• SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology
• SK hynix will adopt TSMC’s cutting-edge foundry process to advance HBM4 performance
• Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI applications

Seoul, April 19, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative.

SK hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology. The collaboration is also expected to enable breakthroughs in memory performance through trilateral collaboration between product design, foundry, and memory provider.

The two companies will first focus on improving the performance of the base die that is mounted at the very bottom of the HBM package. HBM is made by stacking a core DRAM die on top of a base die that features TSV¹ technology, and vertically connecting a fixed number of layers in the DRAM stack to the core die with TSV into an HBM package. The base die located at the bottom is connected to the GPU, which controls the HBM.

¹TSV (Through Silicon Via): An interconnect technology that links upper and lower chips with an electrode that vertically passes through the base logic chip and DRAM chips. There can be thousands of pass-through TSVs depending on the chip design

SK hynix has used a proprietary technology to make base dies up to HBM3E, but plans to adopt TSMC’s advanced logic process for HBM4’s base die so additional functionality can be packed into limited space. That also helps SK hynix produce customized HBM that meets a wide range of customer demand for performance and power efficiency.

SK hynix and TSMC also agreed to collaborate to optimize the integration of SK hynix’s HBM and TSMC’s CoWoS^®2 technology, while cooperating in responding to common customers’ requests related to HBM.

²CoWoS (Chip on Wafer on Substrate): A TSMC proprietary packaging process that connects GPU/xPU, a logic chip, and HBM, on a special substrate called an interposer. It is also called 2.5D packaging as the logic chip and the vertically stacked(3D) HBM are integrated into one module which is placed on a horizontal (2D) package substrate

“We expect a strong partnership with TSMC to help accelerate our efforts for open collaboration with our customers and develop the industry’s best-performing HBM4,” said Justin Kim, President and the Head of AI Infra, at SK hynix. “With this cooperation in place, we will strengthen our market leadership as the total AI memory provider further by beefing up competitiveness in the space of the custom memory platform.”

“TSMC and SK hynix have already established a strong partnership over the years. We’ve worked together in integrating the most advanced logic and state-of-the art HBM in providing the world’s leading AI solutions,” said Dr. Kevin Zhang, Senior Vice President of TSMC’s Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer. “Looking ahead to the next-generation HBM4, we’re confident that we will continue to work closely in delivering the best-integrated solutions to unlock new AI innovations for our common customers.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix Partners with TSMC to Strengthen HBM Technological Leadership first appeared on SK hynix Newsroom.

The signing event, which was held virtually a day earlier, was attended by Dong-sub Kim, President of SK hynix’s Communication & External Affairs and Youn-wook Kim, Vice President of SK hynix’s Corporate Sustainability Management. From Microsoft, Andrea Della Matea, president of the Asia Pacific region and Ji-eun Lee, CEO of Microsoft Korea, attended.

According to the MOU, SK hynix and Microsoft will cooperate in observing changes in biodiversity of the Anseongcheon with the help of the technology and providing an opportunity to local young talent to grow into experts in environment and data.

Yongin semiconductor cluster project, which SK hynix has been pursuing with an aim of enhancing the competitiveness of the domestic industry by having around 50 local and foreign partner companies in the same space, is currently under reviews for government approvals and expected to start operation in 2025. Once started, the cluster is likely to discharge a lot of purified water to the Anseongcheon, leading to an increase in the volume of the stream and thus positive results such as a more active ecosystem as a result of a rise in the quantity of prey.

The two companies will observe and record changes in the aquatic ecosystem using Microsoft’s Azure AI to help scientifically prove that the changes are taking place in a healthy environment where various stakeholders also participate.

Collecting raw data needed for the AI analysis will be done by residents of the local community and SK hynix employees. When these participants save the ecosystem data they collected using IT devices such as smartphones on Microsoft’s cloud system Azure, AI will identify and classify them. The collection of data accumulated through repeat of this process will be provided to experts who will lead the study on biodiversity and the outcome will be made public.

The collaboration between the two companies will also provide the young generation of the local community an opportunity to grow into experts in data analysis and environment through a training program by Microsoft and a cooperation with environment experts. The program will also help the young talent to find jobs in the relevant field.

Dong-sub Kim, President of SK hynix’s Communication & External Affairs, said, “We share a common goal of addressing social issues and enhancing ESG management by taking advantage of the IT capabilities for this collaboration with Microsoft. We will continue our efforts to cooperate and communicate with various stakeholders in a parent way to make the Yongin semiconductor cluster a healthier place for coexistence.”

Andrea Della Matea, President of Microsoft Asia Pacific, said, “I am proud to see this collaboration between Microsoft and SK hynix as we share a common goal of saving the Earth, the most finite resources we have. Korea has been at the forefront of the green growth initiatives powered by technology and data that have resulted in tangible outcome such as job creation, energy security as well as a reduction in greenhouse gas emissions. It is our role, as an industry leader, to support with technology, competitiveness and resources to help build a better regional foundation. This is the purpose-driven technology based on our mission of cooperating for public interest and making the world fairer, more environment-friendly and sustainable.”

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SK hynix Inc. (or ‘the Company’, www.skhynix.com) today signed a memorandum of understanding (“MOU”) with the Dalian Municipal People’s Government of China and the Administrative Committee of Jinpu New District, Dalian via video link, under which both parties will jointly collaborate on SK hynix’s acquisition of Intel’s Dalian semiconductor fabrication plant (“Dalian Fab”) as well as SK hynix’s future investments in Dalian. The MOU signing ceremony was attended by Jin Guowei, Vice Mayor of the Dalian Municipal People’s Government, and Noh Jongwon, Executive Vice President at SK hynix.

Representatives of SK hynix Inc., the Dalian Municipal People’s
Government of China and the Administrative Committee of Jinpu New District,
Dalian signing the MOU via video link People holding MOU from left to right: Noh Jongwon,
Executive Vice President at SK hynix; Lv Dongsheng, Deputy Director of the Administrative Committee of
Jinpu New District, Dalian ; Jin Guowei, Vice Mayor of the Dalian Municipal People’s Government.

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Speaking at the signing ceremony, Dalian Vice Mayor Mr. Jin Guowei commented, “In recent years, the IT industry in Dalian has witnessed a strong development momentum, becoming one of the city’s fastest-growing and most dynamic pillar industries. As Dalian develops its high-tech industry, we see partnerships with reputed domestic and foreign companies as an important approach to lift the industry’s development to a higher level. This MOU signifies that the partnership between Dalian and SK hynix has entered a new stage of close cooperation. We will strengthen support for SK hynix’s project development in Dalian to ensure its smooth transition, while at the same time, continue to drive technological innovation, cultivate and grow industrial clusters, and enhance the overall scale and core competitiveness of Dalian’s IT industry.”

Noh Jongwon, Executive Vice President at SK hynix said, “With a deep-rooted foothold in the Chinese market for over 17 years, SK hynix has always pursued co-development and co-prosperity with the China market. We have been continuously expanding our tangible support and commitments in areas like human resources, technology and investment, as we look to help develop and strengthen local IT ecosystem. The signing of this milestone MOU marks the further deepening of the partnership between Dalian and SK hynix, which we hope will advance industrial innovation capacity in Dalian. As a partner, SK hynix will do its best to fulfill its commitments and explore potential collaborations with the Dalian government.”

Last year, SK hynix announced that it had signed an agreement to acquire Intel’s NAND memory and storage business for 9 billion USD, which includes Intel’s NAND SSD business, NAND component and wafer business, and the Dalian Fab in the city’s Jinpu New District.

In accordance with the MOU, SK hynix will continue to invest in the Dalian Fab, while the Dalian government will provide support for SK hynix’s acquisition of the Dalian Fab. In addition, SK hynix will seek to broaden its collaboration scope with the Dalian government to drive sustainable urban development, contribute to regional economic prosperity and help the city develop and grow its IT sector. The MOU will help elevate Dalian’s industrial innovation capacity and support further development of local IT industry.

Since it established its first fabrication plant in China in 2004, SK hynix has been actively expanding its investment in China. As of 2020, the company had made a cumulative investment of more than 20 billion USD in the country. SK hynix is committed to its DBL (Double Bottom Line) business principle which pursues both economic and social value, and it looks to address wider social issues such as healthcare, education and environment, under the guidance of its CSR strategy. In addition, with its ongoing business expansion in China, SK hynix also prioritizes the recruitment and training of local talent in China, currently employing more than 7,000 Chinese nationals and creating ongoing employment opportunities. The company is committed to bringing more employment opportunities to Dalian and fostering more talent through new project investments in the region.

SK hynix aims to further expand its deep-rooted local presence, and will actively work with the forces in government, business, academic and society to reinvent a better future for China’s IT industry and contribute to a more prosperous future for the global IT sector.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Jaehwan Kevin Kim
E-Mail: global_newsroom@skhynix.com

Technical Leader
Sejin Julia Yoo
E-Mail: global_newsroom@skhynix.com

Technical Leader
Eun Suk Yixi Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix signs MOU with government of Dalian, China, seeking to continue supporting future development of Chinese IT industry and prosperity of regional economies first appeared on SK hynix Newsroom.

hynix Semiconductor Inc. (www.hynix.com) and ProMOS Technologies Inc. today announced the signing of a memorandum of understanding (MOU) to initiate a long term strategic alliance in technology licensing, foundry service and development of new generation memory production processes.

The new alliance will represent nearly one quarter of the world DRAM output. According to the MOU, hynix licenses to ProMOS certain proprietary technology for DRAM stack process, while ProMOS offers to hynix its 300mm fab capacity. hynix and ProMOS also plan to collaborate in the development of next-generation process technologies.

The world’s third largest DRAM maker, hynix excels in the development, sales, marketing and distribution of high quality semiconductor products, including DRAM, SRAM, Flash Memory, and system IC devices, making it an industry leader, and valuable alliance partner. ProMOS, renowned for its manufacturing quality and high wafer output yield rate, plans on building a second 300mm fab in Taiwan, to be integrated into its existing 300mm and 200mm fabs. In addition to technology licensing and capacity sharing, hynix and ProMOS have left open the possibility of more mutually beneficial projects in the future.

“We are happy to join forces with ProMOS in sharing its premium technology capability and manufacturing competence,” said C.S. Oh, Senior Vice President and Memory COO of hynix Semiconductor, “This partnership will further enhance our DRAM manufacturing capacity, allowing us to quickly deliver high-quality products to the market.” “hynix has been one of the world’s first-rate providers of DRAM. Its success comes from outstanding production efficiency, sustainable R & D investment, and a highly dedicated management team with a clear focus on semiconductors,” said Min-liang Chen, President of ProMOS. “The alliance forged between hynix and ProMOS advances both parties into a new phase of viable long-term growth. We envision enormous benefits to both our clients and ourselves.”

The post hynix, ProMOS Sign MOU for Long-term Strategic Alliance first appeared on SK hynix Newsroom.

On September 26, 2002 hynix Semiconductor Inc. announced that it had signed an MOU with BOE (BOE Technology Group) of China regarding the sale of Hydis, the TFT-LCD business unit.

hynix will transfer tangible & intangible fixed assets, current assets, operating liabilities and the LCD factory building and related structures still owned by hynix to BOE. The cash payment is US$380 million, of which amount may be increased upon a final due diligence of current assets and current liabilities. To this end, hynix, Hydis and BOE are scheduled to sign a definitive agreement by October 25, 2002 and complete the business transaction by the end of November this year.

By completing this asset transfer and by selling the largest non-core business unit, hynix will achieve significant progress in the scheduled business-restructuring objective. The sale will also allow hynix to concentrate on core business and bolster investment in next generation production facilities. This sale of business will enable Hydis to further extend its TFT-LCD business by being linked to Chinese capital and the market. BOE also said that it is planning to foster TFT-LCD business as their core strategic business by acquiring technology and manufacturing & operating fundamentals of Hydis. It is expected that the business transfer will enable Hydis to diversify its product line utilizing its existing customers and its technology, strengthen its customer service by implementing a more active operating strategy, and expand its business through continuous investment to produce the next generation products. BOE manufactures computer peripheral devices including CRT and monitors, with its headquarter in Beijing, China. It also acquired TN/STN LCD business of Hydis late last year jointly with Semicon Engineering Co., Ltd.

The post hynix Signed MOU to Sell HYDIS first appeared on SK hynix Newsroom.

hynix Semiconductor Inc., ( hynix, www.hynix.com ) today announced the signing of a non-binding memorandum of understanding(MOU) for the sale of its memory business to Micron Technology, Inc. in exchange for approximately 108.6 million shares of Micron common stock.

Micron will invest $ 200 million in hynix in return for a 15% equity stake in hynix’s continuing non-memory businesses. As part of the transaction, Korean lenders will agree to provide U.S. $1.5 billion of long-term debt financing for use by Micron in its Korea-based operations. The MOU is subject to approval by the hynix Creditors Council and the Boards of Directors of hynix and Micron by April 30, 2002.

The transactions will also be subject to successful negotiation of definitive agreements and approvals from a number of parties, including U.S. and European antitrust authorities and the hynix shareholders.

About hynix Semiconductor Inc.

hynix Semiconductor Inc. (hynix) of Ichon, Korea, is an industry leader in the development, sales, marketing and distribution of high-quality semiconductors, including DRAM, SRAM, Flash memory and system IC devices. hynix Semiconductor is one of the world’s leading DRAM supplier with its thirteen semiconductor-manufacturing facilities worldwide and a production capacity of over 300,000 wafer starts per month. In addition, hynix is expanding its system IC business unit with leading technology and added deep sub-micron foundry services to strategically broaden its overall semiconductor presence and achieve its goal of leading the global semiconductor market. hynix maintains worldwide development, manufacturing, sales and marketing facilities.

About Micron Technology, Inc.

Micron Technology, Inc. and its subsidiaries manufacture and market DRAMs, SRAMs, Flash Memory, other semiconductor components, and memory modules. Micron’s common stock is traded on the New York Stock Exchange ( NYSE ) under MU symbol. To learn more about Micron Technology,Inc., visit its web site at www.micron.com.

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