FMS 2024 features a broader focus on different memory types compared to previous years

SK hynix has returned to Santa Clara, California to present its full array of groundbreaking AI memory technologies at FMS: the Future of Memory and Storage (FMS) 2024 from August 6–8. Previously known as Flash Memory Summit, the conference changed its name to reflect its broader focus on all types of memory and storage products amid growing interest in AI. Bringing together industry leaders, customers, and IT professionals, FMS 2024 covers the latest trends and innovations shaping the memory industry.

Participating in the event under the slogan “Memory, The Power of AI,” SK hynix is showcasing its outstanding memory capabilities through a keynote presentation, multiple technology sessions, and product exhibits.

Keynote Presentation: Envisioning the Future of AI With Leading Memory & Storage Solutions

Keynote presentations have always been a highlight at FMS. The talks act as an important forum for attendees to learn about emerging memory and storage technologies from industry leaders. Due to its leadership in the AI memory field, SK hynix was selected to give a keynote presentation titled “AI Memory and Storage Solution Leadership and Vision for the AI Era” at the newly expanded event.

Held on the first day of FMS 2024, the keynote was delivered by Vice President Unoh Kwon, head of HBM Process Integration (PI) and Vice President Chunsung Kim, head of SSD Program Management Office (PMO). The pair provided insights into the company’s DRAM and NAND flash solutions which aim to solve the pain points of generative AI and promote continued development of AI. These pain points include maximizing the efficiency of AI training and inference¹ while minimizing floor space and power utilization for storing data.

¹AI inference: The process of running live data through a trained AI model to make a prediction or solve a task.

Kwon and Kim delivering their keynote on SK hynix’s leading AI memory products

Each speaker covered a particular type of memory. Kwon touched on the company’s DRAM memory products that are optimized for AI systems such as HBM², CXL®³, and LPDDR5T⁴. Meanwhile, Kim introduced the company’s best-in-class NAND flash storage devices including its SSD and UFS⁵ solutions, which will continue to be crucial for AI applications in the future.

²High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
³Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
⁴Low Power Double Data Rate 5 Turbo (LPDDR5T): Low-power DRAM for mobile devices aimed at minimizing power consumption and featuring low voltage operation. LPDDR5T is an upgraded product of the LPDDR5X and will be succeeded by LPDDR6.
⁵Universal Flash Storage (UFS): A high-performance interface for computing and mobile systems which require low power consumption.

In addition to its keynote, SK hynix also held five sessions that took a deeper look into its next-generation products set to solidify the company’s AI technology leadership. These sessions covered a variety of topics, including the company’s DRAM, SSD, and CXL solutions.

Product Booth: Presenting the Industry’s Best AI Memory

SK hynix’s booth at FMS 2024 consists of four sections showcasing many of the products which featured in the company’s keynote and session talks. One of the booth’s highlights is the samples of the 12-layer HBM3E, the next-generation AI memory solution which is expected to be mass-produced in the third quarter of 2024. The company is also holding demonstrations of select products with its partners’ systems, highlighting its strong collaboration with various major tech companies.

The AI Memory and Storage section includes industry-leading solutions such as SK hynix’s HBM3E and eSSD portfolio

• AI Memory and Storage: Features SK hynix’s flagship AI memory products such as samples of its 12-layer HBM3E, which is set to be the same height as the previous 8-layer version under JEDEC⁶ standards. The section also includes GDDR6-AiM⁷, a product suitable for machine learning due to its computational capabilities and rapid processing speeds, and the ultra-low power LPDDR5T optimized for on-device AI. Storage solutions on display include the PCIe Gen5-based eSSD PS1010, which is ideal for AI, big data, and machine learning due to its rapid sequential read speed.

⁶Joint Electron Device Engineering Council (JEDEC): A U.S.-based standardization body that is the global leader in developing open standards and publications for the microelectronics industry.
⁷Accelerator in Memory (AiM): A special-purpose hardware made using processing and computation chips.

At the NAND Tech, Mobile, and Automotive section, attendees can see products such as the company’s 321-layer NAND and ZUFS 4.0

• NAND Tech, Mobile, and Automotive: This section includes solutions such as the world’s highest 321-layer wafer technology as well as triple-level cell (TLC) and QLC NAND. Mobile technologies are also showcased including ZUFS⁸ 4.0, an industry-best NAND product optimized for on-device AI⁹ which boosts a smartphone’s operating system speed compared to standard UFS.

⁸Zoned Universal Flash Storage (ZUFS): A NAND flash product that improves efficiency of data management. It optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS.
⁸On-device AI: A technology that implements AI functions on the device itself, instead of going through computation by a physically separated server.

The AI PC and CMS 2.0 section features a demonstration of the company’s industry-leading SSD, PCB01

• AI PC and CMS 2.0: Attendees can see a system demonstration of the industry-best SSD PCB01, which is able to efficiently process large AI computing tasks when applied to on-device AI PCs. In addition, CMS¹⁰ 2.0, a next-generation memory solution that boasts equivalent data processing capabilities as a CPU, is applied to a vector database¹¹.

¹⁰Computational Memory Solution (CMS): A product that integrates computational functions into CXL memory.
¹¹Vector Database: A collection of data stored as mathematical representations, or vectors. As similar vectors are grouped together, vector databases can make low-latency inquiries, making them ideal for AI.

The OCS, Niagara, CMM section displays innovative solutions such as Niagara 2.0 and HMSDK

• OCS, Niagara, and CMM: This section features a demonstration of OCS¹² technology which enhances the data analysis and pooled memory solution Niagara 2.0¹³. It also includes a demonstration of CMM¹⁴– DDR5¹⁵, which expands system bandwidth by 50% and capacity by up to 100% compared to systems only equipped with DDR5.

¹²Object-based Computational Storage (OCS): A new computational storage platform for data analytics in high-performance computing. OCS has not only high scalability but also data-aware characteristics that enable it to perform analytics independently without help from compute nodes.
¹³Niagara 2.0: A solution that connects multiple CXL memories together to allow numerous hosts such as CPUs and GPUs to optimally share their capacity. This eliminates idle memory usage while reducing power consumption.
¹⁴CXL Memory Module (CMM): A new standardized interface that has an advantage in scalability and helps increase the efficiency of CPUs, GPUs, accelerators, and memory.
¹⁵Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.

Super Women Conference: Cherishing Diversity in the Memory & Storage Industry

Haesoon Oh delivers the keynote at the FMS Super Women Conference

SK hynix also co-sponsored the FMS Super Women Conference, an event held on the sidelines of FMS 2024 which celebrates the achievements of female leaders and promotes diversity in the memory industry. Head of NAND Advanced PI Haesoon Oh, the company’s first female executive-level research fellow, delivered a keynote address on the company’s next-generation innovations and the importance of understanding diversity.

Paving the Way Forward in the AI Era

At FMS 2024, SK hynix underlined its commitment to lead the industry by providing integrated AI memory solutions and expanding its expertise in the sector. Collaborating with other leading partners, the company will strive to provide customers with the best possible solutions that match their rapidly changing needs.

The post SK hynix Presents Extensive AI Memory Lineup at Expanded FMS 2024 first appeared on SK hynix Newsroom.

• To display AI memory product portfolio, introduce vision through keynote speech
• Key female leader to speak on role of diversity for technological innovation
• To promote stronger leadership in AI with competitiveness in integrated solutions

Seoul, August 1, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today it will participate in FMS 2024, a global semiconductor memory event taking place in Santa Clara, California, from August 6th through August 8th to showcase advancements in its memory technologies and products and present its future visions in the AI space.

The Future Memory and Storage, formerly known as the Flash Memory Summit for NAND providers mainly, was rebranded this year to invite a wider range of participants including DRAM and storage providers amid growing interest in AI technology.

SK hynix said that it will expand the scope of participation this year through not only display of the products, but also delivering keynote speech to introduce its future visions.

The company plans to take full advantage of the event to promote its competitiveness leading the AI memory solution industry as it did with the announcement of the development of the industry’s highest 321-layer NAND at FMS last year.

Opening the event will be a keynote speech by Unoh Kwon, Head of HBM Process Integration and Chunsung Kim, Head of SSD PMO, at SK hynix, on “AI Memory & Storage Solution Leadership and Vision for AI Era.” The two executives will introduce the company’s DRAM and NAND product portfolios and AI memory solutions optimized for AI implementation, respectively.

At the event, SK hynix will display the samples of the next-generation AI memory products such as the 12-layer HBM3E, expected to be mass produced in the third quarter, and 321-high NAND planned to be shipped from the first half of next year.

The company will also display the systems of customers completed with its flagship products to show its strong partnership with the world’s biggest technology companies.

In a bid to show its commitment to diversity, SK hynix has also decided to sponsor the FMS Super Women Conference taking on the sidelines of the event to encourage prominent female leaders in the memory industry. Haesoon Oh, Head of NAND Advanced Process Integration and the company’s first female executive-level fellow researcher, will make a presentation on the role of diversity for SK hynix’s future technology innovation.

“With the AI era opening in full, the importance of memory solutions, a combination of multiple products to increase performance, instead of single DRAM and NAND products, is growing,” said Justin Kim, President and the Head of AI Infra at SK hynix. “At FMS, we will imprint our competitiveness and technological leadership in the global market.”

Selected products from SK hynix’s memory lineup at FMS 2024: (from top left, clockwise) 321-layer NAND flash, ZUFS 4.0, PS1010, and PCB01

Selected products from SK hynix’s memory lineup at FMS 2024: (from top left, clockwise) LPDDR5T, HBM3E, CMS 2.0, and GDDR6-AiM

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix to Showcase Next-Generation Technology at FMS 2024 first appeared on SK hynix Newsroom.