SK hynix is showcasing its cutting-edge AI memory technologies at GPU Technology Conference (GTC) 2025 held in San Jose from March 17–21.

Hosted annually by NVIDIA, GTC is one of the world’s leading AI conferences. This year’s event, held under the theme “What’s Next in AI Starts Here,” features over 1,000 sessions and 300 exhibitions highlighting the latest advancements and solutions in AI technology.

Visitors gather to see the latest AI memory innovations at SK hynix’s booth

At the conference, SK hynix is presenting a booth under the theme “MEMORY, POWERING AI and TOMORROW,” showcasing memory products that accelerate AI innovation. These products are displayed in four sections: AI/Data Centers (DC), HBM¹, On-Device, and Automotive. In particular, the HBM section debuted a model of the 12-layer HBM4, which is currently under development, demonstrating the company’s overwhelming technological leadership.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that significantly enhances data processing speeds by vertically stacking multiple DRAM chips, surpassing the capabilities of traditional DRAM. HBM has evolved through six generations, starting with the original HBM and followed by HBM2, HBM2E, HBM3, HBM3E, and HBM4.

The AI/Data Centers section features high-performance eSSDs, DIMM solutions, and more

The AI/DC section features enterprise SSDs (eSSDs) optimized for large-scale data processing and storage, including PEB110, PS1010, and PEB9010, alongside data center DIMM² products such as DDR5 RDIMM and MRDIMM. The world’s highest-specification graphics memory, GDDR7³, is also on display. Additionally, next-generation AI memory products are drawing attention, including CMM-DDR5⁴, a DDR5-based CXL⁵ product, and SOCAMM⁶, a low-power DRAM module for AI servers. The company plans to begin mass production of SOCAMM in line with the market’s emergence, leveraging its strengths in LPDDR5X⁷ and server memory to expand its AI memory portfolio.

²Dual In-line Memory Module (DIMM): A module in which multiple DRAM chips are combined on a substrate.
³Graphics DDR (GDDR): A standard specification of graphics DRAM defined by JEDEC and specialized for processing graphics more quickly. It is now one of the most popular memory chips for AI and big data applications.
⁴CXL Memory Module-DDR5 (CMM-DDR5): A next-generation DDR5 memory module utilizing CXL technology to boost bandwidth and performance for AI, cloud, and high-performance computing.
⁵Compute Express Link (CXL): A next-generation interface that efficiently connects CPUs/GPUs and memory in high-performance computing systems, supporting large-scale, ultra-fast computations. Applying CXL to existing memory modules can expand capacity by more than 10 times.
⁶Small Outline Compression Attached Memory Module (SOCAMM): A next-generation memory module based on LPDDR5X, featuring a smaller form factor than traditional server memory modules while offering higher power efficiency.
⁷Low Power Double Data Rate 5X (LPDDR5X): Low-power DRAM for mobile devices, including smartphones and tablets, aimed at minimizing power consumption and featuring low voltage operation. LPDDR5X is the seventh-generation LPDDR product.

The company unveiled a model of its HBM4 at GTC 2025

The highlight of the HBM section is undoubtedly HBM4. Unveiled for the first time in the world at GTC 2025, the in-development HBM4 is set to offer significantly enhanced base die performance and vastly reduced power consumption. Following the introduction of this latest AI memory solution, HBM4, SK hynix will further strengthen its industry leadership. Additionally, the company is showcasing the industry’s best-performing and highest-capacity 12-layer HBM3E available today, alongside NVIDIA’s GB200 Grace^TM Blackwell Superchip.

The On-Device section features various products tailored for on-device and AI applications, including LPDDR6 and LPCAMM2

Visitors to the On-Device section can explore the company’s high-performance, low-power memory solutions designed for on-device data processing and AI computing. These include LPDDR6, LPCAMM2⁸, PCB01, and ZUFS⁹ 4.0.

⁸Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.
⁹Zoned Universal Flash Storage (ZUFS): An advanced version of UFS that improves data management efficiency by organizing data into zones, optimizing transfer between the operating system and storage device.

Various vehicle memory solutions are also on display in the Automotive section

Meanwhile, at the Automotive section, SK hynix is presenting a range of vehicle memory solutions aimed at advancing the era of autonomous mobility. These include HBM2E, LPDDR5, UFS¹⁰ 3.1, and Gen4 SSD tailored for the automotive industry.

¹⁰Universal Flash Storage (UFS): A breakthrough type of flash memory that can simultaneously read and write data. Due to its low-power consumption, high-performance and reliability, UFS is widely applied in mobile devices.

As well as its exhibition at GTC 2025, SK hynix has also prepared a virtual booth. Online visitors can browse a web brochure detailing the company’s achievements in 2024 and information on key products including server solutions, the high-capacity SSD PS1012, GDDR7, and CMM-DDR5. Furthermore, there are also videos of innovative products such as HBM, 1c DDR5¹¹, and automotive memory, emphasizing SK hynix’s technological leadership.

¹¹1c DDR5: A 16 gigabit DDR5 DRAM built using the 1c node, the sixth generation of the 10 nm DRAM process. The 10 nm DRAM process was developed in the order of 1x-1y-1z-1a-1b-1c. In October 2024, SK hynix became the first in the world to successfully develop the 1c DDR5 DRAM.

Jungsoo Park of HBM Product Planning presenting on the importance of HBM in the AI era

The company also shared its insights with industry professionals during the event’s presentation sessions. Technical Leader Jungsoo Park of HBM Product Planning presented on “HBM: Backbone of High-Performance Computing and AI,” highlighting the evolution of HBM technology and SK hynix’s unrivaled leadership in the field.

Kihong Kim of Mobility Business giving a talk on SK hynix’s automotive memory

Meanwhile, in an online session titled “Preparing for the Future: Automotive Memory and Storage Requirements”, Technical Leader Kihong Kim of Mobility Business introduced the characteristics of memory and storage in the automotive industry and SK hynix’s related strategic approach.

As AI technology continues its rapid evolution, the role of memory is becoming increasingly vital. At GTC 2025, SK hynix is underlining its AI memory leadership by introducing solutions optimized for the AI era. Looking ahead, the company will further strengthen collaboration with global AI companies to remain at the forefront of AI memory innovation.

The post SK hynix Showcases Unrivaled AI Memory Leadership at GTC 2025 first appeared on SK hynix Newsroom.

Amid intensifying technological competition and diversifying customer demands in today’s AI market, HBM¹ remains a gamechanger.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Backed by industry-leading technology, SK hynix’s HBM played a pivotal role in the company achieving its best-ever performance in 2024. In 2025, continued innovation and enhanced productivity will be crucial to drive even greater growth. The role of the HBM Heterogeneous Integration Technology team, responsible for optimizing yield, quality, and cost, as well as advancing packaging technology, is therefore more critical than ever.

To find out more about the team’s efforts, the SK hynix Newsroom sat down with its leader, Vice President Kwonwhan Han. In the first episode of an interview series featuring newly appointed executives in 2025, Han discussed HBM technology innovation strategies for leading the AI memory market along with his vision and goals.

Two Birds, One Stone: Achieving Technological & Operational Innovation

Han, who joined SK hynix in 2002, was involved from the initial development of HBM and has since led the development and mass production of every HBM generation, playing a key role in establishing the company’s HBM leadership.

“When HBM was first launched, production scale and demand were nowhere near today’s levels” he stated. “However, the emergence of ChatGPT in 2023 sparked explosive growth in the AI market and a rapid surge in customer demand. In response, we were tasked with building a much larger production line than the existing one in a short period of time. To meet demand, we also converted parts of other production lines into HBM production lines, establishing a large-scale mass production system. At the time, it seemed nearly impossible to reach our goals, but with the dedicated efforts of the HBM Heterogeneous Integration Technology team and related departments, we were able to succeed.”

Han’s strategic response became the foundation for SK hynix’s increased HBM market share and world-class production capacity and quality. Building on this experience and expertise, he is now set to lead the HBM Heterogeneous Integration Technology team. In this position, he will play a crucial role in enhancing mass-production capabilities and establishing a new technical base for a smooth transition to next-generation HBM.

“To stay competitive in the HBM market, it is essential to not only have technological expertise but also deliver the best products to customers in a timely manner,” Han claimed. “I will do my utmost to establish a collaborative system that can promptly respond to market and customer demands through technological and operational innovation, ensuring stable mass production.”

Han plans to develop a collaborative system which can respond to market demands, ultimately leading to stable HBM mass production

Building the Optimal Mass-Production Environment to Meet Market & Customer Demands

“The most important task in 2025 is to respond steadily to growing market demands, while also solidifying our technological readiness for mass production of next-generation HBM,” Han emphasized.

“The 12-layer HBM3E, which will be the main focus of production in 2025, has a higher level of process complexity compared to the existing 8-layer HBM3E,” he revealed. “Additionally, as next-generation HBM products evolve, we expect the technical challenges will become more demanding. While mass production will begin after overcoming many of these challenges during development, unexpected variables may still emerge as we rapidly scale production, and it will be difficult to resolve them. Therefore, the HBM Heterogeneous Integration Technology team plans to focus on proactively anticipating these variables and developing a thorough response strategy.”

Recently, as demand for AI memory increases, there has also been a gradual rise in demand for customized products, especially among big tech companies. However, HBM involves more process steps and a more complex production process than other products, making it challenging to meet these demands. “Rather than simply increasing production volume, establishing an efficient operational system has become even more important,” Han stated. “We will enhance the flexibility of our production lines and strengthen collaboration with customers to maximize our HBM competitiveness.

“We are improving various operational systems through collaboration to enhance HBM production flexibility. From the development stage, development and mass production departments will work as one, closely cooperating with customers to increase production efficiency. To achieve this, we aim to establish an optimal mass-production environment by proactively addressing technical challenges with relevant departments. Based on these efforts, we will contribute to SK hynix’s advancement as a full stack AI memory provider.”

Han aims to enhance production line flexibility and strengthen customer collaboration to maximize HBM competitiveness

Fulfilling the Leader’s Role: Fostering Employee & Company Growth

Han emphasized that the key to driving outstanding performance lies in employees’ self-driven motivation, adding that leadership plays a crucial role in fostering such a mindset. In particular, he expressed a strong commitment to supporting the growth of younger team members.

“I believe that the role of a leader is to communicate in order to create an environment where employees can motivate themselves and take ownership of their work,” he said. “I will actively communicate and solve problems with my team so that passionate young employees who do their best can grow together with the company.”

In addition, Han emphasized that on-site safety remains the most important value even in a rapidly changing market, and encouraged employees to confidently move forward together.

“We are currently growing rapidly, and we must focus on achieving our goals. However, nothing is more important than safety at our facilities,” he claimed. “To ensure this, our management will lead by example. Also, I hope we never forget that we are the world’s best in our industry. Moving forward, I will continue to communicate and collaborate with my team, working together to build an even stronger SK hynix.”

Read more articles from the New Leadership Spotlight 2025 series

The post [New Leadership Spotlight 2025] Head of HBM Heterogeneous Integration Tech Kwonwhan Han Strives to Strengthen HBM Leadership Through Optimized Mass Production first appeared on SK hynix Newsroom.

The post [CES 2025 Video] Ride the AI Wave With SK hynix first appeared on SK hynix Newsroom.

• SK hynix to showcase technological capabilities, participating in the world’s largest consumer electronics show, CES 2025, from January 7-10
• Featuring a wide range of products driving the AI era, from HBM, the core of AI infrastructure, to next-gen memories like PIM
• Company to present new possibilities in the AI era through technological innovation and provide irreplaceable value

Seoul, January 3, 2025

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).

A large number of C-level executives, including CEO Kwak Noh-Jung, CMO (Chief Marketing Officer) Justin Kim and Chief Development Officer (CDO) Ahn Hyun, will attend the event. “We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES,” said Justin Kim. “Through this, we will publicize our technological competitiveness to prepare for the future as a ‘Full Stack AI Memory Provider¹’.”

¹Full Stack AI Memory Provider: Refers to an all-round AI memory provider, which provides comprehensive AI-related memory products and technologies

SK hynix will also run a joint exhibition booth with SK Telecom, SKC and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” The booth will showcase how SK Group’s AI infrastructure and services are transforming the world, represented in waves of light.

SK hynix, which is the world’s first to produce 12-layer HBM products for 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry’s highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance.

In addition, the company will display high-capacity, high-performance enterprise SSD products, including the ‘D5-P5336’ 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power and space efficiency, has been attracting considerable interest from AI data center customers.

“As SK hynix succeeded in developing QLC²(Quadruple Level Cell)-based 61TB products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market” said Ahn Hyun, CDO at SK hynix. The company will also showcase on-device AI products such as ‘LPCAMM2³’ and ‘ZUFS 4.0⁴,’ which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX⁵, designed to be core infrastructures for next-generation data centers.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.
³Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.
⁴Zoned Universal Flash Storage (ZUFS): A NAND Flash product that improves efficiency of data management. The product optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS, a flash memory product for various electronic devices such as digital camera and mobile phone.
⁵Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card product that specializes in large language models using GDDR6-AiM chips

In particular, CMM-Ax is a groundbreaking product that adds computational functionality to CXL’s advantage of expanding high-capacity memory, contributing to improving performance and energy efficiency of the next-generation server platforms⁶.

⁶Platform: Refers to a computing system that integrates both hardware and software technologies. It includes all key components necessary for computing, such as the CPU and memory.

“The changes in the world triggered by AI are expected to accelerate further this year, and SK hynix will produce 6^th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers,” said Kwak Noh-Jung, CEO at SK hynix. “We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”), and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix to Unveil ‘Full Stack AI Memory Provider’ Vision at CES 2025 first appeared on SK hynix Newsroom.

Who helped define the semiconductor industry’s early history?

Pioneers and visionaries laid the groundwork for today’s global semiconductor industry. The “Who” episode reveals the history of some of the sector’s most influential figures and their contributions to the industry.

Having learned about the pioneers of the industry, the next step is to discover more about semiconductors themselves, including the various types.

So what types of semiconductors are there?

Semiconductors are generally classified based on their functionality. On this basis, the “What” episode details the three main types of chips and their functions.

These chips, especially semiconductor memory, have transformed how society interacts with technology and have become increasingly integral to daily life in recent years.

If semiconductor memory is so crucial, when did it become essential in daily life?

As technology has advanced and data generation has skyrocketed, semiconductor memory has grown in importance. The “When” episode traces the increasingly vital role of memory over the years, from its applications in the first home PCs to today’s AI-driven systems.

Without memory chips, modern computing, the internet, and AI would not exist. As demand for these semiconductors has surged, specialized manufacturing facilities have ramped up production to meet demand.

Where are semiconductors manufactured?

Before semiconductor components become finished products, they must undergo several manufacturing stages. The “Where” episode reveals how various facilities are responsible for different parts of this manufacturing process, from wafer manufacturing to packaging.

These facilities play a critical role in meeting rising demand for semiconductors. In the age of AI, these chips—particularly semiconductor memory—have become vital for AI applications.

Why do we need semiconductor memory in the AI era?

In the AI era, semiconductor memory plays a key role in ensuring the smooth operation of AI applications. The “Why” episode breaks down the core tasks of AI memory which enable systems to manage ever-growing amounts of data.

With AI driving rapid advancements, the demand for semiconductors continues to fuel significant growth across the entire market.

This surge in demand raises a critical question: just how big is the semiconductor market?

The semiconductor market has grown exponentially over the decades, evolving from a niche industry into a global economic powerhouse. The “How” episode reveals the current value of the market and shows how the industry is poised for even greater expansion in the coming years.

The semiconductor industry’s growth underpins global innovation, and companies such as SK hynix are at the forefront, developing advanced solutions to meet ever-expanding demands.

The Role of Semiconductors Today, Tomorrow, and Beyond

From the pioneering breakthroughs of early visionaries to AI-driven technologies today, semiconductors have transformed the world. SK hynix played a critical role in this evolution, providing memory solutions that power the technologies shaping daily life. As AI and emerging technologies continue to grow, the company remains at the forefront, advancing memory technologies for the future. Explore the full journey of these chips in the Semiconductor 101 series.

<Other articles from this series>

[Semiconductor 101] SK hynix’s Guide to Who’s Who in the Semiconductor Industry

[Semiconductor 101] SK hynix Explains “What’s What” in the Semiconductor World

[Semiconductor 101] When Semiconductors & SK hynix Made Their Mark on the World

[Semiconductor 101] “Where” in the World Are Semiconductors Made and Applied? SK hynix Reveals All

[Semiconductor 101] “Why” Modern Tech Needs Semiconductors & SK hynix’s Key Contributions

[Semiconductor 101] SK hynix Explores How Semiconductors Are Made & How to Build a Career in the Growing Industry

The post Semiconductor 101 Roundup: SK hynix’s Quick Guide to Semiconductors first appeared on SK hynix Newsroom.

Organized by the Korea Semiconductor Industry Association, SEDEX is South Korea’s largest semiconductor exhibition. This year’s event, the 26^th edition of the exhibition, is themed “The Integration of AI Semiconductors and Cutting-Edge Packaging Technology.” Featuring 600 booths, it brings together 250 companies representing the entire semiconductor ecosystem, including semiconductor devices, system semiconductors, equipment and components, materials, facilities, and sensors.

Visitors to SK hynix’s exhibition explore the company’s advanced products

Under the slogan of “Memory, The Heart of AI,” SK hynix is presenting advanced technologies which are driving AI innovation and underlining its AI memory leadership. These include its industry-leading HBM¹, CXL^®2, the next-generation AI memory solution, and PIM³, the next-generation intelligent memory. Additionally, it features server products for high-performance computing in data centers and on-device AI⁴ solutions for smart devices.

¹High Bandwidth Memory (HBM): A high-performance, high-value memory that achieves high bandwidth by connecting multiple DRAM chips using through-silicon via (TSV). This memory significantly boosts data processing speeds compared to traditional DRAM.
²Compute Express Link^® (CXL^®): A next-generation interface designed to efficiently utilize high-performance computing systems by connecting CPU, GPU, memory, and other components.
³Processing-In-Memory (PIM): A technology which enhances memory performance through its processing capabilities, helping to address data transfer bottlenecks in AI and big data applications.
⁴On-Device AI: A technology that enables AI processing directly on the device, improving responsiveness and delivering personalized, real-time services without the need for cloud-based computation.

SK hynix is also sharing its new vision through its 41st anniversary brand film and the Yongin Semiconductor Cluster exhibition as the company looks to leverage 40 years of expertise to strengthen its position as the global no. 1 AI memory provider.

As well as technological innovations, SK hynix is promoting its social value (SV) initiatives such as the Happy Bread bakery project. This initiative is run by Happy Moa, an SK hynix subsidiary that aims to increase employment opportunities for the disabled. The SV zone features various attractions for visitors, including interactive games and exhibits.

During the three-day event, SK hynix also delivered a keynote address on the key role of packaging for AI technologies. To shed light on SK hynix’s activities at SEDEX 2024, the newsroom visited the company’s booth, capturing its technological vision as a total AI memory provider.

Showcasing Global No. 1 AI Memory Technology: From HBM to Server & On-Device AI Solutions

A simulation of virtual GPUs powered by HBM3E

At the center of the exhibition hall, SK hynix has set up a large LED wall that immerses visitors in a virtual AI data center. The wall includes simulations of virtual GPUs powered by the industry-leading HBM3E, offering a realistic experience of an operational data center. Behind it, an exhibition space highlights SK hynix’s flagship AI memory products.

The HBM exhibition zone features a display of the 12-layer HBM3E and a rice-based art installation to highlight the product’s capacity

The main product at the center of the exhibition is HBM, the highest-performing DRAM for AI workloads. On display is the world’s first 12-layer HBM3E, which SK hynix began mass producing in September 2024. A standout feature of the HBM exhibit, which covers the developmental history of the product, is an art installation illustrating the high capacity of the 12-layer HBM3E compared with the world’s first DRAM from 1970. It uses grains of rice to visually convey the dramatic leap in memory technology driven by SK hynix’s technological prowess.

To the left of the HBM exhibition zone, a dedicated space is showcasing next-generation AI memory technologies including PIM and CXL.

The PIM zone features AiM and AiMX products

The PIM section introduces SK hynix’s AiM⁵ product and the AiMX accelerator card. Combining multiple GDDR6-AiM chips, AiMX is a high-speed, low-power, cost-effective memory solution which can perform computational functions—making it optimized for generative AI applications.

⁵Accelerator-in-Memory (AiM): SK hynix’s PIM semiconductor product, which features the GDDR6-AiM.

CMM-DDR5 and CMM-Ax are on display in the CXL zone

In the CXL section, SK hynix is presenting its CMM (CXL Memory Module)-DDR5⁶ which expands system bandwidth by up to 50% and capacity by up to 100% compared to systems equipped with only DDR5. A sample of CMM-Ax⁷, which integrates machine learning and data filtering functions into CXL memory, is also on display. A live demonstration of a system equipped with CMM-Ax highlights its exceptional performance.

⁶CXL Memory Module-DDR5 (CMM-DDR5): A next-gen DDR5 memory module based on CXL that enhances system bandwidth, speed, and performance for AI, cloud, and high-performance computing.
⁷CXL Memory Module-Ax (CMM-Ax): A high-performance memory module optimized for computational workloads, improving AI and data center efficiency.

To the right of the HBM exhibition, SK hynix is displaying AI solutions for servers and on-device applications.

AI solutions for servers, including DDR5 RDIMM, are also being showcased

These include products gaining attention in the high-performance computing (HPC) market such as the world’s first 1cnm DDR5 RDIMM and DDR5 MCR DIMM. The DDR5 products are showcased alongside a lineup of enterprise SSDs (eSSDs) compatible with various server form factors.

The 1cnm DDR5 RDIMM, first revealed at the TSMC Open Innovation Platform (OIP) Ecosystem Forum in September 2024, offers 11% faster operating speeds and over 9% improved power efficiency compared to the previous generation. When applied to data centers, the product is expected to reduce operational costs by up to 30%.

The on-device AI exhibition includes key products such as LPCAMM2 and ZUFS 4.0

In the on-device AI solution section, SK hynix is displaying LPCAMM2, which packages LPDDR5X⁸, and the next-generation mobile NAND solution, ZUFS 4.0⁹. LPCAMM2 provides the performance of two SODIMM¹⁰ DRAM modules in a single package, offering space savings, lower power consumption, and high performance—ideal for on-device AI applications. As the highest-performing product in the industry, ZUFS 4.0 enhances smartphone application launch speeds by approximately 45% over previous versions in long-term usage environments, making it an optimal solution for on-device AI in mobile devices.

In addition to these innovative displays, SK hynix shared its industry expertise through a keynote address by Kangwook Lee, head of Package Development. Held on the second day of the event, Lee’s presentation covered the role of advanced packaging in the AI era.

⁸Low Power Double Data Rate 5X (LPDDR5X): A low-voltage DRAM standard for mobile devices like smartphones and tablets, designed to reduce power consumption.
⁹Zoned Universal Flash Storage (ZUFS): An advanced version of UFS that improves data management efficiency by organizing data into zones, optimizing transfer between the operating system and storage device.
¹⁰Small Outline DIMM (SODIMM): A compact memory module typically used in laptops and desktop PCs.

Sharing a Vision for the Future of the AI Era

A special exhibit introducing the Yongin Semiconductor Cluster and SK hynix’s industrial AI start-up, Gauss Labs

Aside from the main exhibition area, SK hynix is presenting a special exhibit highlighting the Yongin Semiconductor Cluster and its industrial AI start-up, Gauss Labs.

The Yongin Semiconductor Cluster is currently undergoing development in the South Korean city of Yongin. During the exhibition, SK hynix is sharing the goals and vision of the cluster, which aims to become a hub for the AI memory ecosystem and a key component of the company’s long-term growth strategy.

(From left) The Tube T31 and Beetle X31 are shown at the Brand SSD zone

A separate exhibition zone is also being dedicated to brand SSDs, a type of B2C product aimed at general consumers. This zone includes a U.S. promotional video for the portable Beetle X31 SSD,  along with displays of the PCIe SSDs Platinum P41 and P51, as well as the stick-type SSD Tube T31.

A selection of breads prepared by the Happy Bread bakery

The company is also introducing its social value initiative, the Happy Bread bakery. As the bakery brand of Happy Moa under SK hynix, it employs approximately 190 individuals with developmental disabilities with customized jobs across various baking processes. Visitors to the booth can enjoy breads and cookies made by the Happy Bread bakery.

Visitors enjoying taking part in a quiz and playing various games organized by SK hynix

In addition to these activities, SK hynix is engaging visitors through a variety of events and games throughout the exhibition hall. At the entrance of the Brand SSD zone, an interactive “Find the Beetle X31” game highlights the performance of the portable SSD. A dedicated gaming zone is also centered around the company’s memory innovations where visitors can play jumping games, pinball, and layer stacking games. This area also features interactive activities such as a quiz and a raffle with attractive prizes.

At SEDEX 2024, SK hynix is underscoring the critical role of its memory solutions in the AI era. By showcasing its diverse portfolio of cutting-edge products and technologies in one place, SK hynix is solidifying its position as a total AI memory provider.

The post SK hynix Showcases AI Memory Leadership & Shares Future Vision at SEDEX 2024 first appeared on SK hynix Newsroom.

Driving key technologies, intertwined with industries across the world, and an essential part of the AI era—semiconductors are integral to daily life. This fifth episode in the Semiconductor 101 series explores in detail why semiconductors are crucial for shaping modern society. The article also delves into why SK hynix is adapting its approach in the AI era and examines the sweeping influence of the semiconductor industry on the global economy.

Why does the world need semiconductor memory?

Semiconductor memory is indispensable for modern technology, enabling efficient data storage and processing across a variety of devices. To gain a better understanding of semiconductor memory’s importance, let’s picture how its absence would impact some areas of life.

A world without semiconductor memory would be like stepping back in time

Work

Without semiconductor memory, workers would find tasks that once could be finished in a day would take weeks or even months to complete. Computers would be painfully slow and inefficient —making opening and saving files a chore—and offer significantly reduced storage capacity. Multitasking would also be inefficient, with noticeable delays when switching between applications like Word documents and web browsers.

Other essential business applications such as video conferencing, cloud-based software, and messaging tools would be unreliable and costly, hindering collaboration and presenting huge obstacles to remote workers.

Digital Entertainment

People may struggle to fill their evenings and weekends as the entertainment on offer becomes severely limited. Online activities would be time-consuming or almost impossible without semiconductor memory, which enables networking equipment to manage and route data. Social media would be unrecognizable, as users would be unable to instantly share photos and videos. Streaming, gaming, and cloud services would also be unusable without fast and scalable storage solutions. Smartphones would not exist in their current form either, as high-performance and efficient memory is key to the functionality, compact size, and battery life of modern phones.

Banking & Finance

Financial transactions would look very different in a world without semiconductor memory. It would be necessary to make frequent trips to the bank, as app-based transactions would be impossible. This would affect personal finances and the broader economy.

Why is semiconductor memory crucial for the AI era?

In the AI era, semiconductor memory plays a key role in ensuring the smooth operation of AI applications. Today’s AI systems are performing advanced tasks such as image generation and problem solving which require significant data processing capabilities. Moreover, as these AI tools require ever-growing amounts of data to continue their evolution, there is a pressing need to manage this explosion of data. That’s where semiconductor memory comes in.

Semiconductor memory offers several key features which support the smooth operation of AI

High-performance memory is essential for data storage, retrieval, and processing, enabling technologies to keep pace with the rapid rate of data generation. Let’s break down some of the reasons why semiconductor memory is essential in the age of AI.

• Rapid Data Processing: AI systems must rapidly process vast amounts of data to make real-time decisions. Semiconductor memory supports this process by enabling fast data access and storage.
• AI Training Support: AI applications are trained on large datasets to improve their performance. Memory products with high capacity and bandwidth can store and manage these datasets. Moreover, the rapid read/write capabilities of memory solutions can accelerate AI training, making AI systems more efficient.
• Energy Efficiency: AI applications are resource intensive. Semiconductor memory helps reduce power consumption, making them more sustainable. Edge devices¹, such as smart sensors and mobile AI processors, depend on energy-efficient semiconductor memory to perform tasks like real-time image recognition while conserving battery life.

As AI continues to evolve and integrate into various technologies, semiconductor memory remains the key to unlocking its full potential.

Why is HBM an essential product for AI?

Featuring stacked DRAM² chips, High Bandwidth Memory (HBM) is an ultra-fast memory technology which has become crucial in the age of AI. Combining high performance with low-power consumption, HBM can efficiently handle the growing demands of AI systems.

Combining high performance with low-power consumption, HBM is an essential AI memory product

To illustrate some of the benefits of HBM for AI compared to other DRAM products, think of it as an upgraded metro system that reduces passenger wait times at stops. Traditional DRAM chips have a limited number of data paths, akin to station entrances and exits, which are prone to bottlenecks in the data-centric AI era.

Meanwhile, HBM features significantly more data paths which run vertically to support the smooth and rapid passage of data, just like passengers freely passing through a station with numerous entrances and exits. HBM’s ability to minimize delays, or latency, is key in AI systems which need real-time data access to perform tasks such as deep learning.

As touched upon in the previous question, AI systems handle massive datasets and complex computations. HBM supports these tasks by enabling swift and efficient data processing, making it ideal for AI training. For example, SK hynix’s world’s best-performing 12-layer HBM3E offers industry-leading data processing speeds of 1.18 terabytes (TB) per second.

In addition, HBM is optimized for supporting parallel processing in AI systems due to its high bandwidth. As it offers high performance with low-power consumption, HBM also enables AI systems to operate efficiently, particularly in data centers and edge computing devices.

Why does SK hynix need to expand its semiconductor production capacity?

Today, phones instantly recognize faces, autonomous cars cruise down highways, and smart fridges can place orders for food. These developments are largely thanks to technologies such as AI, 5G, and Internet of Things (IoT) devices, which all require high-performance memory products. Moreover, the rapid growth of these and other advanced technologies is further heightening memory demand.

The number of AI users is forecast to grow rapidly, heightening demand for semiconductor memory

Looking at the AI market alone, the number of AI users is projected to grow from almost 255 million in 2023 to around 730 million by 2030³. In response to this changing technological landscape and resultant rising demand for memory, SK hynix is ramping up its production capacity. The company currently operates four production facilities in its home country of South Korea and plans to build two additional domestic facilities in the future, namely:

• The Yongin semiconductor cluster which will boost the company’s production of AI memory
• A fabrication facility (fab) in Cheongju which will produce next-generation DRAM products, including HBM

While it may seem straightforward to simply build new manufacturing facilities to increase production, there are other aspects to consider. For example, there are often challenges associated with commercializing innovations through mass production.

SK hynix is adept in this area, as the company has a long history of transitioning innovations from the R&D stage through to high-volume manufacturing, particularly with DRAM and NAND flash⁴. A recent example of this occurred in March 2024, when the company successfully mass-produced its 8-layer HBM3E through close client collaboration and enhancements in product design.

Why does the semiconductor industry have so much impact on the global economy?

The value of the semiconductor market is greater than the GDP of numerous countries

Semiconductors are essential components in a multitude of electronic devices and are driving technological advancements, making the industry a cornerstone of the global economy. In 2023, the semiconductor market was valued at around 611 billion USD, greater than the GDP of Singapore. However, the full extent of the semiconductor sector’s impact on the global economy can only be understood when looking at some of the industries fueled by these chips.

The consumer electronics market, which is valued at around 950 billion USD, relies heavily on semiconductors. The market’s size is emphasized by the fact that global smartphone subscriptions have surpassed 6.9 billion.

The telecommunications sector, including the expected trillion-dollar 5G market, also depends on semiconductors along with the automotive and healthcare industries. As previously mentioned, semiconductors are also key to advanced technologies such as AI, 5G, and IoT, highlighting their ubiquity in a wide range of high-value technology markets.

While it has been established that the semiconductor sector is a multi-billion-dollar industry which creates immense direct revenue, it also contributes to the economy in other forms. In particular, the sector employs people across the world in roles such as R&D, supply chain management, and manufacturing. By 2030, an estimated 3 million employees will be needed in the sector, highlighting its impact on jobs markets worldwide.

Exploring semiconductor manufacturing in more detail, production is concentrated in East Asian countries such as Taiwan and South Korea. Slowdowns in production which contributed to global chip shortages throughout the years have further highlighted the sector’s strategic importance to numerous industries across the world.

Looking ahead, the semiconductor industry’s impact on the global economy will only continue to grow as the sector itself, and others which rely on chips, expand in the future.

¹Edge: The boundary of a network where data is generated and processed locally on devices or sensors, rather than being transmitted to a centralized data center.
²Dynamic Random-Access Memory (DRAM): A type of short-term computer memory that stores data temporarily while a device is on, losing information when the power is turned off.
³Statista, “Generative artificial intelligence (AI)” report (2024)
⁴NAND Flash: A long-term storage technology that retains data even when the power is off, commonly used in USB drives and memory cards.

The final episode of the Semiconductor 101 series will explore “how” semiconductors are made and provide insights on launching and advancing a career in this dynamic industry.

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[Semiconductor 101] SK hynix Explains “What’s What” in the Semiconductor World

[Semiconductor 101] When Semiconductors & SK hynix Made Their Mark on the World

[Semiconductor 101] “Where” in the World Are Semiconductors Made and Applied? SK hynix Reveals All

The post [Semiconductor 101] “Why” Modern Tech Needs Semiconductors & SK hynix’s Key Contributions first appeared on SK hynix Newsroom.

SK hynix is showcasing its leading AI and data center memory products at the 2024 Open Compute Project (OCP) Global Summit held October 15–17 in San Jose, California. The annual summit brings together industry leaders to discuss advancements in open source hardware and data center technologies. This year, the event’s theme is “From Ideas to Impact,” which aims to foster the realization of theoretical concepts into real-world technologies.

SK hynix’s booth at the 2024 OCP Global Summit

In addition to presenting its advanced memory products at the summit, SK hynix is also strengthening key industry partnerships and sharing its AI memory expertise through insightful presentations. This year, the company is holding eight sessions—up from five in 2023—on topics including HBM¹ and CMS².

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Memory Solution (CMS): A memory solution optimized for AI, HPC, and data centers, enhancing speed, efficiency, and scalability for compute-heavy workloads.

Displays & Demonstrations at the Booth: Transforming AI & Data Centers

Visitors to SK hynix’s booth can see a range of the company’s cutting-edge AI and data center solutions and view demonstrations with high-performance customer systems.

SK hynix’s groundbreaking AI and data center products on display

Among the products being demonstrated is CMM-Ax³, formerly known as CMS 2.0, which was shown under its new name for the first time. For the demonstration, SK hynix is highlighting the product’s role in next-generation compute memory for AI infrastructure, particularly for multi-modal applications. Meanwhile, a heterogeneous memory management solution involving CMM (CXL Memory Module)-DDR5⁴ and HMSDK⁵ is also being demonstrated as well as Niagara 2.0⁶, which is illustrating its efficient utilization of pooled memory resources. Another demonstration is highlighting the computational storage drive’s (CSD) AI storage capabilities for large-scale training systems.

³CXL Memory Module-Ax (CMM-Ax): A high-performance memory module optimized for computational workloads, improving AI and data center efficiency.
⁴CXL Memory Module-DDR5 (CMM-DDR5): A next-gen DDR5 memory module based on CXL that enhances system bandwidth, speed, and performance for AI, cloud, and high-performance computing.
⁵Heterogeneous Memory Software Development Kit (HMSDK): A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.
⁶Niagara 2.0: An integrated HW/SW solution for pooled memory that allows multiple hosts (CPUs and GPUs) to efficiently share large memory pools to minimize unused or underutilized memory known as stranded memory. By supporting optimal data placement through hot and cold data detection, it can significantly improve system performance.

SK hynix is showcasing CXL-based solutions including CMM-Ax and Niagara 2.0

In addition, a live demonstration of the GDDR6-AiM⁷-based accelerator card AiMX is being held using Meta’s latest large language model (LLM), Llama3 70B, which has 70 billion parameters. The demonstration shows AiMX’s capability to tackle industry challenges. For example, data centers’ LLM services improve GPU efficiency by simultaneously processing requests from multiple users. However, as the length of the generated token increases, the computation of the attention layer⁸ increases, lowering GPU efficiency. Through the demonstration, AiMX shows it can overcome this issue by handling large amounts of data while offering greater efficiency and lower power consumption compared to the latest accelerators.

⁷Accelerator-in-Memory (AiM): SK hynix’s PIM semiconductor product. PIM is next-generation technology that adds computational functions to memory semiconductors, solving the data transfer bottleneck in AI and big data processing fields.
⁸Attention layer: A mechanism which allows a model to determine the importance of input data to focus on more relevant information.

The AiMX card is being demonstrated with Meta’s latest LLM, Llama3 70B

The company also displayed a range of its industry-leading AI memory and data center products. HBM3E is shown along with the NVIDIA H200 Tensor Core GPU and NVIDIA GB200 Grace Blackwell Superchip. The booth also features SK hynix’s DDR5 RDIMM and MCR DIMM server DRAM, as well as enterprise SSDs (eSSDs), with Supermicro servers. The DDR5 products on display include the world’s first DDR5 DRAM built using the 1c node, the sixth generation of the 10nm process technology. Designed to meet the growing computational and energy demands of AI-driven data centers, the 16 Gb 1c DDR5 offers improved performance and energy efficiency from the previous generation. Additionally, SK hynix unveiled the 1bnm 96 GB DDR5 which can reach speeds of up to 7,200 megabits per second (Mbps), making it ideal for supporting massive data flows in data centers.

HBM3E is presented alongside NVIDIA’s H200 and GB200, while DDR5 RDIMM and MCR DIMM products are shown with Supermicro servers

In the SSD section, the Gen5 eSSDs PS1010 and PS1030 and the Gen4 PE9010 are among those on display. Offering ultra-fast read/write speeds, these SSD solutions are vital for accelerating AI training and inference in large-scale environments. Through all these innovations, SK hynix is continuing to lead the way in AI memory and storage solutions, fueling the future of AI and transforming data center operations.

Gen5 eSSDs showcased at the summit

Expanded Presentation Sessions: Sharing AI Memory Expertise

Reflecting SK hynix’s growing influence as the leading AI memory provider, the company is holding eight insightful sessions—three more than in 2023—on the future of AI memory solutions.

SK hynix is sharing its industry expertise through eight presentations

• Youngpyo Joo, head of Software Solution: Joo discussed how AI-driven technological advancements are reshaping computing architecture, focusing on innovations such as CXL^®9-based memory and computational memory solutions for AI workloads.
• Technical Leader Jungmin Choi, Composable System: In his talk, Choi explored how memory disaggregation can improve system efficiency.
• Technical Leader Honggyu Kim, System SW: Kim explained how SK hynix’s HMSDK solution optimizes memory pooling and sharing in AI workloads, improving performance and reducing network congestion.
• Technical Leader Younsoo Kim, DRAM Technology Planning: Kim addressed the future of HBM memory and its pivotal role in AI applications in his presentation.
• Euicheol Lim, head of Solution Advanced Technology (Solution AT): Lim discussed the role of SK hynix’s AiMX card to reduce operational costs in LLM processing in data centers and on-device services.
• Technical Leader Kevin Tang and Team Leader Jongryool Kim, AI System Infra: Tang and Kim delivered a joint presentation about improving LLM training efficiency and scalability through checkpoint¹⁰
• Hoshik Kim, head of SOLAB: As part of a panel discussion, Kim discussed various issues, solutions, and visions that near-data computing¹¹ needs to address for application to various real systems.
• Technical Leader Myoungseo Kim, AI Open Innovation: Kim will deliver the final talk with Vikrant Soman, Solution Architect at Uber, and Jackrabbit Labs CTO Grant Mackey on CMS composable memory architecture and the need for scalable, interoperable memory solutions. The presentation will reveal the results of SK hynix’s CXL pooled memory prototype integration with Jackrabbit Labs’ open source cluster orchestration software to address the pain point of stranded memory in the Uber Data Center Kubernetes Cluster environment.

⁹Compute Express Link (CXL): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
¹⁰Checkpoint: A technology that stores model parameters and related key data at a specific point during the learning (training) process, enabling the learning process to restart from the saved point in case of a system failure.
¹¹Near-data computing: A computing method aimed at addressing the bottleneck issue between the memory and processor, a limitation of the von Neumann architecture. It delivers only refined data processed by memory to the processor to minimize the movement of data within the system, improving performance and cost efficiency.

Shaping the Future: Advancing AI Memory & Data Center Innovation

At the 2024 OCP Global Summit, SK hynix is reinforcing its industry leadership by not only showcasing its advanced AI memory and data center solutions but also sharing its expertise. Looking ahead, the company is dedicated to pioneering breakthroughs that will define the next generation of AI and data center technologies.

The post SK hynix at the 2024 OCP Global Summit: Leading the Future of AI & Data Center Memory Solutions first appeared on SK hynix Newsroom.

SK hynix has embarked on a 41-year journey to become a leader in HBM and AI memory

The Rise of SK hynix & Its HBM Propelled by the AI Era

SK hynix’s rise to become the leader in the global memory market has been driven by the growth of the AI industry. Since the emergence of generative AI in 2022, a wide range of products and services have adopted AI as the technology has rapidly evolved. This has led to a surge in demand for high-performance memory, which is essential for processing massive datasets and enabling fast training and inference¹. In response to this demand, SK hynix is providing advanced memory products and thereby playing a defining role in the development of the AI industry.

¹AI inference: The process of running live data through a trained AI model to make a prediction or solve a task.

SK hynix has continually advanced its HBM lineup to reach new standards in performance

SK hynix solidified its capabilities even before the AI boom by focusing on developing the early generations of HBM, a high-bandwidth memory which rapidly transmits large volumes of data. The company then gained market leadership and expanded its influence with the third-generation HBM, HBM2E. HBM3, the successor to HBM2E which is optimized for AI and high-performance computing (HPC), also drew significant attention. Most notably, the company established itself as a key partner in the AI and data center markets by supplying HBM products to NVIDIA. Around this time, SK hynix achieved a 50% market share in the HBM sector to strengthen its HBM leadership.

Moving into 2024, SK hynix has maintained its prominence in the AI memory market. The company began supplying the world’s best-performing 8-layer HBM3E, first developed in 2023, to leading global tech giants in March 2024. Offering maximum data processing speeds of around 1.2 terabytes (TB) per second, HBM3E helped SK hynix further bolster its status as the global no. 1 AI memory provider.

Next-Generation HBM: Utilizing 15 Years of HBM Technology Know-How

SK hynix’s HBM success story can be traced back to 2009. This was the year when the company began full-scale product development after discovering that TSV² and WLP³ technologies could break memory performance barriers. Four years later, the company introduced the first-generation HBM, incorporating these TSV and WLP technologies. Although HBM was hailed as an innovative memory solution, it did not receive an explosive market response because the HPC sector had not yet sufficiently matured enough for widespread HBM adoption.

²Through-silicon via (TSV): A technology that drills thousands of microscopic holes in the DRAM chip and connects the upper and lower chip layers with electrodes that vertically penetrate through these holes.
³Wafer-level packaging (WLP): A method that is a step beyond the conventional package, where wafers are cut into individual chips and then packaged. In WLP, the packaging is completed at the wafer level, producing finished products.

Building on its 15-year HBM history, SK hynix is well-placed to develop next-generation HBM products

Despite this, SK hynix pressed forward, focusing on developing the next generation of HBM and pursuing the goal of achieving the “highest performance.” During this period, the company applied MR-MUF⁴ technology, known for its high thermal dissipation and production efficiency, to HBM2E which changed the market landscape. Building upon this, SK hynix developed Advanced MR-MUF technology, which excelled in thin chip stacking, thermal management, and productivity, and applied it to both HBM3 and HBM3E. Leveraging this technology, SK hynix set a series of industry-best performance records, successfully mass-producing the 12-layer HBM3 (24 GB) in 2023 and the 12-layer HBM3E (36 GB) in 2024.

⁴Mass reflow-molded underfill (MR-MUF): A technology that ensures secure and reliable connections in densely stacked chip assemblies by melting the bumps between stacked chips.

These achievements were driven by a strategy that precisely aligned with the rise of the AI revolution. SK hynix launched its AI memory products at the right time, fully meeting market demands. This was made possible through 15 years of accumulated technological expertise based on research and development, unwavering employee trust in the company’s know-how, and forward-looking strategic investments.

SK hynix has continued taking strategic steps to strengthen its AI leadership in 2024. In April, the company signed an investment agreement to build an advanced packaging production facility in the U.S. state of Indiana which will produce next-generation HBM and AI memory. In the same month, SK hynix entered a technology agreement with TSMC. The deal aims to establish a collaborative three-way framework between the customer, foundry, and memory provider to overcome technological limits and secure an advantage in the AI market.

Beyond HBM: Relentless Innovation & Strengthening the AI Memory Lineup

SK hynix’s pursuits and innovations are unfolding across all areas of memory. The company has established its “memory-centric”⁵ vision and is developing a wide range of memory solutions based on over 40 years of accumulated technological knowledge. In 2024, SK hynix is making concerted efforts to strengthen its lineup with PIM, CXL, and AI SSD products to mark the first year of its renaissance.

⁵Memory-centric: An environment where memory semiconductors play the central role in ICT devices.

SK hynix’s AI memory lineup includes PIM, CXL, and AI SSD products

SK hynix is developing its lineup of processing-in-memory (PIM), an intelligent semiconductor memory which breaks the boundary between storage and computation. PIM, which features a processor for computational functions, is capable of processing and delivering the data required for AI computation. In terms of PIM-based products, SK hynix has launched the GDDR6-Accelerator-in-Memory (AiM) and last year introduced the accelerator card AiMX, an AiM-based accelerator that boosts performance by connecting multiple AiM units. In 2024, the company drew attention by unveiling a 32 GB version of AiMX which offers double the capacity of its predecessor.

SK hynix is also actively investing in Compute Express Link (CXL), a technology that integrates different interfaces such as those for CPUs and memory, to expand memory bandwidth and capacity. In May 2024, the company introduced the CXL Memory Module (CMM)-DDR5 which offers 50% greater bandwidth and double the capacity compared to standard DDR5. Then in September, SK hynix integrated key features of its CXL-optimized software HMSDK⁶ into the open-source operating system Linux, setting a new standard for the use of CXL technology.

⁶Heterogeneous Memory Software Development Kit (HMSDK): SK hynix’s proprietary heterogeneous memory software development tool. Enhances the performance of heterogeneous memory systems, including CXL memory, through effective memory control.

Ultra-high-speed, high-capacity enterprise SSDs (eSSDs) for AI servers and data centers are another area of focus for SK hynix. A prime example is the 60 TB Quad Level Cell (QLC) eSSD, co-developed with the company’s U.S. subsidiary Solidigm. This product stores 4 bits per cell while maintaining low power consumption. Looking ahead, the company is planning to develop a 300 TB eSSD and launch the product in 2025.

The company also offers a robust lineup for on-device AI. SK hynix developed the low-power DRAM, LPDDR5T⁷, in January 2023 to enhance the performance of AI smartphones. In November of the same year, the company unveiled the modularized version of the LPDDR5X, LPCAMM2, which is expected to deliver excellent performance in AI desktops and laptops. SK hynix has also completed the development of the high-performance client SSD (cSSD), PCB01, for AI PCs and the mobile NAND solution for AI, Zoned UFS (ZUFS) 4.0.

⁷Low Power Double Data Rate 5 Turbo (LPDDR5T): Low-power DRAM for mobile devices, including smartphones and tablets, aimed at minimizing power consumption and featuring low voltage operation. LPDDR5T is an upgraded product of the 7th generation LPDDR5X and will be succeeded by the 8th generation LPDDR6.

Shaping the Future of Total AI Memory

Today, AI is being used to write reports, generate images, and create various types of content. In healthcare, AI aids in making diagnoses, while in education AI serves as an assistant for teachers. These are just a small selection of the current applications of AI, and the possibilities for the future are expected to be almost limitless as the technology continues to advance.

SK hynix plans to develop customized AI memory and emerging memory products

At the center of this technological revolution is AI memory. Various AI memory solutions, such as HBM, PIM, CXL, and SSDs, transmit large volumes of data quickly with high bandwidth or send only the processed results directly to the processor, minimizing bottlenecks and enhancing AI learning and inference performance. Furthermore, these technologies improve the energy efficiency of AI systems, contributing to the establishment of more sustainable AI infrastructure. These advanced AI memory technologies are expected to be applied across a wider range of industries such as the automotive and healthcare sectors, enabling faster and more efficient AI services.

To further AI’s development, SK hynix is continuously overcoming technological limitations. The company is focused on developing custom AI memory optimized for each customer in line with the growing diversification of AI services. Moreover, SK hynix is also working on next-generation emerging memory, which is based on new structures and principles as well as innovative components, such as ReRAM⁸, MRAM⁹, and PCM¹⁰. By relentlessly investing in technology development, SK hynix aims to secure differentiated competitiveness with advanced technologies and establish a leading position in future markets.

⁸Resistive RAM (ReRAM): A type of emerging memory with a simple structure containing a filament in which data is stored by applying voltage to the filament. It features a large data storage capacity through process miniaturization and low power consumption.
⁹Magnetic Random Access Memory (MRAM): A type of emerging memory which utilizes both charge and spin, with resistance in the device changing based on the direction of the spin.
¹⁰Phase-Change Memory (PCM): Semiconductor memory which stores data by utilizing the phase change of a specific material (phase-change memory). It combines the benefits of non-volatile flash memory, which retains data even when powered off, with the rapid processing speeds of DRAM.

The semiconductor market itself is poised for significant growth. The World Semiconductor Trade Statistics (WSTS) forecasts that the semiconductor market will expand by 16% year-on-year in 2024. In particular, the semiconductor memory sector is predicted to grow by an impressive 76.8% as demand surges for AI memory such as HBM.

Standing at the forefront of the huge AI wave, SK hynix is preparing for another leap forward by building on its past achievements. As SK hynix celebrates its 41st anniversary, the company aims to maintain HBM leadership while securing dominance in the next-generation semiconductor market to stand alone in an era where its products become “the heart of AI.”

The post [SK hynix’s 41st Anniversary] “Celebrating 40+1” … Harnessing 40 Years of Technological Expertise to Stand Alone as the Global No. 1 AI Memory Provider first appeared on SK hynix Newsroom.