• Development of PCB01, 5th generation of 8-channel PCIe, to be followed by mass production within this year
• PCB01, industry’s best SSD for PCs, optimized for on-device AI
• Advancement in NAND solution to extend success story of HBM, solidify leadership in AI memory space

Seoul, June 28, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it developed PCB01, an SSD product with the industry’s best specifications, for on-device AI¹ PCs.

The product marks the first case where the industry adopts the fifth generation of the 8-channel² PCIe³ technology and brings innovation to performance including the data processing speed.

¹On-device AI: a technology that implements AI functions on the device itself, instead of going through computation by a physically separated server. A smartphone’s direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service.
²Channel: a route for the input/output of data between a NAND flash and a controller on the SSD. An increase in the number of channels leads to advancement of the PCIe to the next generations and an improvement in the data processing speed. A 4-channel SSD is typically adopted for the conventional PCs, while an 8-channel SSD is for high-performance PC.
³Peripheral Component Interconnect Express (PCle): a serial-structured, high-speed input/output interface used on the motherboard of digital devices

The company expects the latest advancement in the NAND solution space to add to its success stories in the high-performance DRAM area led by HBM, enhancing its leadership in the overall AI memory space.

With a validation process with a global PC customer underway, SK hynix plans to mass produce and start shipping the products to both corporate customers and general consumers within this year.

PCB01 comes with the capabilities of sequential read and write speeds of 14GB and 12GB per second, respectively, bringing the performance of an SSD to the level unseen before. The speeds allow the operation of a large language model⁴, or LLM, for AI training and inference, in a second.

⁴Large language model (LLM): a language model trained on vast amounts of data, which is essential for performance of generative AI tasks such as creating, summarizing, and translating texts.

The product also comes with an improvement in power efficiency of more than 30% compared with the previous generation, enhancing the stability of the large-scale AI computing tasks.

SK hynix also adopted the SLC⁵ caching for the production of PCB01. With the adoption of the technology that places the single-level cell, or SLC, in some parts of the NAND cell to accelerate performance, a PC user can experience a faster performance for both AI services and conventional computing.

The product is also equipped with the capability aimed at protecting personal data. SK hynix engineers built the root of trust⁶, or ROT, a security solution, in the PCB01 to prevent external cybersecurity attacks and forging and falsification of information, while protecting a user’s password.

⁵Single-level cell (SLC): a type of memory cell used in NAND flash that stores one bit of data in a single cell. As the amount of data stored increases, the memory cell becomes a multi-level cell (MLC), a triple-level cell (TLC), and a quad-level cell (QLC). An increase in the data storage means more data can be stored in the same area, but the speed and stability decreases. An SLC enables faster processing of selected data.
⁶Root of Trust (RoT): an area of the hardware that can always be trusted in terms of security, while enabling prevention of forging and falsification of information.

The company plans to launch PCB01 in three capacities – 512GB, 1TB, and 2TB.

Ahn Hyun, Head of the N-S Committee at SK hynix, said that numerous global providers of CPU for on-device AI PCs are requesting collaboration for compatibility validation process. “We will work towards enhancing our leadership as the global top AI memory provider also in the NAND solution space by successfully completing the customer validation and mass production of PCB01, which will be in the limelight.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

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SK hynix’s booth at COMPUTEX Taipei 2024

SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4–7. As one of Asia’s premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme “Connecting AI”. Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

“Connecting AI” With the Industry’s Finest AI Memory Solutions

Themed “Memory, The Power of AI,” SK hynix’s booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products.

SK hynix’s memory solutions with high bandwidth and capacity are optimized for AI servers

HBM3E, the fifth generation of HBM¹, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Another technology which has become crucial for AI servers is CXL^®2 as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5³ (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM⁴ and MCR DIMM⁵. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
³Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁴Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁵Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.

Visitors to the booth could also see some of the company’s enterprise SSDs (eSSD), including the PS1010 and PE9010. In particular, the PCIe⁶ Gen5-based PS1010 is ideal for AI, big data, and machine learning applications due to its rapid sequential read speed. Additionally, SK hynix’s U.S. subsidiary Solidigm strengthened the eSSD lineup by presenting its flagship products D5-P5430 and D5-P5336 that have ultrahigh capacities of up to 30.72 TB and 61.44 TB, respectively.

⁶Peripheral Component Interconnect Express (PCIe): A high-speed input/output interface with a serialization format used on the motherboard of digital devices.

SK hynix offers leading solutions optimized for on-device AI PCs

In line with the growing on-device AI⁷ trend, SK hynix showcased its groundbreaking memory solutions for on-device AI PCs. These included PCB01, a PCIe Gen5 client SSD for on-device AI which offers the industry’s highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s. Alongside PCB01, SK hynix displayed other products optimized for on-device AI PCs, including the next-generation graphic DRAM GDDR7 and LPCAMM2⁸, a module solution that has the performance effect of replacing two existing DDR5 SODIMMs⁹.

⁷On-device AI: The performance of AI computation and inference directly within devices such as smartphones or PCs, unlike cloud-based AI services that require a remote cloud server.
⁸Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁹Small Outline Dual In-line Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s advanced consumer SSD products are changing the storage device game

Attendees could also get a glimpse of SK hynix’s consumer SSD products. Platinum P51 and Platinum P41, highly reliable consumer SSD solutions which offer excellent speed to boost PC performance, were displayed at the show. Set to be mass-produced later in 2024, Platinum P51 utilizes SK hynix’s “Aries”—the industry’s first high-performance in-house controller. Platinum P51 offers sequential read speeds of up to 14 GB/s and sequential write speeds of up to 12 GB/s, nearly doubling the speed specifications of the previous generation Platinum P41. This enables the loading of LLMs¹⁰ required for AI training and inference in less than one second.

¹⁰Large language model (LLM): As language models trained on vast amounts of data, LLMs are essential for performing generative AI tasks as they create, summarize, and translate texts.

An updated version of the portable SSD Beetle X31 was also unveiled at the event. This compact and stylish SSD uses a USB 3.2 Gen 2 interface to reach a rapid operation speed of 10 gigabits per second (Gbps). In addition to the existing 512 GB and 1 TB versions, SK hynix plans to launch the higher-capacity 2 TB version in the third quarter of 2024.

Earlier in May, the outstanding design of SK hynix’s SSD lineup was highlighted when its stick-type SSD Tube T31 and heat sink for Platinum P41, Haechi H02, both won a prestigious 2024 Red Dot Design Award.

Lastly, SK hynix’s ESG strategy was highlighted at the show, including its efforts to enhance the energy efficiency of its products. The company’s range of energy-efficient solutions are particularly suited for improving the sustainability of AI applications, which require significant amounts of power.

Continuing to Push the Boundaries of AI Memory

In line with the theme of COMPUTEX Taipei 2024, SK hynix continues to advance its technologies to help realize a future where “Connecting AI” becomes an everyday reality. The company will continue to participate in global conferences that present the industry’s latest trends to push its AI memory capabilities to greater heights.

The post “Memory, The Power of AI”: SK hynix Showcases Strength of Its Next-Gen Solutions at COMPUTEX Taipei 2024 first appeared on SK hynix Newsroom.

SK hynix’s booth at DTW 2024

SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024 in the heart of Las Vegas from May 20–23. Hosted annually by Dell Technologies, DTW welcomes some of the world’s biggest tech companies to highlight their latest developments, strategies, and visions. In line with DTW 2024’s theme “Accelerate AI Adoption to Unlock Innovation,” SK hynix is showcasing its advanced AI memory and demonstrating these solutions with Dell Technologies’ systems—underlining its strong partnership with the host.

SK hynix showcasing its next-generation AI memory solutions at the event

AI Solutions Set to Lead the Future Memory Ecosystem

Having participated in DTW since 2019, SK hynix has returned to emphasize the power of its high-performance AI memory products including its SSD, HBM¹, and CXL^®2 solutions.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.

SK hynix’s cSSDs which show good compatibility with Dell PCs

The company is displaying its leading enterprise SSD (eSSD) solutions with Dell Technologies’ systems. These include the PCle³ Gen5-based PS1010 and PEB110, which showed positive results with Dell PowerEdge servers. SK hynix is also presenting its latest power-efficient and rapid server DRAM solutions, MCR DIMM⁴ and RDIMM⁵, which are suited for AI computing in high-performance servers.

Regarding client SSD (cSSD) products, PCB01⁶ boasted strong performance with Dell Alienware gaming PCs. Compared to the previous generations of cSSDs that includes PC801 and PC711, PCB01 offers significant enhancements in speed, quality, and power efficiency.

³Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.
⁴Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁵Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁶PCB01: A PCIe fifth-generation SSD that doubles the speed specifications of its previous generation, enabling the loading of large language models required for AI learning and inference in less than one second.

SK hynix’s latest memory products including LPCAMM2 and HBM3E on display

In addition to demonstrations, SK hynix is displaying some of its other next-generation AI memory products. These include LPCAMM2⁷, a solution optimized for on-device AI which offers performance levels equivalent to two DDR5⁸ SODIMMs⁹. The company’s industry-leading HBM3E, which provides exceptional processing speed, capacity, and heat dissipation, is also being presented alongside its corresponding device—H100 GPU.

⁷Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁸Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁹Small Outline Dual Inline Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s CXL^® product CMM-DDR5 can expand system bandwidth and capacity

As another key technology for the AI era, CXL^® is highlighted through a demonstration of the company’s CXL^® Memory Module-DDR5 (CMM-DDR5) with Intel’s server. CMM-DDR5 has attracted attention for its ability to expand system bandwidth and capacity compared to systems only equipped with DDR5 DRAM.

“Dell Technologies is a strong supporter of the CXL^® ecosystem and an advocate of driving CXL^®-based memory standards throughout the industry,” said a Dell Technologies official. “We believe that CXL^®-based memory will prove to be valuable for systems providers and customers, and we are therefore excited to see the product demonstrations of SK hynix’s CMM-DDR5.”

Additionally, the synergy between SK hynix and its U.S. subsidiary Solidigm is highlighted as Solidigm’s SSD is also on display at the booth, which is operated by both companies.

Eung-bo Shim presenting about the impact of CXL^® memory solutions on the memory ecosystem

On the first day of the conference, Technical Leader Eung-bo Shim of the Next-Gen Memory & Storage team gave a talk on how CXL^® memory solutions will pave the way to the future memory ecosystem infrastructure. Such presentation sessions are expected to further the dialogue between SK hynix, its partners, and fellow industry players as the company aims to realize a memory-centric world in the AI era.

Advancing the Partnership With Dell Technologies in the AI Era

As leaders in their respective fields, SK hynix and Dell Technologies have formed a strong partnership that promises more advanced innovations in the future. Both companies are strengthening their efforts in the AI era, building anticipation for further collaborations that will realize faster AI adoption. Looking ahead, SK hynix remains committed to strengthening partnerships that will solidify its AI memory leadership.

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Figure 1. SK hynix’s exhibition booth at the conference

Showcasing the Industry’s Highest Standard of AI Memory

The AI revolution has continued to pick up pace as AI technologies spread their reach into various industries. In response, SK hynix is developing AI memory solutions capable of handling the vast amounts of data and processing power required by AI. At GTC 2024, the company is displaying some of these products, including its 12-layer HBM3E and Compute Express Link (CXL)¹, under the slogan “Memory, The Power of AI”.

¹Compute Express Link (CXL): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.

Figure 2. HBM3E, the highest-specification DRAM for AI applications

HBM3E, the fifth generation of HBM², is the highest-specification DRAM for AI applications on the market. It offers the industry’s highest capacity of 36 gigabytes (GB), a processing speed of 1.18 terabytes (TB) per second, and exceptional heat dissipation, making it particularly suitable for AI systems. On March 19, SK hynix announced it had become the first in the industry to mass-produce HBM3E.

²High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Figure 3. CXL and GDDR7 are set to become key components of AI systems

Displayed alongside HBM3E is CXL, a standardized interface that increases the efficiency of utilizing CPUs, GPUs, accelerators, and memory. CXL is renowned for its ability to expand memory and improve the performance of AI applications. It is therefore set to play a key role in the AI era along with HBM3E. Visitors to SK hynix’s booth can also check out some never-before-seen products, including the next-generation GDDR7 DRAM specialized for video and graphics processing. Compared to its predecessor GDDR6, the latest GDDR³ product offers double the maximum bandwidth (128 GB per second), a 40% improvement in power efficiency, and enhanced visuals due to its expanded memory density. Set to be used in graphics cards and GPUs, GDDR7 will be integral for AI and advanced technologies which require rapid and large-capacity data processing.

³Graphics DDR (GDDR): A standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation shifted from GDDR3, GDDR5 and GDDR5X to GDDR6. It’s now one of the most popular memory chips for AI and big data applications.

Figure 4. A PCB01-based consumer SSD customized for AI

SK hynix also revealed a new consumer product based on its industry-leading Gen 5 solid-state drive (SSD), PCB01. SK hynix plans to complete development of PCB01 in the first half of 2024 and launch two versions which target large technology companies and general consumers by the end of the year.

Technological Insights, Leadership & Collaboration in the AI Era

Figure 5. Technical Leader Seoyeong Jeong talks about the outlook of the HBM market

During the conference, SK hynix also hosted sessions on key AI memory technologies. These included a presentation by Technical Leader Seoyeong Jeong of HBM Marketing which covered the market outlook for HBM and emphasized the importance of memory solutions in the AI era.

Through its activities at GTC 2024, SK hynix underlined its leadership in the AI memory sector. Looking ahead, the company will continue to realize technological breakthroughs and advance AI technology.

The post NVIDIA GTC 2024: SK hynix Presents the Future of AI Memory Solutions first appeared on SK hynix Newsroom.

• • SK hynix will develop PCB01, a PCIe Gen 5 SSD, in the first half of 2024 and launch the product this year
  • The company also presented the industry’s first volume-produced 12-layer HBM3E at GTC 2024
  • PCB01 strengthens SK hynix’s status as the world’s No. 1 AI memory provider in on-device AI as well as HBM

Figure 1. PCB01, SK hynix’s PCIe Gen 5 SSD, is optimized for PC original equipment manufacturers (OEMs)

SK hynix unveiled a new consumer product based on its latest solid-state drive (SSD), PCB01, which boasts industry-leading performance levels at GPU Technology Conference (GTC) 2024. Hosted by NVIDIA in San Jose, California from March 18–21, GTC is one of the world’s leading conferences for AI developers.

Applied to on-device AI¹ PCs, PCB01 is a PCIe² fifth-generation SSD which recently had its performance and reliability verified by a major global customer. After completing product development in the first half of 2024, SK hynix plans to launch two versions of PCB01 by the end of the year which target both major technology companies and general consumers.

¹On-device AI: The performance of AI computation and inference directly within devices such as smartphones or PCs, unlike cloud-based AI services that require a remote cloud server.
²Peripheral Component Interconnect Express (PCIe): A high-speed input/output interface with a serialization format used on the motherboard of digital devices.

Optimized for AI PCs, Capable of Loading LLMs Within One Second

Offering the industry’s highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 doubles the speed specifications of its previous generation. This enables the loading of LLMs³ required for AI learning and inference in less than one second.

³Large language model (LLM): As language models trained on vast amounts of data, LLMs are essential for performing generative AI tasks as they create, summarize, and translate texts.

To make on-device AIs operational, PC manufacturers create a structure that stores an LLM in the PC’s internal storage and quickly transfers the data to DRAMs for AI tasks. In this process, the PCB01 inside the PC efficiently supports the loading of LLMs. SK hynix expects these characteristics of its latest SSD to greatly increase the speed and quality of on-device AIs.

Figure 2. SK hynix’s PCIe Gen 5 SSD PCB01 is optimized for PC OEMs

PCB01 also offers a 30% improvement in power efficiency compared to its previous generation so it can effectively manage power from large-scale AI computations. In addition, SK hynix has applied single-level cell (SLC)⁴ caching technology to the product which enables some of the cells—the storage areas of NAND—to operate as SLCs with fast processing speeds. The technology allows selected data to be quickly read and written, speeding up the operation of AI services and general PC operations.

⁴Single-level cell (SLC): A type of memory cell used in NAND flash that stores one bit of data in a single cell. As the amount of data stored increases, the memory cell becomes a multi-level cell (MLC), a triple-level cell (TLC), and so on. Even though more data can be stored in the same area, the speed and stability decreases. SLC speeds up the processing of selected data.

Jae-yeun Yun, head of NAND Product Planning and Enablement at SK hynix, stated: “PCB01 will not only be highlighted for its use in AI PCs, but this high-performing product will also receive significant attention in the gaming and high-end PC markets,” he said. “Our much-anticipated product will allow us to solidify our position as the global no.1 AI memory provider not only in the HBM field but also in the on-device AI area.”

Figure 3. The PCB01-based product on display at GTC 2024

Alongside its PCB01-based product, SK hynix also introduced its next-generation flagship technologies and solutions at GTC 2024 including its 36 GB 12-layer HBM3E, CXL⁵, and GDDR7⁶. The display of HBM3E, the industry’s first fifth-generation HBM solution, follows the company’s announcement that it has begun volume production of the product. In addition, GDDR7 attracted much attention for doubling its bandwidth and improving its power efficiency by 40% compared to its predecessor GDDR6.

⁵Compute Express Link (CXL): An integrated interface that connects multiple devices such as memory, CPUs, GPUs, and accelerators all at once.
⁶GDDR7: The 7th generation of graphics memory that supports GPUs to work faster and more efficiently.

On top of presenting its world-class portfolio, SK hynix also held presentation sessions at GTC 2024. Technical Leader Seoyeong Jeong of HBM Marketing gave a talk titled “The Outlook of the HBM Market” where she shared insights on the importance of AI memory and its core technologies.

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