SK hynix’s booth at HPE Discover 2024

SK hynix has returned to Las Vegas to showcase its leading AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise’s (HPE) annual technology conference. Held from June 17–20, HPE Discover 2024 features a packed schedule with more than 150 live demonstrations, as well as technical sessions, exhibitions, and more. This year, attendees can also benefit from three new curated programs on edge computing and networking, hybrid cloud technology, and AI.

Under the slogan “Memory, The Power of AI,” SK hynix is displaying its latest memory solutions at the event including those supplied to HPE. The company is also taking advantage of the numerous networking opportunities to strengthen its relationship with the host company and its other partners.

The World’s Leading Memory Solutions Driving AI

SK hynix’s booth at HPE Discover 2024 consists of three product sections and a demonstration zone which showcase the unprecedented capabilities of its AI memory solutions.

SK hynix’s AI memory solutions on display including its HBM3E and CMM-DDR5

The first section features the company’s groundbreaking memory solutions for AI, including HBM¹ solutions. In particular, the industry-leading HBM3E has emerged as a core product to meet the growing demands of AI systems due to its exceptional processing speed, capacity, and heat dissipation. A key solution from the company’s CXL^®2 lineup, CXL Memory Module-DDR5³ (CMM-DDR5), is also on display in this section. In the AI era where high performance and capacity are vital, CMM-DDR5 has gained attention for its ability to expand system bandwidth by up to 50% and capacity by up to 100% compared to systems only equipped with DDR5 DRAM.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
³Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.

SK hynix’s server DRAM products are optimized for AI computing

In the second section of the booth, SK hynix is presenting its leading server DRAM solutions. The company’s power-efficient and rapid DDR5 RDIMM⁴ and MCR DIMM⁵ are featured, showcasing their ability to support AI computing in high-performance servers. Equipped with 1bnm, the fifth generation of the 10 nm process technology, DDR5 RDIMM can reach speeds of up to 6,400 megabits per second (Mbps), while MCR DIMM boasts speeds of up to 8,800 Mbps. Additionally, SK hynix is displaying its LPCAMM2⁶, a module solution that is increasingly being applied in AI PCs due to its low-power and high-performance features.

⁴Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁵Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁶Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.

SK hynix presents its SSD portfolio including products supplied to HPE

Visitors could also see some of SK hynix’s latest enterprise SSDs (eSSD) in the third section of the booth. These include the PCle Gen5-based PS1010 and PS1030, which are recognized to be ideal for AI, big data, and machine learning applications due to their rapid sequential read speeds. Within the same section, SK hynix’s U.S. subsidiary Solidigm is presenting its QLC⁷-based eSSDs such as D5-P5430, D5-P5316, and D5-P5336. Offering industry-leading performance and massive capacity, these products will serve as optimal solutions for various customers that require immense storage space.

⁷Quadruple Level Cell (QLC): A form of NAND flash memory that can store up to 4 bits of data per memory cell.

Sharing the Latest Innovations and Trends in AI Memory

SK hynix hosted sessions on how its memory solutions are fueling innovation in AI

During the presentation sessions at the conference, SK hynix held talks that focused on how the company’s memory products are fueling innovation in AI. On June 18, Technical Leader Brian Yoon of DRAM Technology Planning at SK hynix America provided an overview of CXL and discussed enabling memory expansion with CMM-DDR5. Yoon also touched on the features of HMSDK⁸, a software that supports CMM-DDR5. Hours later, Director Santosh Kumar of NAND Technology Planning at SK hynix America and Technical Leader Seonjae Kim of SSD Enablement at SK hynix covered SSD technology trends and how SK hynix and Solidigm can meet future SSD demands. During the talk, the pair shared how the companies’ SSD products are optimized for AI storage and modern data center workloads.

⁸Heterogeneous Memory Software Development Kit (HMSDK): A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.

Embracing the Memory Community to Power the Future of AI

At HPE Discover 2024, SK hynix has underlined how it is spearheading innovations in the AI memory sector. The event is not only a chance for the company to showcase its industry-leading solutions, but also a time to strengthen its partnership with HPE and other industry players.

“SK hynix is maintaining a close partnership with HPE based on its industry-leading memory technology, including securing contracts to supply high-capacity DDR5 and 16-channel Gen5 eSSD products,” said Vice President Myoungsoo Park, head of US/EU Sales at SK hynix. “We will continue to strengthen our cooperation with global partners to further solidify our technological leadership as the world’s number one AI memory provider.”

The post SK hynix Showcases Power of Its Groundbreaking AI Memory Solutions at HPE Discover 2024 first appeared on SK hynix Newsroom.

SK hynix presented its next-generation memory technologies and products at HPE Discover 2023, an IT conference held this year in Las Vegas between June 20-22.

Figure 1. SK hynix’s exhibition booth at HPE Discover 2023

Held annually by the American ICT company Hewlett Packard Enterprise (HPE), HPE Discover brings together the company’s customers and partners along with industry experts to explore data center trends and the latest technologies such as memory solutions. SK hynix was among the exhibitors at the show as the company further strengthened its partnership with HPE.

Under the slogan “Elevate Your Edge With Memory Performance,” SK hynix showcased its industry-leading memory solutions for data centers. These included its PS1010 E3.S, a high-performance PCIe¹ Gen5-based eSSD, and DDR5 RDIMM, a DRAM module for servers applied with a 1bnm process. The capabilities of both products were highlighted during a joint promotion with HPE in which they were applied to Gen11, the host company’s latest server range.

¹Peripheral Component Interconnect Express (PCle): A serial-structured, high-speed I/O interface used on the motherboard of digital devices.

Figure 2. SK hynix and Solidigm display their advanced storage and memory solutions at HPE Discover 2023

Visitors could also see SK hynix’s lineup of advanced memory solutions including: HBM3² , a memory product that has been highlighted recently due to the rise of generative AI; CXL³ memory, an interconnect technology that enables efficient scaling of memory bandwidth and capacity; and PIM⁴ , a next-generation memory chip with computing capabilities. SK hynix’s subsidiary company, Solidigm, also showcased its portfolio of products including its PCIe Gen4 NVMe⁵ -based SSD.

²High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
³Compute Express Link (CXL): A next-generation interconnect protocol based on PCIe that efficiently bolsters high-performance computing systems.
⁴Processing-In-Memory (PIM): A next-generation technology that adds computational capabilities to semiconductor memories to solve congestions in data movement found in AI and big data processing.
⁵Non-Volatile Memory express (NVMe): A communication protocol for storage devices based on PCIe interface. It can achieve speeds of up to six times greater than traditional SATA interfaces, making it suitable for ultra-fast, large data processing.

Figure 3. Vice President Eui-cheol Lim of SK hynix’s Solution Development division explains how PIM semiconductors will increase the efficiency of GPTs in the future

SK hynix also held a session where its members spoke about the role and vision of memory solutions in the future. For his part of the presentation, Vice President Eui-cheol Lim of the Solution Development division gave a talk on how PIM semiconductors can increase the efficiency of Generative Pre-trained Transformers (GPTs). Technical Leaders Tai-jin Choi and Santosh Kumar of SK hynix America presented about trends in SSD storage technology for next-generation servers, and their colleague Technical Leader Yoosung Lee presented on how DDR5 is set to be the standard for next-generation DRAMs in the era of big data. All three presentations emphasized how memory solutions are essential in responding to the rapidly changing IT environment.

“Going forward, we plan to not only strengthen our partnerships with key customers but also showcase our unprecedented, next-generation memory solutions,” said Seok Kim, the head of GSM Strategy at SK hynix.

The post SK hynix Showcases Data Center Memory Solutions at HPE Discover 2023 first appeared on SK hynix Newsroom.