The Semiconductor Memory industry is experiencing a new paradigm driven by advances in AI. In this rapidly evolving environment, SK hynix’s Business Planning department played a key role in the company’s best-ever performance in 2024. By maximizing limited resources through rigorous analysis and proactively adapting to internal and external changes, the team contributed significantly to this success. Moving beyond these short-term results, the team is now focused on ensuring the company’s sustainable growth.

In the third episode of an interview series featuring newly appointed executives in 2025, the SK hynix Newsroom sat down with Vice President Jungwoo Kim, head of Business Planning. In this wide-ranging interview, Kim discusses his strategies for driving operational innovation and shaping the company’s future.

Strategic Decision-Making: The Key to Achieving Competitiveness

Kim was instrumental in driving SK hynix’s remarkable growth in 2024 and laying the groundwork for strengthening future capabilities. “Despite the unprecedented downturn in the memory market in 2023, proactive investments based on market analysis led to the company’s record-breaking performance in 2024,” he stated. “Infrastructure investments, such as the decision in 2024 to build the M15X fab, will serve as a critical foundation for responding to new demand.” Kim emphasized that these key achievements were fueled by thorough market analysis and data-based strategic decision-making.

“Decision-making in the semiconductor memory industry is becoming increasingly complex, not only due to technological evolution but also as a result of various uncertainties such as geopolitical risks and growing AI competition,” Kim revealed. “As the head of Business Planning, I will lead strategic decisions that address the company’s key challenges. Beyond simply establishing plans, I will focus on developing feasible strategies by actively communicating with on-site teams to ensure we reach our goals.”

Developing practical and sophisticated strategies based on on-site experience is one of Kim’s strengths. Since joining SK hynix’s manufacturing and technology unit, the Memory Manufacturing Center, in 2003, he has gained extensive experience in field operations and optimization through roles at the Icheon headquarters and as a resident officer in Wuxi, China. “Decisions made during the planning stage significantly impact the productivity and competitiveness of on-site operations,” he emphasized.

“I understand better than anyone the relentless efforts of our members to perfect technology and maximize yield, as well as the intensity of a 24/7 production environment,” he said. “My goal is to provide practical, timely solutions fit for front-line operations, enhancing execution capabilities and contributing to the growth of both the company and our employees.”

Kim will provide practical solutions for front-line operations to support company growth

From Uncertainty to Execution: Driving Operational Innovation

In the semiconductor memory industry, where the cycles of boom and bust are the norm, the “art of timing” is crucial as well-timed investment decisions can determine business success or failure. Since 2023, SK hynix has been operating a consultative body uniting all departments to predict and analyze market conditions, thus guiding key decisions on production, sales, and investments. This approach has helped the company navigate an unprecedented industry downturn and achieve its best performance to date.

“2025 is a pivotal year where we must move beyond past achievements and set the stage for sustainable growth,” Kim claimed.

“Guided by the principle of ‘From Uncertainty to Execution,’ the Business Planning department is driving operational innovation with three key objectives: preemptively taking action to address market changes, strengthening data-driven decision-making systems, and maximizing cross-department synergies,” he revealed. “To effectively respond to market changes, we will refine market assessments and sharpen investment discussions while establishing strategies which align with global IT trends and technological advancements. Additionally, we will build a framework to enable rapid changes of direction based on data analysis of supply and demand fluctuations and investment profitability. Close collaboration with on-site teams will also be key to enhancing execution and ensuring success.”

Collaboration and responding to market changes are key to Kim’s strategy for driving operational innovation

Leading by Example: Embracing Challenges & Innovation for Further Growth

As the Business Planning department tackles company-wide issues, the work requires careful deliberation. “No matter how difficult the problem is, if we demonstrate a ‘one-team’ spirit, discuss solutions, and take it step by step, we’ve always found a way to solve a challenge,” he said and emphasized that, for this approach to succeed, “Leaders must set the right example.”

“A leader should not only set the direction but also engage with team members and consider their diverse perspectives,” he said. “I will step forward for difficult tasks, think deeply, and be a leader who communicates with an open mind.”

Kim concluded by encouraging the team to embrace challenges and drive innovation.

“SK hynix has grown through a history of challenges and innovation,” he said. “While we should take pride in our achievements we’ve made so far, we must not become complacent. Let’s push forward, take action, and create even greater growth together, ensuring SK hynix remains at the forefront of the global semiconductor market.”

Read more articles from the New Leadership Spotlight 2025 series

The post [New Leadership Spotlight 2025] Head of Business Planning Jungwoo Kim on Executing Strategic Decisions to Navigate Uncertainty first appeared on SK hynix Newsroom.

In 2024, SK hynix achieved its best-ever performance to date, solidifying its leadership in the global AI memory industry. The Business Analysis department played a key role in this achievement by strengthening the company’s financial standing through rigorous profit and loss management, cost and profitability analysis, and economic simulations.

To build upon this improved financial foundation and drive further growth, SK hynix appointed Vice President Jaekwang Eom of Business Analysis as a new executive. In the second episode of an interview series featuring newly appointed executives in 2025, the newsroom spoke with Eom to discuss his aspirations and thoughts in this new role.

Rising Above the Downturn, Aiming for Greater Growth in 2025

Aiming for top cost competitiveness and enhanced memory value, Eom and the Business Analysis team relentlessly moved forward in 2024, leading to the company’s record-breaking performance.

“The previous downturn brought significant challenges, making financial stability our top priority in 2024,” he said. “The Business Analysis team responded by promptly analyzing profits and losses amid the rapidly changing environment, optimizing resources, and strengthening our core capabilities. As a result, we achieved world-class cost competitiveness.”

Despite the company’s strong 2024 performance, Eom stressed that there is no room for complacency and he aims for greater progress in 2025.

“Although we achieved great success last year, there’s still room for improvement,” he stated. “In 2025, we will strive to achieve positive net cash¹ and sustainable growth to help the company reach new heights. We will achieve Operational Improvement² (O/I) 2.0 not only through cost reduction but also by measuring the impact of process and structural improvements and implementing an advanced management system.”

¹Net cash: The amount remaining after subtracting borrowings from cash and cash equivalents, indicating a state where cash holdings exceed borrowings.
²Operational Improvement (OI): An SK Group management strategy first proposed in 2002 that optimizes key performance indicators such as profit margins, customer satisfaction, and sustainability to maximize business profits. It refers to all management decisions that improve and enhance the business.

Eom aims to enhance financial stability and operational efficiency, driving sustainable growth for SK hynix

Hands-on Experience Shaping a Balanced Perspective

Eom’s career path is unique. Now leading the Business Analysis department—a key pillar of the company’s financial operations—Eom began his career in manufacturing and technology. With a background in semiconductor manufacturing, he is recognized for his exceptional ability to balance manufacturing and technology operations with financial strategies.

“Finance-related organizations are often perceived as solely focused on cutting costs,” he revealed. “But with my experience in manufacturing and technology, I’ve learned to make well-balanced decisions instead of favoring one side. Moving forward, I’ll continue making decisions that satisfy both our financial objectives and the needs of the manufacturing and technology teams.”

This approach is clear in the Business Analysis department, where nearly half the members have manufacturing or technical backgrounds.

“As SK hynix is a leading tech company, even the Business Analysis department, which is focused on financial strategy, needs a deep understanding of technology,” Eom revealed. “Leveraging this expertise, we’ll develop more well-crafted and practical financial strategies.”

Eom seeks to integrate financial expertise with technical insights, ensuring balanced decision-making and stronger cost competitiveness

Recognizing Achievements Driven by SUPEX & the One-Team Spirit

For Eom, the achievements of 2024 are particularly significant. Not only did the company achieve its best-ever financial results, but a taskforce that was formed in 2021 to drive world-class cost competitiveness also made remarkable progress. In 2024, SK hynix achieved the leading cost competitiveness in the global semiconductor market, demonstrating not only the company’s technological excellence but also its strong leadership in business management.

“Achieving outstanding cost competitiveness wasn’t easy, but thanks to our commitment to SUPEX³ and the ‘one-team’ spirit, we reached our goal faster than expected,” he said. “As a member of SK hynix, I’m incredibly proud and deeply grateful to all the team members who worked hard to make this achievement possible.”

³Super Excellent Level (SUPEX): A key concept of SK Group’s business management system, SKMS, SUPEX describes the highest level attainable by human ability.

Eom concluded by highlighting the importance of hyperconnectivity. “To become the world’s leading full stack AI memory provider, we must focus on improving individual skills while also harnessing the power of collective intelligence,” he added.

“As market conditions rapidly evolve and competition intensifies, we must improve operational efficiency while securing a technological edge. I believe we can elevate SK hynix to new heights by harnessing the power of convergence—where experts from various fields work together to create even greater value.”

Read more articles from the New Leadership Spotlight 2025 series

The post [New Leadership Spotlight 2025] Head of Business Analysis Jaekwang Eom Balances Financial & Tech Objectives for Leading Cost Competitiveness first appeared on SK hynix Newsroom.

Amid intensifying technological competition and diversifying customer demands in today’s AI market, HBM¹ remains a gamechanger.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Backed by industry-leading technology, SK hynix’s HBM played a pivotal role in the company achieving its best-ever performance in 2024. In 2025, continued innovation and enhanced productivity will be crucial to drive even greater growth. The role of the HBM Heterogeneous Integration Technology team, responsible for optimizing yield, quality, and cost, as well as advancing packaging technology, is therefore more critical than ever.

To find out more about the team’s efforts, the SK hynix Newsroom sat down with its leader, Vice President Kwonwhan Han. In the first episode of an interview series featuring newly appointed executives in 2025, Han discussed HBM technology innovation strategies for leading the AI memory market along with his vision and goals.

Two Birds, One Stone: Achieving Technological & Operational Innovation

Han, who joined SK hynix in 2002, was involved from the initial development of HBM and has since led the development and mass production of every HBM generation, playing a key role in establishing the company’s HBM leadership.

“When HBM was first launched, production scale and demand were nowhere near today’s levels” he stated. “However, the emergence of ChatGPT in 2023 sparked explosive growth in the AI market and a rapid surge in customer demand. In response, we were tasked with building a much larger production line than the existing one in a short period of time. To meet demand, we also converted parts of other production lines into HBM production lines, establishing a large-scale mass production system. At the time, it seemed nearly impossible to reach our goals, but with the dedicated efforts of the HBM Heterogeneous Integration Technology team and related departments, we were able to succeed.”

Han’s strategic response became the foundation for SK hynix’s increased HBM market share and world-class production capacity and quality. Building on this experience and expertise, he is now set to lead the HBM Heterogeneous Integration Technology team. In this position, he will play a crucial role in enhancing mass-production capabilities and establishing a new technical base for a smooth transition to next-generation HBM.

“To stay competitive in the HBM market, it is essential to not only have technological expertise but also deliver the best products to customers in a timely manner,” Han claimed. “I will do my utmost to establish a collaborative system that can promptly respond to market and customer demands through technological and operational innovation, ensuring stable mass production.”

Han plans to develop a collaborative system which can respond to market demands, ultimately leading to stable HBM mass production

Building the Optimal Mass-Production Environment to Meet Market & Customer Demands

“The most important task in 2025 is to respond steadily to growing market demands, while also solidifying our technological readiness for mass production of next-generation HBM,” Han emphasized.

“The 12-layer HBM3E, which will be the main focus of production in 2025, has a higher level of process complexity compared to the existing 8-layer HBM3E,” he revealed. “Additionally, as next-generation HBM products evolve, we expect the technical challenges will become more demanding. While mass production will begin after overcoming many of these challenges during development, unexpected variables may still emerge as we rapidly scale production, and it will be difficult to resolve them. Therefore, the HBM Heterogeneous Integration Technology team plans to focus on proactively anticipating these variables and developing a thorough response strategy.”

Recently, as demand for AI memory increases, there has also been a gradual rise in demand for customized products, especially among big tech companies. However, HBM involves more process steps and a more complex production process than other products, making it challenging to meet these demands. “Rather than simply increasing production volume, establishing an efficient operational system has become even more important,” Han stated. “We will enhance the flexibility of our production lines and strengthen collaboration with customers to maximize our HBM competitiveness.

“We are improving various operational systems through collaboration to enhance HBM production flexibility. From the development stage, development and mass production departments will work as one, closely cooperating with customers to increase production efficiency. To achieve this, we aim to establish an optimal mass-production environment by proactively addressing technical challenges with relevant departments. Based on these efforts, we will contribute to SK hynix’s advancement as a full stack AI memory provider.”

Han aims to enhance production line flexibility and strengthen customer collaboration to maximize HBM competitiveness

Fulfilling the Leader’s Role: Fostering Employee & Company Growth

Han emphasized that the key to driving outstanding performance lies in employees’ self-driven motivation, adding that leadership plays a crucial role in fostering such a mindset. In particular, he expressed a strong commitment to supporting the growth of younger team members.

“I believe that the role of a leader is to communicate in order to create an environment where employees can motivate themselves and take ownership of their work,” he said. “I will actively communicate and solve problems with my team so that passionate young employees who do their best can grow together with the company.”

In addition, Han emphasized that on-site safety remains the most important value even in a rapidly changing market, and encouraged employees to confidently move forward together.

“We are currently growing rapidly, and we must focus on achieving our goals. However, nothing is more important than safety at our facilities,” he claimed. “To ensure this, our management will lead by example. Also, I hope we never forget that we are the world’s best in our industry. Moving forward, I will continue to communicate and collaborate with my team, working together to build an even stronger SK hynix.”

Read more articles from the New Leadership Spotlight 2025 series

The post [New Leadership Spotlight 2025] Head of HBM Heterogeneous Integration Tech Kwonwhan Han Strives to Strengthen HBM Leadership Through Optimized Mass Production first appeared on SK hynix Newsroom.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

In light of this rapidly changing business environment, the newsroom invited newly appointed SK hynix executives to a roundtable to discuss the competitiveness underlying the company’s status as the global No. 1 AI memory provider and the company’s future direction.

For this final New Leadership Spotlight article, seven company vice-presidents who previously participated in the series took part in the roundtable: head of HBM Process Integration (PI) Unoh Kwon; head of Material Development Deoksin Kil; head of HBM Sales & Marketing (S&M) Kitae Kim; head of Advanced Package Development Hoyoung Son; head of NAND Advanced Process Integration (PI) Haesoon Oh; head of Performance and Reliability (PnR) for the 321-layer NAND flash Donghun Lee; and head of Global Revolutionary Technology Center Jaeyun Yi. The roundtable was moderated by Jeongho Won, who is head of Global PR.

The roundtable participants: (from left) Unoh Kwon (HBM PI), Kitae Kim (HBM Sales & Marketing), Donghun Lee (PnR for the 321-layer NAND flash), Haesoon Oh (NAND Advanced PI), Deoksin Kil (Material Development), Hoyoung Son (Advanced Package Development), and Jaeyun Yi (Global RTC)

How SK hynix Gained a Competitive Edge in the AI Era

• Long-term R&D and investment in HBM even before the market opened up
• Deep understanding and collaboration with customers
• Preparations for a future of heterogeneous convergence that breaks barriers between fields

SK hynix has taken the lead in the AI memory market through its groundbreaking technology. In March 2024, the company became the first in the world to mass-produce HBM3E, the fifth generation of HBM. SK hynix is also strengthening its position by bringing forward the planned mass production of its next-generation HBM4 to 2025, and securing advanced technology through global investments and cooperation with partners. To kick off the roundtable, the panelists discussed the background of SK hynix’s leadership position.

Kwon claimed SK hynix’s early investment and research in AI memory were key to growth

Kwon: “Our long-term investment and research in AI memory even before the market opened up have been the foundation for the company’s growth. Based on this, SK hynix develops high-performance memory products for various industries including HBM, which is essential for AI infrastructure. Our competitive advantages include proactively securing these types of technologies as well as our mass production experience.”

Kim: “SK hynix’s strength is that the company always collaborates with its customers on the front line and meets their needs based on a thorough understanding of them. We are highly trusted thanks to our timely delivery and experience in the mass production of HBM.”

Son: “HBM’s success is due to the company’s more flexible approach to collaborating not only with customers but also across departments. In order to meet the needs of a more diverse market, we need to take our collaboration with customers to the next level and prepare for heterogeneous integration which blurs the lines between memory and systems, as well as between semiconductor front-end and back-end processes.”

Lee highlighted the importance of high-capacity SSDs for AI

Another point of discussion was high-capacity NAND flash solutions.

Lee: “High-capacity SSD products based on NAND flash are essential for storing large amounts of data required for AI systems. SK hynix was the first in the industry to secure multi-plug technology, which reliably enables NAND flash’s data storage area even at ultra-high density, and All Peri. Under Cell (PUC) technology, which increases production efficiency by reducing product size. Both of these breakthroughs enhanced our competitiveness in this area.”

Oh: “SK hynix’s world-class ability to achieve cost-effectiveness along with its timely product development also allows the company to meet customer needs in the NAND flash field.”

Memory: The Key of AI Infrastructure Set for a Bigger Future Role

When asked why AI memory has been in such high demand, the executives unanimously pointed out that high-performance solutions such as HBM, CXL^®2, eSSDs³, PIM⁴, and others are solving data bottlenecks in traditional memory and enhancing AI system’s operating speeds. They added that demand for high-performance, high-capacity memory will only continue to grow as AI applications expand.

²Compute Express Link^® (CXL^®): A technology that consolidates the interface between memory and other devices such as logic chip and storage into one to increase efficiency and enable high bandwidth and high capacity.
³Enterprise solid-state drive (eSSD): An SSD is a storage solution which combines NAND flash and a controller. Among the various types of SSDs available, eSSDs are designed specifically for enterprises.
⁴Processing-In-Memory (PIM): A new generation of intelligent memory that embeds the computational functions of a processor in memory.

Kim: “Memory will be utilized much more as generative AI technologies are being widely used in public services such as education and healthcare, as well as in B2C markets to analyze key consumer segments, develop products and services, run marketing campaigns, and even manage supply chains.”

Kil believes the convergence of various industries with AI will boost growth in the semiconductor market

Kil: “Generative AI technology itself is important, but it is much more crucial to see how many applications it can be implemented in and how it is delivered to consumers. In the future, the convergence of the on-device⁵, autonomous driving, and robotics industries with AI will drive changes and growth in the semiconductor market.”

⁵On-device AI: AI technology that implements AI functions on the device itself instead of proceeding with computation in a physically separated server. With on-device AI, AI functions become more responsive and more customized AI services can be provided as smart devices are capable of independently collecting and computing information.

Lee: “As AI technology becomes more advanced, we can envision a future where the metaverse becomes so sophisticated that it’s close to the real world. As big tech companies try to get a head start in this space, we could see an increase in memory demand.”

Oh stated that the proliferation of AI servers is boosting demand for NAND flash products such as eSSDs

The executives also discussed about how the expanding AI industry is opening up new memory markets.

Oh: “NAND flash hasn’t received much attention in the AI industry, but products such as eSSDs have started to gain traction as demand for large-scale AI servers has increased. New markets are opening up in various fields, resulting in numerous memory products gaining in popularity.”

Son: “Initially, it was difficult to predict that the AI memory market would develop in the way it has. Now, the industry is focusing on securing tailored memory solutions for customers considering various future possibilities.”

Yi: “There is also growing interest in emerging memories that go beyond the limits of conventional memories to obtain differentiated technologies. In particular, MRAM⁶, RRAM⁷, and PCM⁸, which combine the high-speed performance of conventional DRAM with the high-capacity characteristics of NAND flash, are increasingly in the spotlight.”

⁶Magnetic RAM (MRAM): Memory which uses the phenomenon that the resistance of an element changes depending on the direction of the magnetic spin motion to distinguish whether data is stored or not.
⁷Resistive RAM (RRAM): Memory that stores data based on the resistance difference created by applying voltage to the filaments in the device.
⁸Phase-change memory (PCM): A memory that stores data using the phenomenon of changing the phase when a voltage is applied to a specific material.

SK hynix’s Top Priorities in Response to Future Market Changes

The executives also had various opinions on the issues SK hynix should pay attention to in order to stay ahead of future industry and technology changes. First of all, they underlined the importance of strengthening relationships with customers and global cooperation to maintain the company’s technological superiority.

Kim called for the company to continue improving in both the front-end and back-end processes

Kim: “Even as AI services diversify, the core specifications required for memory will continue to be ‘speed’ and ‘capacity’ as long as there are no changes to the current structure of the Von Neumann⁹ architecture which separates logic and memory chips.” In order for SK hynix to maintain its edge in AI memory technology including HBM, it must not only improve its design, device, and product competitiveness in the front-end process, but also continue to develop its outstanding packaging technology such as its unrivaled high-level stacking in the back-end process.

⁹Von Neumann architecture: A program-embedded computer structure typically featuring three levels consisting of the main memory unit, a central processing unit, and an input/output unit. Most computers today follow this basic structure, but its bottleneck limits the ability to design high-speed computers.

“Our big tech customers are accelerating their new product release cycles to gain AI market leadership. We are already discussing plans for 2025 to ensure we can deliver next-generation HBM products in a timely manner.”

Kwon: “The upcoming HBM4 will be the first HBM solution to introduce a logic chip’s manufacturing process in memory. In addition to realizing specifications beyond what our customers want, the newly introduced process will lead to collaborations with related industries and create new opportunities.”

Son claims that advanced packaging technology is key to developments in conventional memory and heterogenous integration

Son: “To improve the performance of conventional memory and realize heterogeneous integration such as that between memory and logic chips, we need to elevate advanced packaging technology. To do this, we need to strengthen collaboration with global industry, academia, and research institutes in different fields on various subjects ranging from conventional memory to the convergence of semiconductors.”

In addition, the executives emphasized the importance of enhancing product quality through material development, improving high-performance NAND technology for AI, and conducting R&D for next-generation memory.

Kil: “We need to keep a close eye on the emerging AI and semiconductor markets and create a development environment that can flexibly respond to rapidly changing situations. Through innovation in semiconductor materials, we can simplify processes and improve defect rate control and UPH¹⁰. As for the packaging field, which is becoming increasingly crucial, it is vital to develop materials that enhance product performance and quality by boosting yield and heat dissipation properties.”

¹⁰Unit Per Hour (UPH): The amount of products manufactured per hour on a production line.

Lee: “The ability to store exponentially growing data in a limited space with as much data and as little power as possible is becoming vital. Therefore, high-capacity, low-power eSSDs are essential, while NAND flash for eSSDs needs to offer high performance, quality, and reliability when implementing 300 or more layers of ultra high-density storage.”

Oh: “The use of QLC¹¹-based eSSDs in AI servers has recently grown as QLC technology is specialized for high capacity and complemented by rapid read and write speeds, while it also reduces customers’ total cost of ownership¹². We will endeavor to develop timely products to target relevant markets.”

¹¹Quadruple Level Cell (QLC): A form of NAND flash memory that can store up to 4 bits of data per memory cell.
¹²Total cost of ownership (TCO): The total costs of an asset that includes such as the initial investment, power, facility operations, and maintenance.

Yi revealed that SK hynix will focus on strengthening R&D in future technologies

Yi: “The global environment is changing so rapidly that it is difficult to predict whether the changes we anticipate will occur in the distant future or will soon become a reality. We are focusing on emerging memories such as SOM¹³, spin memory¹⁴, and synaptic memory¹⁵ which offer ultra-high speed, high capacity, and low power, as well as MRAM, RRAM, and PCM. Looking ahead, we will continue to strengthen R&D on various future technologies.”

¹³Selector-Only Memory (SOM): A memory that implements the capacitor (storage area) and transistor (control area), known as a selector, of conventional memory into a single device. This can help overcome the micro-processing limitations of conventional PCM.
¹⁴Spin memory: A memory that applies the spin motion characteristics of electrons to distinguish whether data is stored or not.
¹⁵Synaptic memory: Memory based on artificial neural network devices which solves limitations found with serial processing in the existing computing structure, such as data bottlenecks, by realizing a highly efficient computing structure similar to the human brain.

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership

New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech

Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials

New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era

New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors

The post New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends first appeared on SK hynix Newsroom.

Jaeyun Yi was appointed as the head of SK hynix’s Global Revolutionary Technology Center (RTC), which conducts research and development of next-generation semiconductors, at the end of 2023. As a seasoned semiconductor device expert, he has led the development of emerging memories¹ including ReRAM², MRAM³, PCM⁴, and ACiM⁵, which began with pilot studies of DRAMs.

¹Emerging memories: Memory technologies based on newer forms or principles compared to traditional memories such as DRAM or NAND flash. Examples of emerging memories include ReRAM, MRAM, PCM, and FeRAM.
²Resistive RAM (ReRAM): A semiconductor memory that stores data by applying voltage to simple-structured devices filled with filaments. With a refined process, it offers a high data storage capacity and low power consumption.
³Magnetic random access memory (MRAM): A semiconductor memory that simultaneously uses charge and spin so that the device’s resistance changes depending on the direction of the spin.
⁴Phase-change memory (PCM): A semiconductor memory that stores data by using the phase change of a specific material. It has both the advantages of flash memory of not losing information when powered off and DRAMs that have fast processing speeds.
⁵Analog compute-in-memory (ACiM): A technology for next-generation AI semiconductors that removes barriers between computation and memory.

Yi is credited with helping to lay the foundation for SK hynix’s global competitiveness by establishing the open research platform (ORP)⁶, that was based on his collaboration experience with domestic and foreign semiconductor companies, universities, and research institutes.

In continuation of the newsroom’s series interviewing the newest members of SK hynix’s executive team, Yi talked about his vision for Global RTC in developing future semiconductor memories and promoting wider collaborations through the ORP.

⁶Open research platform (ORP): A platform that builds a proactive research and development ecosystem by strengthening partnerships focused on technological innovation. Global RTC operates a Research website (https://research.skhynix.com) to share insights on its ongoing research of future technologies and to actively communicate with various global research organizations.

Yi believes that emerging memories will break through the limitations of conventional memories

Emerging Memories to Create Value That Transcends Generations

“Global RTC aims to present the paradigm for the evolution of the future semiconductor industry,” Yi asserted. “Especially, we are developing emerging memories that will unlock the value of next-generation technologies. In addition, we are continuing to conduct foundational research into advanced computing that will overcome the limitations of existing semiconductor technologies. As a new company executive, I will accelerate the achievements of our future research and development to solidify SK hynix’s technological leadership.”

Accordingly, Yi anticipates emerging memories will set a new paradigm for the AI era. These technologies are gaining attention as advanced solutions that will break through the limitations of conventional memory. As for SK hynix, its current emerging memory solutions include SOM⁷, spin⁸, synaptic⁹ memory, and ACiM.

⁷Selector-only memory (SOM): A semiconductor consisting of a dual function material (DFM) and two electrodes that can play the role of both memory and selector. A selector is a device that responds to a voltage applied between a word line and a bit line. It allows data to be written or erased on a memory cell based on the difference in voltage across the two ends.
⁸Spin: A technology that applies the spin motion of electrons to semiconductors, enabling various forms of memory and devices with ultra-high speed and ultra-low power characteristics.
⁹Synaptic: Devices that can mimic the neural networks of the human brain, solving problems caused by traditional computer structures and enabling highly efficient computing structures.

Yi anticipates Global RTC to lead the future of the semiconductor industry by developing emerging memories

“SOM possesses both the characteristics to quickly process data as seen in DRAMs and the ability to store and erase data like NAND flash,” Yi explained. “It is expected to play an important role in the DRAM and NAND flash markets that are set to see drastic changes. Additionally, Global RTC is developing a variety of future technologies such as the fastest spin device among emerging memories which leverages magnetic properties.”

Yi also mentioned how Global RTC’s research in other emerging memories is progressing rapidly.

“We are conducting research in synaptic memory, an AI semiconductor that mimics the human brain,” Yi said. “In addition, we are researching ACiM which reduces data movement between the memory and processor during AI computation while also cutting energy use. This specific technology has recently attracted great interest from both the academic field and our industry.”

Yi claims Global RTC’s ORP will advance global collaborations

Making SK hynix Shine Brighter in the Global Market

Yi emphasized that SK hynix needs to strengthen its system of collaboration with those from all walks of life to be more competitive in the rapidly changing global market.

“The ORP fostered by Global RTC is an open research platform of collaboration that can address the range of future technology demands,” he noted. “As a result, we are currently discussing possible partnerships with external companies and research organizations.”

He also stressed that “in the future semiconductor market, success will rely on such alliances between various institutions including industry players, academic bodies, and research organizations rather than the efforts of a single company.”

“Furthermore, it is also important to have a new system that promotes open discussions in response to environmental changes,” he added.

Through these efforts, Yi is committed to researching customized semiconductor memories to meet diversified needs in the future. Moreover, he touched on the responsibilities that come with being a leader in the global semiconductor industry.

“As the data generated by technological advancements such as AI and cloud computing continues to grow, there are concerns over the significant power consumption of these innovations,” he said. “Consequently, Global RTC is continuing to research about efficient energy use so we can achieve our goal of net zero.”

Pathfinders of Future Technologies: “It’s All About Taking on Challenges”

“The recent AI fever that started with ChatGPT is also a huge opportunity for the semiconductor memory field,” Yi stated. “At this significant time, we need to be pathfinders of future technologies.”

He noted the importance of developing diverse fundamental technologies¹⁰ for the future market just like TSV¹¹, which was applied to HBM and transformed the industry downturn into an opportunity.

¹⁰Fundamental technologies: A core technology required to implement changes and improvements to product characteristics.
¹¹Through-silicon via (TSV): A technology that drills thousands of microscopic holes in a DRAM chip and connects the holes in the upper and lower layers of the chip with electrodes that run vertically through them.

Yi points to communication, trust, and care in his organization as the cornerstones of success

“TSV—a vital fundamental technology for HBM—started its research 15 years ago as one of the innovative technologies of the future,” Yi recalled. “Even if it was not developed in anticipation of the AI era, it has become one of the leading AI semiconductor technologies of today. Likewise, we need to work on developing more fundamental technologies for a future that we truly cannot predict.”

Yi also offered his last words of encouragement to SK hynix employees.

“All of our hard work has played a part in transforming the past downturn into an opportunity, but we cannot be satisfied just yet,” he said. “If we are not afraid in the face of new challenges, we can achieve even more than we have in the past. I hope we can make a united effort in taking on challenges by communicating, trusting, and caring for one another.”

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership

New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech

Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials

New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era

New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends

The post New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors first appeared on SK hynix Newsroom.

As part of efforts to strengthen its competitiveness in the future AI infrastructure market, SK hynix created the AI Infra division and the affiliated HBM¹ Business department at the end of 2023. In a key appointment within HBM Business, Vice President Unoh Kwon became head of HBM Process Integration (PI).

While working as a DRAM development research fellow in 2022, Kwon broke new ground by becoming the first to apply the HKMG² process to the mobile DRAM LPDDR, and this led to the successful development of the ultra-high-speed and low-power LPDDR5X and LPDDR5T. In recognition of his contributions, Kwon was awarded the SUPEX Award³ in 2023.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV). There are five generations of HBM, starting with the original HBM and followed by HBM2, HBM2E, HBM3, and the latest HBM3E—an extended version of HBM3. SK hynix is the first in the world to begin mass production of HBM3E.
²High-K metal gate (HKMG): A next-generation process that uses a material with a high dielectric constant (K) as an insulating film inside the DRAM transistor to prevent leakage current and improve capacitance. It enables faster speeds while reducing power consumption.
³SUPEX Award: As the most prestigious award within SK Group that carries the meaning “super excellent,” it recognizes members who have successfully realized innovations by not being afraid to take on new challenges.

With his strong technical background, Kwon has been tasked with finishing the future roadmap for the company’s HBM technology. As part of the newsroom’s series focusing on new executive members at SK hynix, Kwon spoke about his vision to develop the next generation of HBM technology and his strategies for the AI era.

Improving Development Efficiency Through HBM-Focused, Integrated HBM Business Department

Kwon anticipates the HBM Business department will bring greater efficiency while enhancing employees’ technical capabilities

With the continuous evolution of AI, demand has also rapidly increased for HBM—a representative memory product for the technology. “I feel a great sense of pride and responsibility to take on this role when there are high expectations for SK hynix’s HBM products,” said Kwon. “With the combined experience and challenging spirit of employees who developed the world’s best-performing HBM, we will do our best to achieve the next generation of technological innovations.”

In a move to improve the efficiency and synergy of HBM production from the development phase to the manufacturing and commercialization stages, SK hynix merged the various departments in charge of these processes into HBM Business. This rare, product-focused reorganization demonstrates the company’s commitment to maintaining its HBM leadership.

Kwon cites the HBM Business department’s high efficiency as its biggest strength. By shortening the decision-making process at the beginning of product development, members can quickly coordinate among themselves and execute projects. Furthermore, as the development team can hear feedback directly from customers, the team can reflect customer values during product development.

“Possessing the united goal of advancing HBM, our department has created an environment where we can focus on our technical capabilities and demonstrate them to the fullest,” Kwon stated. “Consequently, our members have been able to take a more goal-orientated view. What’s more, I can now also analyze what is needed for our technology to grow from a business perspective, and I plan to use this skill to contribute significantly to our efforts.”

Harnessing Unique Semiconductor Fundamental Technology to Revolutionize HBM

Kwon plans to use his previous experience in system semiconductors to advance HBM technology

When asked about the biggest achievement of his career, Kwon chose the application of the HKMG process to LPDDR in 2022. The HKMG process ranks as one of the most significant innovations in semiconductor fundamental technology⁴. Although it was applied early on in system semiconductors, HKMG was not easy to implement in mobile DRAM semiconductor memories where the leakage current needs to be controlled to minimize power consumption.

⁴Fundamental technology: A key technology used for implementing changes and improvements to product characteristics.

Using his past experience at a different global tech company where he successfully applied the HKMG process in system semiconductors, Kwon was once again able to break the technical barriers in mobile DRAM. “It meant a lot to be a part of collective efforts with SK hynix members to make the technological breakthrough of changing the paradigm of memory circuit structures,” Kwon exclaimed.

“As a product featuring advanced and complex technology, HBM can be said to be the most technologically intensive DRAM around,” he explained. “HBM is also the main reason I decided to take on the challenge of shifting my focus from system semiconductors to semiconductor memories.” Fascinated by HBM’s ability to spark the convergence of systems and memory, Kwon now plans to concentrate all his technical skills for another breakthrough.

“I expected that there would come a time when performance improvements would go beyond established scaling and reach technological advancements deriving from the convergence of structures, devices, and processes between system semiconductors and semiconductor memories,” Kwon said. “As I predicted that there would be new opportunities for innovation driven by semiconductor memories, I was convinced that HBM was the beginning of this technological revolution. That is why I am more committed than ever to leverage my experiences to create bigger synergies for SK hynix’s HBM technology.”

Confidently Taking on Unforeseen Challenges During the AI era

Kwon believes that adaptability and a challenging spirit will bring innovations in the AI era

Commenting on the outlook of the HBM market, Kwon said that “HBM will become specialized and customized to reflect the values sought by customers.” He stressed that in addition to excellent functional capabilities, the next generation of HBM will need to work as a specialty product differentiated for each customer and have a role that goes beyond memory.

“As we enter the AI era, we are witnessing an unprecedented level of rapid change,” Kwon said. “It is now more important than ever to stay ahead of the curve and react flexibly to changes. To maintain our technological leadership and to lead in the AI era, HBM PI is working hard to develop technologies which will lead to the innovation of fundamental technologies and rapid commercialization of products. We are also actively engaging and collaborating with customers and external partners.”

Kwon also emphasized the importance of not only adapting to changes but also of broadening one’s horizons and taking on challenges to achieve innovations.

“In the future, AI memory will go beyond its current focus on data centers to expand into areas that meet certain purposes. These include ASICs⁵ with improved performance and efficiency or on-device solutions that are optimized for customers’ products,” Kwon claimed. “HBM will not be the only AI memory in use as various types of DRAMs will also become essential memory for AI. Additionally, semiconductor devices will have to be developed to meet various required conditions including traditional characteristics. In a period of such drastic change, it is important to broaden our horizons to create essential synergies by fusing various technologies together, proactively challenge ourselves, and use our setbacks to get up and test ourselves again.”  

⁵Application-specific integrated circuit (ASIC): Also known as a custom semiconductor, an ASIC is an integrated circuit designed for a specific purpose.

In closing, Kwon encouraged SK hynix employees to take pride in leading important changes in the AI era.

“There have been many technological breakthroughs in history, but the changes brought on by AI are bigger and greater than ever,” he said. “SK hynix is driving these significant shifts with its industry-leading technological competitiveness. All of our members have an important role in the AI era, and I will continue to strengthen HBM’s capabilities with a great sense of pride and responsibility.”

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership

New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech

Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials

New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors

New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends

The post New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era first appeared on SK hynix Newsroom.

At the end of 2023, SK hynix promoted Head of Material Development Deoksin Kil to principal research fellow¹ of the newly established Infra Tech Center (ITC).

¹Research fellow: SK hynix executives with outstanding technical capabilities who focus on researching innovative technologies.

Kil’s department focuses on semiconductor materials, which are recently playing an integral role in the overall process of developing and manufacturing products. Not only are they key to technological innovations, but these materials are also crucial for improving cost competitiveness and lowering carbon emissions.

Since joining the company in 1999, Kil has been on a journey to revolutionize materials and thereby strengthen SK hynix’s competitiveness in this field. In 2023, he received the SUPEX Award² for his contribution to localizing extreme ultraviolet photoresist (EUV PR)³, a material which was previously only imported from overseas. Having led the company’s material development with a high level of expertise, Kil is expected to develop new technologies that will boost cost competitiveness while proactively identifying material-related risks.

²SUPEX Award: As the most prestigious award within the SK Group that carries the meaning “super excellent,” it recognizes members who have succeeded in reaching innovation by not being afraid to take on new challenges.
³Extreme ultraviolet photoresist (EUV PR): A key material that engraves circuit shapes on wafers during the photolithography process.

As part of the newsroom’s interview series that shines a light on SK hynix executives, Kil discussed the future role of materials in the semiconductor industry and his vision to achieve technological innovations.

Targeting Collective Innovation Based on Materials

Kil expects that integrated R&D will be crucial to strengthening the competitiveness of materials

“I am very pleased and proud to be recognized for my expertise and competence in semiconductor materials,” Kil said. “At the same time, I also feel a heavy weight on my shoulders as I am tasked with leading the materials field to bring about even greater innovations. I will therefore focus on continuously developing new materials at the ITC to ensure that our Material Development department becomes an integral part of creating synergies between advanced and mass-production technologies.”

In addition to developing new technologies, Kil’s department is tasked with supporting and managing the overall R&D process by leading the development of materials used in the manufacturing process.

Kil highlights how material innovations lead to advancements in semiconductor technology

Subsequently, he went on to emphasize the goal of innovation driven by materials.

“In the past, materials played a secondary role in improving the characteristics of processes. But in recent years, innovations in materials have directly led to improvements in the unit per hour (UPH)—the amount of products manufactured per hour on a production line—and have modified the concept of processes, resulting in a reduction in investment costs,” Kil explained. “These innovations have consequently improved the productivity and cost competitiveness of DRAM and NAND flash products. With these technical capabilities, it is our goal to achieve integrated innovations driven by materials.”

Building a Stable Semiconductor Materials Ecosystem, Minimizing Materials Risk

Taking past experiences as lessons, Kil stresses the importance of being prepared for the worst case in terms of materials risks

Looking back at his career, Kil picked the successful localization of EUV PR in 2023 as one of his most significant feats. “The Korean semiconductor industry used to rely solely on internationally imported materials, but restrictions to these imports in 2019 significantly impacted our sector,” he recalled. “Fortunately enough, SK hynix’s quick response to the issue ensured we eventually benefitted from the situation in the end.”

As part of this response, Kil has worked with SK Materials Performance since 2021 to develop EUV PR—an essential material for the semiconductor process. As a result, SK hynix succeeded in localizing EUV PR and contributed to the normalization of material supply and demand. “This experience has enabled us to become confident in our current endeavors to develop new materials,” he said.

Based on the lessons learned from the 2019 incident, SK hynix established the Material Risk Index (mRI). Through this index, the risk level of different categories of materials began to be calculated and managed separately so that any potential crises could be handled effectively. Additionally, Kil is also operating a mutual benefit consultative group for high-risk materials with partners.

“Semiconductor materials have a decisive impact not only on technology implementation but also on mass-production processes like equipment operations,” Kil stressed. “By continuing to closely monitor important affairs such as geopolitics and international regulations, we will reduce uncertainty and build a stable ecosystem of semiconductor materials.”

Expanding Role of Materials to Spark Renaissance in 2024

Kil hopes SK hynix will become a significant player in developing future materials

Kil predicts that materials will become more important in the future semiconductor market. “In the future, semiconductor materials will be developed not only to improve performance but to also meet standards for low carbon emissions and possess eco-friendly characteristics. Consequently, we are taking part in various efforts to develop new alternative materials,” he said.

Kil pointed out that these newly developed materials will be increasingly applied to existing technologies in 2024.

“We plan to implement practical and differentiated solutions by clearly identifying the needs for each stage of the respective technologies,” he explained. “At a time when our role of material development is growing in importance, we will not stop until we achieve a renaissance in materials development.”

While thanking all of SK hynix’s employees, Kil urged them to continue challenging themselves to test their limits.

“To realize a positive and hopeful future, you must prepare yourself,” he stated. “You get closer to your dreams by facing challenges, gaining experiences, and building skill sets. I hope many of you will be able to achieve your dreams in 2024.”

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership

New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech

New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era

New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors

New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends

The post Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials first appeared on SK hynix Newsroom.

SK hynix has ramped up preparations for its evolution in the AI era with a new addition to its executive team. Hoyoung Son became the head of Advanced Package Development at the start of 2024 to strengthen the company’s leadership in packaging technology for HBM¹, a key semiconductor for AI.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds over conventional DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV) technology. There are five generations of HBM, starting with the original HBM and followed by HBM2, HBM2E, HBM3, and HBM3E—an extended version of HBM3.

In 2023, Son received the distinguished Haedong Young Engineer Award² for his contributions to the development of advanced packaging³ technology, which is also a key element for HBM products. In the fourth article of this interview series with recently appointed executives, Son spoke about his plans for the future and how he will adapt to such a big role in the AI era.

²Haedong Young Engineer Award: A prize presented at the annual Haedong Awards. Hosted by the Haedong Science and Culture Foundation, the awards recognize those who have made significant contributions to promote the growth and expansion of electronic engineering in South Korea.
³Advanced packaging: A solution that emerged to meet market requirements for high-performance products by resolving issues related to limits on wafer density technology.

“It was a special moment to become the first team leader to win the Haedong Young Engineer Award in 2023, which is usually awarded to executives,” he said. “This year, I have a greater sense of responsibility now that I am an executive. I will do my utmost to accomplish my goals in this new position.”

An Unwavering Spirit Sparking a Revolution in AI Semiconductor Memory

Son has been instrumental in the development of HBM, which has garnered significant attention in the semiconductor industry. He helped solidify the company’s leadership in AI memory technology by leading the development of TSV⁴, the core technology of HBM, as well as SK hynix’s proprietary MR-MUF⁵ from the early stages of their introduction.

⁴Through Silicon Via (TSV): A technology that drills thousands of microscopic holes in a DRAM chip and vertically connects silicon dies through electrodes.
⁵Mass Reflow-Molded Underfill (MR-MUF): The process of placing a liquid protective material between stacked chips while simultaneously hardening the chips and the surrounding circuitry. MR-MUF is considered to be more efficient than laying down a film-like material after each chip is stacked, and has exceptional heat dissipation capabilities.

Son claims his team’s perseverance will realize more breakthroughs in AI memory

“Personally, I believe the most meaningful achievement was developing the first generation of HBM in 2013, which felt like going from zero to one,” he recalled. “Countless trials and risks couldn’t stop our efforts as we used these setbacks as lessons to come up with stronger solutions. Subsequently, we successfully developed the current fifth generation of HBM, HBM3E, and advanced packaging technology.”

Son thinks that the same unwavering spirit is needed in the AI era. As unforeseen challenges await in the future, it will be important to overcome them to achieve innovations.

“Just as SK hynix never gave up on developing HBM because we believed in its value, I will continue to develop the next generation of AI memory that will lead the rapidly changing AI era,” he added.

Evolving Into a Total AI Memory Provider

Son also thinks that SK hynix’s role in the AI age is gradually changing. He believes that the company should evolve from its current position as a supplier of semiconductors to become a total AI memory provider.

Son stresses the need to develop diverse AI memory products for AI technology

“When we developed our advanced packaging technology in 2023, one division was responsible for integrating it with existing process technology. Although this approach can reduce trial and error in the early stages of development, it has flaws in terms of efficiency and expertise as the technology becomes more sophisticated and diverse,” he said. “Developing customer-specific AI memory requires a new approach as the flexibility and scalability of the technology becomes critical.”

Son stressed that as AI technology is being utilized in more areas, the hardware required to implement these technologies is also advancing in various ways. “To proactively respond to these changes, we plan to departmentalize our current divisions and enhance their expertise,” he explained.

“For different types of AI to be realized, the characteristics of AI memory also need to be more diverse,” he stated. “Our goal is to have a range of advanced packaging technologies to respond to the shifting technological landscape. Looking ahead, we plan to provide differentiated solutions to meet all customer needs.”

Building Solid Foundations for the Next Generation to Grow

As for his aspirations as a new executive, Son wants to create an environment for growth and development. More specifically, he wants the next generation of workers to have the opportunity to be creative, and emphasized the importance of working autonomously and extending their reach by having various exchanges with academic and industry experts.

“On top of securing immediate results, possessing a technological edge will be more important in the long run,” he explained. “When I was first developing TSV technology and HBM, working in an open environment that allowed me to communicate with academics and other experts was a huge asset to me.”

Son hopes to create the same work culture in his new division. “Although our current members are already highly qualified, I want to help them experience interactions with various external experts so they can become world-class engineers,” he said. “Most importantly, I want to create an environment and culture where people can work as they wish and grow together.”

Son underlines the importance of creating a work environment that encourages growth and happiness

Concluding the interview, Son emphasized that employee happiness is paramount.

“I think happiness starts with understanding the value of life and contemplating ways to grow,” he said. “We have accomplished a lot so far, but if we stay on course to continue achieving more and strive to be better by self-examining ourselves, I think we can be very content. It is my hope that our members will be happier this year.”

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership

Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials

New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era

New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors

New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends

The post New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech first appeared on SK hynix Newsroom.

SK hynix’s HBM¹ was the superstar of the semiconductor memory industry in 2023. The company’s technological competitiveness led to a record increase in HBM sales and a profitable fourth quarter, signaling a rebound in the market.

Vice President Kitae Kim, head of the HBM Sales & Marketing (S&M) department, significantly contributed to HBM’s successful performance by anticipating market changes, responding to customer needs, and increasing profitability. Kim has extensive experience in semiconductor sales and marketing having managed accounts for major global tech companies, where he drove revenue growth and built strong customer relationships.

He has also been a key figure in maintaining SK hynix’s sales even during unstable market conditions. Kim drove the company’s record operating profit in 2018, and has led the sales division’s downturn task force since 2022 to successfully navigate the recession.

In this third installment of interviews with newly appointed executives, the newsroom spoke with Kim about his vision for strengthening SK hynix’s HBM market leadership and future-proofing the company’s sales strategy.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV). There are five generations of HBM, starting with the original HBM and followed by HBM2, HBM2E, HBM3, and HBM3E—an extended version of HBM3.

Striving for Market Dominance Beyond HBM Leadership

Kim attributes early preparation for the AI era as an important factor in HBM’s market success

“As the AI ecosystem expands with the diversification and sophistication of generative AI services, demand is increasing for HBM—a high-performance and high-capacity memory solution. HBM is a revolutionary product which has challenged the notion that semiconductor memory is only one part of an overall system,” he said. “In particular, SK hynix’s HBM has outstanding competitiveness. Our advanced technology is highly sought after by global tech companies.”

Kim emphasized that HBM’s key sales strength is its advanced technology. This is because it is crucial to first secure the technical specifications required by customers to promptly respond to the surging demand for AI memory. He added that his team’s foresight in detecting and preparing for market changes in advance also proved to be highly effective.

“We had been consistently preparing for the onset of the AI era through efforts in both sales and marketing. We proactively established collaborative relationships with our customers and anticipated the market conditions,” he said. “Building on this foundation, SK hynix was able to establish mass-production infrastructure for HBM faster than anyone else, move forward with product development, and quickly achieve market dominance.”

Having established itself as the HBM market leader by pooling its company-wide capabilities, SK hynix plans to maximize this dominance in 2024. To achieve this goal, the HBM Business division was created to bring together all departments including product design, device, development, mass production, and the HBM S&M department which is led by Kim.

Looking ahead, Kim aims to achieve the milestones needed for the company and division to expand positive relationships with customers and promptly respond to market trends.

Fundamental Technical Capabilities & Shortening Time to Market

Kim underscores the importance of technical competitiveness and rapid time to market to gain an edge in the market

“The most challenging period was the industry downturn that began in 2022,” Kim revealed. The combination of this recession with an unstable global landscape made the situation more difficult.

“As the downturn worsened, the situation became increasingly uncertain. It affected our team members, but we rallied together to overcome the challenges,” he said. “On the sales side, we concentrated on improving profitability. To achieve this goal, we focused our sales capabilities on HBM—an AI server and data center-oriented product. In the process, we worked to strengthen our collaboration with clients, focusing on long-term benefits rather than immediate gains. I believe these collective efforts enabled SK hynix to weather the downturn.”

Despite some lingering external uncertainties, Kim believes that the semiconductor memory market is on an upward trend this year. This is in part due to a recovery in demand from global big tech customers. In addition, the application of AI in more areas including on-device² products such as AI-equipped PCs and smartphones is set to boost demand for not only HBM3E, but also for other products such as DDR5 and LPDDR5T.

Kim emphasized that “technical competitiveness is fundamental, but from a sales perspective, shortening the time to market³ (TTM) is key to maintaining market dominance.”

“Proactively securing customer purchase volumes and negotiating more favorable conditions for our high-quality products are the basics of semiconductor sales operations,” Kim said. “With excellent products in hand, it’s a matter of speed. Our planned production volume of HBM this year has already sold out. Although 2024 has just begun, we’ve already started preparing for 2025 to stay ahead of the market.”

²On-Device AI: AI technology that implements AI capabilities on the device itself instead of proceeding with computation in a physically separated server. With on-device AI, AI functions become more responsive and more customized AI services can be provided as smart devices are capable of independently collecting and computing information.
³Time to market (TTM): The length of time required to develop a product from initial conception to when it is released to the market and available for sale.

Delivering Total Solutions to Customers Through ‘One Team’ Synergy

Kim believes the HBM division’s One Team synergy allows SK hynix to provide total AI memory solutions to its customers

Kim acknowledged that while he feels deep pride as the head of the HBM S&M department for the industry’s number one HBM company, he also feels a great sense of responsibility. The HBM S&M department is comprised of three teams: the HBM Sales team that pursues win-win relationships with customers; the HBM Marketing team that discovers optimal pathfinding through market and industry analysis; and the HBM Planning & Intelligence (P&I) team that maximizes sales and profitability by determining the ideal product and supply strategy to lead the market. This unprecedented integration of teams reflects the company’s commitment to becoming a total AI memory provider that leads market change while also being first to provide tailored solutions to customers.

“Semiconductor sales is a position that requires collaboration with major global tech companies,” he said. “To meet our customers’ expectations, it is essential to provide total solutions that encompass not only technology but also elements including quality control, sales, and marketing. To achieve this, we have started optimizing our organizational operations this year. At a time when the direction set by leaders is crucial, I will do my utmost to lead the way in bringing together the capabilities of each team to maximize our One Team synergy.”

Lastly, Kim expressed optimism and confidence for the coming months in a message to his coworkers.

“In 2024, the time for the long-awaited upturn is getting closer,” he said. “In this new era of progress, I will strive to achieve the best results in our business. I hope that everyone at SK hynix can also realize their aspirations this year.”

<Other articles from this series>

New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash

New Leadership Spotlight: SK hynix’s Youngest Exec, Lee Donghun, Discusses Spearheading NAND Flash Development

New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech

Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials

New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era

New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors

New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends

The post New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership first appeared on SK hynix Newsroom.