem of data movement congestion in AI and big data processing.

Figure 3. SK hynix’s booth providing a demonstration of AiMX, an AI accelerator card

CXL⁵ was another highlight at SK hynix’s booth. Based on PCle⁶, CXL is a standardized interface that helps increase the efficiency of HPC systems. Offering flexible memory expansion, CXL is a promising interface for HPC systems such as AI and big data-related applications. In particular, SK hynix’s Niagara CXL disaggregated memory prototype platform was showcased as a pooled memory solution that can improve system performance in AI and big data distributed processing systems.

⁵Compute Express Link (CXL): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
⁶Peripheral Component Interconnect Express (PCIe): A high-speed input/output series interface used in the mainboard of digital devices. PCIe’s data-transfer speed doubles in accordance with a generation shift.

Figure 4. SK hynix’s CXL pooled memory solution, Niagara, and CXL-based computational memory solution (CMS)

Additionally, SK hynix was able to present the results of its collaboration with Los Alamos National Laboratory (LANL) to improve the performance and reduce the energy requirements of applications that utilize HPC physics. Called CXL-based computational memory solution (CMS)⁷, the product has the capability to accelerate indirect memory accesses while also significantly reducing data movement. Such technological enhancements are also applicable to various memory-intensive domains such as AI and graph analytics.

⁷Computational Memory Solution (CMS):  A memory solution that offers the functions of machine learning and data filtering, which are frequently performed by big data analytics applications. Just like CXL, CMS’s memory capacity is highly scalable.

Lastly, object-based computational storage (OCS) was shown as part of SK hynix’s efforts to develop an analytics ecosystem with multiple partners. It minimizes data movement between analytics application systems and storage, reduces storage software stack weight, and accelerates data analysis speed. And through a demonstration, the company showed how its interface technology enhances data processing capabilities in OCS.

Figure 5. Object-based computational storage (OCS) was developed as part of SK hynix’s efforts to form an analytics ecosystem

Innovative Data Center & eSSD Solutions

Figure 6. A presentation of data center solutions including MCR DIMM, PS1010, and PS1030

SK hynix also displayed a range of its data center solutions at the conference, including its DDR5 Registered Dual In-line Memory Module (RDIMM). Equipped with 1bnm, the fifth generation of the 10nm process technology, DDR5 RDIMM reaches speeds of up to 6,400 megabits per second (Mbps). The display also featured DDR5 Multiplexer Combined Ranks (MCR) DIMM, which reaches speeds of up to 8,800 Mbps. With such rapid speeds, these DDR5 solutions are suited for AI computing in high-performance servers.

Visitors to the SK hynix booth could also see its latest enterprise SSD (eSSD) products, including the PCle Gen5-based PS1010 E3.S and PS1030. In particular, the PS1030 delivers the industry’s fastest sequential read speed of 14,800 megabytes per second (MBps) which makes it ideal for big data and machine learning.

Sharing the Potential of SK hynix’s Memory Solutions

Figure 7. Technical Leader Yongkee Kwon presents about LLM inference solution using SK hynix’s AiM

During the conference, SK hynix employees also held presentations on the application of the company’s memory solutions for AI and HPC. On the fourth day of the conference, Technical Leader of PIM Hardware in Solution Advanced Technology Division Yongkee Kwon held a talk titled “Cost-Effective Large Language Model (LLM) Inference Solution Using SK hynix’s AiM.” Kwon revealed how SK hynix’s AiM, a PIM device that is specialized for LLMs, can significantly improve the performance and energy efficiency of LLM inference. When applied to Meta’s Open Pre-trained Transformers (OPT) language model, an open-source alternative to Open AI’s GPT-3, AiM can reach speeds up to ten times higher than state-of-the-art GPU systems while also offering lower costs and energy consumption.

Figure 8. Technical Leader Hokyoon Lee talks about the innovative solutions offered by SK hynix’s CXL solution, Niagara

On the same day, Technical Leader of System Software in Memory Forest x&D Hokyoon Lee held a presentation titled “CXL-based Memory Disaggregation for HPC and AI Workloads.” SK hynix’s Niagara addresses the issue of stranded memory—or unused memory in each server that can never be utilized by other servers—with its elastic memory⁸ feature. Additionally, Niagara’s memory sharing feature provides a solution to heavy network traffic in conventional distributed computing. In the session, the presenters demonstrated the effectiveness of memory sharing during a real simulation with the Ray distributed AI framework which is used in ChatGPT.

⁸Elastic memory: A type of memory with capacity that can be adjusted as required by servers when multiple hosts share memory, such as pooled memory.

A day later, Director and Technical Leader of SOLAB in Memory Forest x&D Jongryool Kim presented on “Accelerating Data Analytics Using Object Based Computational Storage in an HPC.” By introducing SK hynix’s collaboration with LANL in researching computational storage technologies, Kim proposed object-based computational storage (OCS) as a new computational storage platform for data analytics in HPC. Due to its high scalability and data-aware characteristics, OCS can perform analytics independently without help from compute nodes—highlighting its potential as the future of computational storage in HPC.

Similarly, SK hynix will continue to develop solutions that enable the advancement of AI and HPC as a globally leading AI memory provider.

Figure 9. Technical Leader Jongryool Kim explains how SK hynix participated in collective research into computational storage technologies

The post SK hynix Debuts at SC23 to Showcase Next-Gen AI & HPC Solutions first appeared on SK hynix Newsroom.

SK hynix showcased its next-generation memory semiconductor technologies and solutions at the OCP Global Summit 2023 held in San Jose, California from October 17–19.

The OCP Global Summit is an annual event hosted by the world’s largest data center technology community, the Open Compute Project (OCP), where industry experts gather to share various technologies and visions. This year, SK hynix and its subsidiary Solidigm showcased advanced semiconductor memory products that will lead the AI era under the slogan “United Through Technology”.

▲ Figure 1. SK hynix’s exhibition booth at the OCP Global Summit 2023

At the Booth: Leading Global AI Memory Technologies in the Spotlight

▲ Figure 2. HBM(HBM3/HBM3E), MCR DIMM, DDR5 RDIMM, and LPDDR CAMM products on display at SK hynix’s booth

SK hynix presented a broad range of its solutions at the summit, including its leading HBM¹(HBM3/3E), CXL², and AiM³ products for generative AI. The company also unveiled some of the latest additions to its product portfolio including its DDR5 RDIMM, MCR DIMM, enterprise SSD (eSSD), and LPDDR CAMM⁴ devices.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
²Compute Express Link (CXL): A next-generation memory solution that increases the memory bandwidth of server systems with traditional DRAM products to improve performance and easily expand memory capacity.
³Accelerator in Memory (AiM): SK hynix’s PIM semiconductor product name, which includes GDDR6-AiM.
⁴Low Power Double Data Rate Compression Attached Memory Module (LPDDR CAMM): A solution developed based on the LPDDR package in line with the next-generation memory standard (CAMM) for laptops and mobile devices. Compared to conventional So-DIMM modules, LPDDR CAMM has a single-sided configuration which is half as thick and offers improved capacity and power efficiency.

Visitors to the HBM exhibit could see HBM3, which is utilized in NVIDIA’s H100, a high-performance GPU for AI, and also check out the next-generation HBM3E. Due to their low-power consumption and ultra-high-performance, these HBM solutions are more eco-friendly and are particularly suitable for power-hungry AI server systems.

▲ Figure 3. CXL-based CMS 2.0, pooled memory, and memory expander solutions being demonstrated at the event

Three of SK hynix’s key CXL products were demonstrated at the event, including its CXL-based computational memory solution (CMS)⁵ 2.0. A next-generation memory solution that integrates computational functions into CXL memory, CMS 2.0 uses NMP⁶ to minimize data movement between the CPU and memory. CMS 2.0 was applied to SK Telecom’s spatial data analysis and visualization solution based on Lightning DB which analyzes foot traffic in real time, illustrating CMS 2.0’s data processing power equivalent to a server CPU. Moreover, the demonstration highlighted that CMS 2.0 can improve data processing performance and energy efficiency.

⁵Computational Memory Solution (CMS):  A memory solution that offers the functions of machine learning and data filtering, which are frequently performed by big data analytics applications. Just like CXL, CMS’s memory capacity is highly scalable.
⁶Near-Memory Processing (NMP): A memory architecture which moves the compute capability next to the main memory to address CPU memory bottlenecks and improve processing performance.

The company also demonstrated its CXL-based pooled memory solution which can significantly reduce idle memory usage and shorten the overhead time of data movement in distributed processing environments such as AI and big data. The demonstration, which featured a technological collaboration with software provider MemVerge, showcased how CXL-based pooled memory solutions can improve system performance in AI and big data distributed processing systems.

Additionally, SK hynix demonstrated its CXL-based memory expander applied to Meta’s software caching engine, CacheLib, which showed how the CXL-based memory solution optimizes software for improved performance and cost savings.

▲ Figure 4. PIM and AiMX on display at the summit

AiM, a game-changing technology that redefines memory’s role in AI inference, was also presented at the booth. A subset of SK hynix’s PIM⁷ portfolio, AiM promises to revolutionize machine learning, high-performance computing, and big data applications while reducing operating costs. The company demonstrated its GDDR6-AiM, a solution which incorporates computational capabilities into the memory and improves the performance and efficiency of data-intensive generative AI inference systems. Additionally, a demonstration was held for the prototype of AiMX⁸, an innovative generative AI accelerator card based on GDDR6-AiM.

⁷Processing-In-Memory (PIM): An advanced technology that combines computational capabilities and memory within just one die to perform the best computing capability.
⁸Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card featuring a GDDR6-AiM chip which is specialized for large language models.

▲ Figure 5. PS1010 E3.S, a PCIe Gen5 eSSD product, showcased at the booth

SK hynix also showcased the PS1010 E3.S, a PCIe (Peripheral Component Interconnect Express) Gen5-based eSSD. Designed for data-intensive applications, cloud computing, and AI workloads, the PS1010 E3.S promises improved performance and reliability with superior speed and lower carbon emissions compared to previous generations.

At the Sessions: Sharing Industry Insights & Key Technologies

▲ Figure 6. SK hynix’s Hoshik Kim, fellow of the System Architecture Group in Memory Forest x&D, holds a session on CXL technology

Through thought-provoking talks and sessions at the summit, SK hynix also suggested the future development of next-generation memory solutions.

In a panel session titled “Data Central Computing, Present and Future”, Hoshik Kim, fellow of the System Architecture Group in Memory Forest x&D, joined other industry experts to omputing and programming models. Kim also held an executive session in which he revealed SK hynix’s progress in developing CXL technology and shared the company’s vision under the theme of “CXL: A Prelude to a Memory-Centric Computing”.

▲ Figure 7. SK hynix’s Youngpyo Joo, Dongwuk Moon and Jungmin Choi of Memory Forest x&D giving talks on CXL-based solutions

The potential of CXL was also the focal point of three other sessions held by the company’s employees from the Memory x&D department. Youngpyo Joo, head of the Software Solutions Group, explored how CXL-based computational memory solution architecture can offer increased usability and flexibility.

Meanwhile, Donguk Moon, technical leader of the Platform Software team, introduced how emerging CXL devices can enhance memory capacity and bandwidth at the caching layer for technologies such as AI and web services. In addition, Jungmin Choi, technical leader of the Composable Memory team, covered how the latest CXL technology will further support the disaggregation of memory. Choi also emphasized that this technology can not only solve problems currently faced by data centers such as idle memory, but also improve system performance.

▲ Figure 8. Euicheol Lim, head of SK hynix’s Memory Solution Product Design Group, discusses PIM-based AiM and PIM technologies

In another engaging session, Euicheol Lim, head of the Memory Solution Product Design Group, explored the potential for PIM technology to meet the high memory and computational demands of AI. Lim highlighted key technologies based on PIM, including SK hynix’s PIM-based AiM accelerator.

Advanced Solutions to Unlock Next-Generation Technologies

As the OCP Global Summit 2023 drew to a close, SK hynix reinforced its commitment to developing groundbreaking solutions which can help realize advanced technologies such as AI. Going forward, the company will continue to tackle industry challenges and make technological breakthroughs for the AI era as the global no.1 AI memory solution provider.

The post SK hynix Displays Next-Gen Solutions Set to Unlock AI & More at OCP Global Summit 2023 first appeared on SK hynix Newsroom.

NEWS HIGHLIGHTS

• SK hynix and Solidigm unveil their first technology and product collaboration, which combines SK hynix’s 128-layer NAND Flash with Solidigm’s SSD controller and firmware expertise.
• Together, SK hynix and Solidigm will continue to optimize both companies’ operations to create synergies and partnership.
• Additionally, the collaboration between SK hynix and Solidigm reflects their commitments to strengthening their investments in US R&D, as part of SK hynix’s “Inside America Strategy.”

San Jose, California, April 4th, 2022, and Seoul, South Korea April 5th, 2022

Today SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel’s NAND and SSD business.

The P5530 combines SK hynix’s 128-layer 4D NAND flash with Solidigm’s SSD controller^* and firmware supporting a PCIe^* Gen 4 interface. The product is offered in 1TB, 2TB, and 4TB capacity options. SK hynix and Solidigm worked together to optimize performance with specific data center use cases and targeted deployments in mind.

Since the launch of Solidigm, the companies have partnered to forge a forward-moving strategy and co-develop products while reinforcing common values across the companies. Through the ongoing partnership and collaboration with Solidigm, SK hynix expects to enhance its NAND flash business competitiveness to the same extent as its DRAM business.

“With in-time demonstration of the collaborative product based on the combined competence of SK hynix and Solidigm, we aim to not only enhance our NAND flash business competitiveness but also speed up our “Inside America” strategy,” said Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO) at SK hynix. “SK hynix and Solidigm will continue to partner in order to optimize both companies’ operations to create greater synergies.”

“In our early days of Solidigm, we’re pleased to be forming a strong collaboration with SK hynix. Together, we’re united in optimizing our products to provide unparalleled solutions for our customers. The P5530 is just the first example of what will come from our industry-defining partnership as we solidify our leadership across the NAND industry and create a new paradigm for solid state storage,” said Rob Crooke, Chief Executive Officer at Solidigm.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”), and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

About Solidigm

Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Our origins reflect Intel’s longstanding innovation in memory products and SK hynix’s international leadership and scale in the semiconductor industry. Solidigm became a standalone U.S. subsidiary under SK hynix in December 2021. Headquartered in San Jose, CA, Solidigm is powered by the inventiveness of more than 2,000 employees in 20 locations worldwide. For more information about Solidigm, please visit https://www.solidigm.com and follow us on Twitter at @Solidigm and on LinkedIn.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Jaehwan Kevin Kim
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Solidigm
Corporate Affairs

Rhonda Foxx
press@solidigmtechnology.com

Catherine Roberts
press@solidigmtechnology.com

The post SK hynix and Solidigm Introduce First Collaborative Product first appeared on SK hynix Newsroom.

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With every new year comes a fresh sense of optimism about the future, a moment to focus on what’s to come, instead of what we’re leaving behind. And so, it’s fitting that the annual Consumer Electronics Show would take place in early January to provide the world with a preview of the products, services and technologies that will impact our lives in the year – and years – ahead.

Back in-person at the Las Vegas Convention Center after a Covid-prompted virtual-only show last year, CES remains a one-of-a-kind, a spotlight show where devices have long grabbed the headlines. The event, starting January 5 in strict compliance of the federal and local health authorities’ guidelines, is taking place in a relatively calmer mood, but still attracting visitors eager to learn the new technology trend.

It’s important to remember, however, that the “E” in CES stands for Electronics and that none of these attention-grabbing devices would be what they are without the various internal components – from Bluetooth chips to advanced semiconductor memory – powering them.

In keeping with the spirit of looking into the future with optimism, SK hynix will use its show floor space at CES to promote a different type of optimism for the future, one that impacts everyone – the environmental impact.

For as much attention that the devices themselves receive about battery life, heat generation and other concerns, carbon reduction efforts begin at the heart of those devices, within the internal components.

As a semiconductor company, SK hynix, along with five other group affiliates participating in the exhibition, shoulders an important part of SK Group’s larger carbon reduction effort and will be showcasing examples of its impact on three distinct areas: the product, the process, and the package.

The Product: Low-Powered Semiconductors

It’s widely recognized that general solid-state drives, or SSDs, consume 60% less power than hard-disk drives, or HDDs. If we can replace existing 4th generation NAND Flash-based enterprise SSDs (eSSDs) in the data centers around the world with 5th generation eSSDs, carbon dioxide emissions could be reduced by 50,000 tons a year in 2030.

SK hynix’s world’s best-performing DRAM, High Bandwidth Memory 3 (HBM3), is also expected to contribute to SK hynix’s efforts to reduce carbon dioxide emissions. HBM3, which is used for AI Accelerators and high-performance graphics cards, has improved power consumption over existing GDDR DRAM by about 50 percent. Replacing GDDR DRAM with HBM3 also will contribute to the reduction of CO2 emissions by about 830,000 tons a year in 2030.

By accelerating the transition of the storages into SSDs and developing the next-gen semiconductor memory solutions, SK hynix can help contribute to the reduction of carbon dioxide emissions, which is one of the important goals for SK Group.

The Process: Water-free scrubber

One of the best examples of SK hynix’s sustainable movement is the adoption of the highly efficient ‘Water-Free Scrubber’ at process plants to better manage water resources.

SK hynix’s dedication to the safe disposal of various chemicals used in semiconductor processing is proven through its development and adoption of eco-friendly process technology. For this, the eco-friendly scrubber technology was developed for the treatment of process gas. The eco-friendly scrubbers led to a reduction of greenhouse gas emissions by approximately 90 percent a year in 2020. Furthermore, SK hynix developed new water-free scrubbers with its partner companies. Compared to the existing scrubbers, these water-free scrubbers can eliminate process gas without using any water resources, and by so further reduce water resource consumption.

The Package: Biodegradable package material

The commitment to the environment doesn’t end when the products are manufactured. Even the packaging that our SSDs are shipped in take the environment into consideration.

Last year, when the company announced its Gold P31 SSD, it noted packaging that utilized biodegradable plastic bags, soy ink and Forest Stewardship Council (FSC)-certified paper. This eco-friendly package can be degraded by 90% in 180 days, and the certification indicated that the wood fiber was harvested in ways that reduce environmental impact by protecting water quality, avoiding hazardous chemicals, and protecting forest ecology and wildlife habitats.

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SK’s Pursuit of Eco-Friendly Semiconductor Ecosystem

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Processing a copious amount of data we use every day generates a lot of heat and carbon. In the process of semiconductor production, we are also striving with our business partners to create a sustainable semiconductor ecosystem by establishing the Eco Alliance, which is concerned with minimizing carbon emissions and solving environmental problems.

In 2019, SK hynix created the ECO Alliance, a coalition of nearly 40 partner companies committed to building an eco-friendly semiconductor ecosystem. Each member company of alliance is held accountable to mid-to long-term environmental goals that will reduce the impact of their company on the environment. SK hynix is working with partners to maximize energy efficiency in the manufacturing process by recovering waste heat and operating the refrigeration system in optimal condition.

THE SK FAMILY EFFORT

When it comes to carbon reduction, the work being done through SK hynix are part of a larger effort among SK Group’s many companies. The Group is determined to contribute to the global carbon reduction targets of 21 billion tons by 2030 by taking on one percent of that, or 200 million tons.

The work is part of SK Group’s larger philosophy and belief that social values are just as important as economic values. It’s an important message that will resonate as many of us venture out again for the first time since Covid changed our lives. For some, it will be the first time back on an airplane or sleeping in a hotel room. For others, it may be the first time being back among large groups of people.

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But to be back after last year’s hiatus, to see some cutting-edge technologies and be able to understand that the future is more than what we do, but also how we go about doing it. It’s an exciting time to be back.

Safe travels to one and all heading to and from Las Vegas. Stay healthy.

The post Back to CES: SK hynix Focuses on Ways Technology Can Impact Carbon Reduction Efforts first appeared on SK hynix Newsroom.

Solution products based on 128-layer 1Tb 4D NAND
(Clockwise from top left) 16TB E1.L eSSD, 2TB cSSD, 1TB UFS 3.1

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SK hynix delivered the engineering samples of its Terabyte-level high-density solutions based on the 128-layer 1Tb (Terabit) CTF (Charge Trap Flash) based 4D NAND Flash to major customers this month. These include ▲ 1TB UFS 3.1, ▲ 2TB cSSD (client SSD), and ▲ 16TB E1.L eSSD (enterprise SSD).
SK hynix succeeded in the mass production of the 128-layer 1Tb TLC NAND for the first time in the industry in June 2019. A small chip size of the SK hynix’s 4D NAND allows ultra-low power and ultra-thin solution products of TB level of capacity.

Ultra-thin (1.0mm) 1TB UFS 3.1 for 5G Smartphones

Ultra-thin (1.0mm) 1TB UFS 3.1 for 5G smartphones

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In November this year, SK hynix provided engineering samples of its 1TB UFS 3.1, based on the 128- layer 1Tb 4D NAND, to major smartphone manufacturers. As the number of chips required to realize 1TB product has halved compared with using 512Gb NAND, the 1TB could be produced with a package thickness of only 1mm, which is optimal for ultra-thin 5G smartphones. Smartphones equipped with this product are expected to be mass-produced around the second half of the next year.

This product adopted a new feature called Write Booster, which is the industry’s new standard, and SK hynix’s in-house controller and firmware, doubling the sequential write performance. Thanks to this, one 4K UHD film of 15GB (gigabyte) can be downloaded in only 20 seconds.

2TB cSSD with the Industry’s Highest Power Efficiency

2TB cSSD with the industry’s highest power efficiency

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2TB cSSD targets slim laptops and gaming PCs that require higher specifications. In this product, the 128-
layer 1Tb TLC NAND Flash which realized a data transfer rate of 1,200Mbps (Megabits/sec) at only 1.2V is combined with SK hynix’s own controller where Hardware Automation technology was applied, delivering the best performance in PCIe Gen3 platforms.

The 2TB sample delivered to customers this time realized the industry’s best power efficiency by lowering 6W in the previous 96-layer SSD product to 3W. After customer qualification, this product is expected to be used by major PC manufacturers from the first half of 2020.

16TB E1.L eSSD, a standard form factor for Next-Generation Data Centers

16TB E1.L eSSD, a standard form factor for next-generation data centers

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Meanwhile, SK hynix’s 16TB eSSD in new standard E1.L form factor, based on the cost competitive 128-
layer 1Tb TLC NAND, is a PCIe standard product supporting the latest NVMe 1.4 protocol. It is expected that the mass-production of this product will begin from the second half of next year. This product can store more than 1,000 4K UHD movies of 15GB each. Moreover, by applying SK-hynix’s in-house controller and firmware, this product features a sequential read of 3,400MB/s and a sequential write of 3,000MB/s.

As the enterprise PCIe SSD market is expected to grow by average 53% annually until 2023, SK hynix is concentrating more on this market. With this effort, SK hynix’s market share in PCIe enterprise SSD in the second quarter of this year was 10.3%, significantly increasing from 1.8% of the same period of the last year. (The market growth rate and market share are based on TRENDFOCUS)

“128-layer 1Tb 4D NAND boasts the industry’s highest density, best performance, and even cost competitiveness,” said Vice President Han Joo Na, Head of NAND Development Strategy. “By accelerating the business of 128 layer NAND solutions, which provides high productivity and investment efficiency, SK hynix is reinforcing its competitiveness of the NAND business.”

World’s first 128-layer 1Tb 4D NAND Flash by SK hynix

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The post SK hynix Delivers Engineering Samples of Terabyte-Level Solutions Based on a 128-Layer 4D NAND first appeared on SK hynix Newsroom.