• Development of 61TB product based on QLC technology, strengthening synergy with Solidigm in the AI data center SSD market
• Data transfer speed of up to 32GT/s with PCIe 5.0, with doubled sequential read performance compared to PCIe 4.0 products
• SK hynix to build a foundation for growth to become a full-stack AI memory provider with leadership in high-capacity eSSD technology

Seoul, December 18, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has completed development of its high-capacity SSD product, ‘PS1012 U.2¹’, designed for AI data centers.

¹U.2: A type of Form Factor for SSDs, typically 2.5 inches in size, primarily used in servers or high-performance workstations. It is known for large capacity storage and high durability.

As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC² technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61TB product using this technology and introduced it to the market.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.

SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies.

With the latest 5th generation (Gen5) PCIe³, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32GT/s (Giga-transfers per second)⁴, with the sequential read performance of 13GB/s (Gigabyte per second), which is twice that of previous generation products.

³Peripheral Component Interconnect express (PCIe): A high-speed input/output interface with a serial structure used on the main board of a digital device.
⁴Giga-transfers per second (GT/s): Number of operations or information transferred per second

In addition, the company developed this product to support the OCP 2.0 version, enhancing its compatibility with various data center server devices of global AI customers.

⁵Open Compute Project (OCP): An international consultative body that involves major data center companies around the world to discuss hardware, software and eSSD standards for building ultra-high-efficiency data centers.

SK hynix plans to supply the sample of the new product to global server manufacturers within this year for product evaluation, and based on this, it plans to expand its product line to 122TB in the third quarter of next year. The company also aims to lead the SSD market for ultra-high capacity data centers by developing 244TB products based on the world’s highest 321-high 4D NAND developed in November, to overcome the capacity limitations of eSSD.

“SK hynix and Solidigm are strengthening our QLC-based high-capacity SSD lineup to solidify our technological leadership in NAND solutions for AI,” said Ahn Hyun, President and Chief Development Officer of SK hynix. “In the future, we will lay the foundation for growth to become a Full Stack AI memory provider by meeting the diverse needs of AI data center customers based on our high competitiveness in the eSSD field.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix Develops ‘PS1012 U.2’, High Capacity SSD for AI Data Centers first appeared on SK hynix Newsroom.

• Development of PCB01, 5th generation of 8-channel PCIe, to be followed by mass production within this year
• PCB01, industry’s best SSD for PCs, optimized for on-device AI
• Advancement in NAND solution to extend success story of HBM, solidify leadership in AI memory space

Seoul, June 28, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it developed PCB01, an SSD product with the industry’s best specifications, for on-device AI¹ PCs.

The product marks the first case where the industry adopts the fifth generation of the 8-channel² PCIe³ technology and brings innovation to performance including the data processing speed.

¹On-device AI: a technology that implements AI functions on the device itself, instead of going through computation by a physically separated server. A smartphone’s direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service.
²Channel: a route for the input/output of data between a NAND flash and a controller on the SSD. An increase in the number of channels leads to advancement of the PCIe to the next generations and an improvement in the data processing speed. A 4-channel SSD is typically adopted for the conventional PCs, while an 8-channel SSD is for high-performance PC.
³Peripheral Component Interconnect Express (PCle): a serial-structured, high-speed input/output interface used on the motherboard of digital devices

The company expects the latest advancement in the NAND solution space to add to its success stories in the high-performance DRAM area led by HBM, enhancing its leadership in the overall AI memory space.

With a validation process with a global PC customer underway, SK hynix plans to mass produce and start shipping the products to both corporate customers and general consumers within this year.

PCB01 comes with the capabilities of sequential read and write speeds of 14GB and 12GB per second, respectively, bringing the performance of an SSD to the level unseen before. The speeds allow the operation of a large language model⁴, or LLM, for AI training and inference, in a second.

⁴Large language model (LLM): a language model trained on vast amounts of data, which is essential for performance of generative AI tasks such as creating, summarizing, and translating texts.

The product also comes with an improvement in power efficiency of more than 30% compared with the previous generation, enhancing the stability of the large-scale AI computing tasks.

SK hynix also adopted the SLC⁵ caching for the production of PCB01. With the adoption of the technology that places the single-level cell, or SLC, in some parts of the NAND cell to accelerate performance, a PC user can experience a faster performance for both AI services and conventional computing.

The product is also equipped with the capability aimed at protecting personal data. SK hynix engineers built the root of trust⁶, or ROT, a security solution, in the PCB01 to prevent external cybersecurity attacks and forging and falsification of information, while protecting a user’s password.

⁵Single-level cell (SLC): a type of memory cell used in NAND flash that stores one bit of data in a single cell. As the amount of data stored increases, the memory cell becomes a multi-level cell (MLC), a triple-level cell (TLC), and a quad-level cell (QLC). An increase in the data storage means more data can be stored in the same area, but the speed and stability decreases. An SLC enables faster processing of selected data.
⁶Root of Trust (RoT): an area of the hardware that can always be trusted in terms of security, while enabling prevention of forging and falsification of information.

The company plans to launch PCB01 in three capacities – 512GB, 1TB, and 2TB.

Ahn Hyun, Head of the N-S Committee at SK hynix, said that numerous global providers of CPU for on-device AI PCs are requesting collaboration for compatibility validation process. “We will work towards enhancing our leadership as the global top AI memory provider also in the NAND solution space by successfully completing the customer validation and mass production of PCB01, which will be in the limelight.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix Develops PCB01 for Artificial Intelligence PCs first appeared on SK hynix Newsroom.

SK hynix showcased its next-generation memory semiconductor technologies and solutions at the OCP Global Summit 2023 held in San Jose, California from October 17–19.

The OCP Global Summit is an annual event hosted by the world’s largest data center technology community, the Open Compute Project (OCP), where industry experts gather to share various technologies and visions. This year, SK hynix and its subsidiary Solidigm showcased advanced semiconductor memory products that will lead the AI era under the slogan “United Through Technology”.

▲ Figure 1. SK hynix’s exhibition booth at the OCP Global Summit 2023

At the Booth: Leading Global AI Memory Technologies in the Spotlight

▲ Figure 2. HBM(HBM3/HBM3E), MCR DIMM, DDR5 RDIMM, and LPDDR CAMM products on display at SK hynix’s booth

SK hynix presented a broad range of its solutions at the summit, including its leading HBM¹(HBM3/3E), CXL², and AiM³ products for generative AI. The company also unveiled some of the latest additions to its product portfolio including its DDR5 RDIMM, MCR DIMM, enterprise SSD (eSSD), and LPDDR CAMM⁴ devices.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
²Compute Express Link (CXL): A next-generation memory solution that increases the memory bandwidth of server systems with traditional DRAM products to improve performance and easily expand memory capacity.
³Accelerator in Memory (AiM): SK hynix’s PIM semiconductor product name, which includes GDDR6-AiM.
⁴Low Power Double Data Rate Compression Attached Memory Module (LPDDR CAMM): A solution developed based on the LPDDR package in line with the next-generation memory standard (CAMM) for laptops and mobile devices. Compared to conventional So-DIMM modules, LPDDR CAMM has a single-sided configuration which is half as thick and offers improved capacity and power efficiency.

Visitors to the HBM exhibit could see HBM3, which is utilized in NVIDIA’s H100, a high-performance GPU for AI, and also check out the next-generation HBM3E. Due to their low-power consumption and ultra-high-performance, these HBM solutions are more eco-friendly and are particularly suitable for power-hungry AI server systems.

▲ Figure 3. CXL-based CMS 2.0, pooled memory, and memory expander solutions being demonstrated at the event

Three of SK hynix’s key CXL products were demonstrated at the event, including its CXL-based computational memory solution (CMS)⁵ 2.0. A next-generation memory solution that integrates computational functions into CXL memory, CMS 2.0 uses NMP⁶ to minimize data movement between the CPU and memory. CMS 2.0 was applied to SK Telecom’s spatial data analysis and visualization solution based on Lightning DB which analyzes foot traffic in real time, illustrating CMS 2.0’s data processing power equivalent to a server CPU. Moreover, the demonstration highlighted that CMS 2.0 can improve data processing performance and energy efficiency.

⁵Computational Memory Solution (CMS):  A memory solution that offers the functions of machine learning and data filtering, which are frequently performed by big data analytics applications. Just like CXL, CMS’s memory capacity is highly scalable.
⁶Near-Memory Processing (NMP): A memory architecture which moves the compute capability next to the main memory to address CPU memory bottlenecks and improve processing performance.

The company also demonstrated its CXL-based pooled memory solution which can significantly reduce idle memory usage and shorten the overhead time of data movement in distributed processing environments such as AI and big data. The demonstration, which featured a technological collaboration with software provider MemVerge, showcased how CXL-based pooled memory solutions can improve system performance in AI and big data distributed processing systems.

Additionally, SK hynix demonstrated its CXL-based memory expander applied to Meta’s software caching engine, CacheLib, which showed how the CXL-based memory solution optimizes software for improved performance and cost savings.

▲ Figure 4. PIM and AiMX on display at the summit

AiM, a game-changing technology that redefines memory’s role in AI inference, was also presented at the booth. A subset of SK hynix’s PIM⁷ portfolio, AiM promises to revolutionize machine learning, high-performance computing, and big data applications while reducing operating costs. The company demonstrated its GDDR6-AiM, a solution which incorporates computational capabilities into the memory and improves the performance and efficiency of data-intensive generative AI inference systems. Additionally, a demonstration was held for the prototype of AiMX⁸, an innovative generative AI accelerator card based on GDDR6-AiM.

⁷Processing-In-Memory (PIM): An advanced technology that combines computational capabilities and memory within just one die to perform the best computing capability.
⁸Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card featuring a GDDR6-AiM chip which is specialized for large language models.

▲ Figure 5. PS1010 E3.S, a PCIe Gen5 eSSD product, showcased at the booth

SK hynix also showcased the PS1010 E3.S, a PCIe (Peripheral Component Interconnect Express) Gen5-based eSSD. Designed for data-intensive applications, cloud computing, and AI workloads, the PS1010 E3.S promises improved performance and reliability with superior speed and lower carbon emissions compared to previous generations.

At the Sessions: Sharing Industry Insights & Key Technologies

▲ Figure 6. SK hynix’s Hoshik Kim, fellow of the System Architecture Group in Memory Forest x&D, holds a session on CXL technology

Through thought-provoking talks and sessions at the summit, SK hynix also suggested the future development of next-generation memory solutions.

In a panel session titled “Data Central Computing, Present and Future”, Hoshik Kim, fellow of the System Architecture Group in Memory Forest x&D, joined other industry experts to omputing and programming models. Kim also held an executive session in which he revealed SK hynix’s progress in developing CXL technology and shared the company’s vision under the theme of “CXL: A Prelude to a Memory-Centric Computing”.

▲ Figure 7. SK hynix’s Youngpyo Joo, Dongwuk Moon and Jungmin Choi of Memory Forest x&D giving talks on CXL-based solutions

The potential of CXL was also the focal point of three other sessions held by the company’s employees from the Memory x&D department. Youngpyo Joo, head of the Software Solutions Group, explored how CXL-based computational memory solution architecture can offer increased usability and flexibility.

Meanwhile, Donguk Moon, technical leader of the Platform Software team, introduced how emerging CXL devices can enhance memory capacity and bandwidth at the caching layer for technologies such as AI and web services. In addition, Jungmin Choi, technical leader of the Composable Memory team, covered how the latest CXL technology will further support the disaggregation of memory. Choi also emphasized that this technology can not only solve problems currently faced by data centers such as idle memory, but also improve system performance.

▲ Figure 8. Euicheol Lim, head of SK hynix’s Memory Solution Product Design Group, discusses PIM-based AiM and PIM technologies

In another engaging session, Euicheol Lim, head of the Memory Solution Product Design Group, explored the potential for PIM technology to meet the high memory and computational demands of AI. Lim highlighted key technologies based on PIM, including SK hynix’s PIM-based AiM accelerator.

Advanced Solutions to Unlock Next-Generation Technologies

As the OCP Global Summit 2023 drew to a close, SK hynix reinforced its commitment to developing groundbreaking solutions which can help realize advanced technologies such as AI. Going forward, the company will continue to tackle industry challenges and make technological breakthroughs for the AI era as the global no.1 AI memory solution provider.

The post SK hynix Displays Next-Gen Solutions Set to Unlock AI & More at OCP Global Summit 2023 first appeared on SK hynix Newsroom.

Figure 1. SK hynix’s booth at FMS 2023 featured some of the company’s latest products and technologies

As the world’s largest memory and storage trade show, the annual Flash Memory Summit (FMS) is renowned for exhibiting revolutionary high-speed memory and SSD products. At FMS 2023 held August 8^th-10^th at the Santa Clara Convention Center in California, SK hynix continued this legacy of innovation by showcasing groundbreaking memory solutions under the slogan “United Through Technology”. During the event, executives from SK hynix gave a keynote speech to share the companies’ developments in the memory sector.

Leading 4D NAND Solutions Key to the Multimodal AI Era

Figure 2. SK hynix’s EVP and Head of NAND development Jungdal Choi and EVP and Head of Solution Development Hyun Ahn during their keynote speech

On August 8^th, SK hynix’s EVP and Head of NAND development Jungdal Choi along with EVP and Head of Solution Development Hyun Ahn gave a keynote speech titled “Industry-Leading 4D NAND Technology and Solutions Enabling the Multimodal AI¹ Era”.

¹Multimodal AI: Combines various data types (image, text, speech, numerical data, etc.) with multiple intelligence processing algorithms to achieve higher performance levels.

Choi revealed that the company is currently developing the world’s first 321-layer NAND product, the fifth generation of 4D NAND. Choi said that the new product, which is the first in the industry to exceed 300 layers, is set to help the company solidify its technological leadership in NAND. Meanwhile, Ahn introduced the company’s ultra-high performance UFS 4.0 and PCIe 5^th generation (Gen5) SSD products for use in data centers and PCs. The continuous development of SSD products is essential as they are set to become an essential storage solution for application with multimodal AI, which analyzes and calculates vast amounts of data on various platforms. The pair concluded by stating that SK hynix is committed to supporting multimodal AI and other advanced technologies by developing next-generation PCIe Gen6 SSDs and UFS 5.0 memory-based products.

Breaking Barriers: Unveiling Pioneering 4D NAND & SSD Solutions

Figure 3. SK hynix’s product line-up, including its 4D NAND solutions, were on display

SK hynix is continually looking to advance its 4D NAND technology in terms of performance and reliability. The company’s development of the industry’s first 96-layer 4D NAND based on charge trap flash² (CTF) in 2018 became a launchpad for further innovations, leading to the development of its 238-layer 4D NAND four years later in another industry first. Continuing this line of industry firsts, SK hynix showcased samples of its 321-layer 1 Tb 4D NAND, which offers a 59% improvement in productivity compared with the previous generation 238-layer, 512 Gb NAND chips. This improvement was realized by technological developments that enabled the stacking of more cells and a larger storage capacity on a single chip, thereby increasing the total capacity of a single wafer.

The groundbreaking 321-layer NAND product was later presented at SK hynix’s booth along with other NAND solutions, including the company’s PCle³ Gen5 enterprise SSD (eSSD) called PS1030 which utilizes V7 NAND. The PS1030, which was applied to a supermicro server for the demonstration, delivers the fastest sequential read speed in the industry—14,800 MB/s. It also offers a random read performance of 3,300 kIOPS⁴, highlighting its specifications as a high-performance eSSD.

²Charge trap flash (CTF): Unlike floating gate, which stores electric charges in conductors, CTF stores electric charges in insulators, which eliminates interference between cells, improving read and write performance while reducing cell area per unit compared to floating gate technology.

³Peripheral Component Interconnect Express (PCle): A serial-structured, high-speed input/output interface used on the motherboard of digital devices.

⁴Thousand Input/Output Operations Per Second (kIOPS): A measure of how many read and write operations a storage device can perform in a second.

Visitors to the SK hynix booth could also see another one of the company’s SSDs, the PCIe Gen4 PC811.  Applied to a PC for the demonstration, the PC811 is SK hynix’s first V8 NAND-based mainstream client SSD (cSSD). Other SSDs on show included its high-speed Platinum P41, ultra-low power Gold P31, and the company’s first portable SSD for consumers, SK hynix Beetle X31.

Unleashing the Power of HPC With KV-CSD

Figure 4. SK hynix’s Woosuk Chung, team leader for the Computational Storage department, held a session on KV-CSD, which was also displayed at the company’s booth

SK hynix also held the second demonstrations of its pioneering Key Value Store Computational Storage Device (KV-CSD) following on from its debut at last year’s FMS. Co-developed with U.S.-based Los Alamos National Laboratory (LANL), the KV-CSD is a next-generation intelligent storage product which improves write and read capabilities for high performance computing (HPC).

The impact of the KV-CSD was discussed in a session on August 10^th by SK hynix’s Woosuk Chung, team leader for the Computational Storage department. Titled “Architecture of a Query Accelerating KV-CSD in a HPC System”, the talk revealed how the new KV-CSD overcomes the limitations of software key-value stores.

High-Performance Mobile and Automotive Solutions

Figure 5. SK hynix’s mobile and automotive solutions

SK hynix also exhibited its technologies for the mobile and automotive sectors at FMS 2023. The company’s line-up of V7 512 Gb universal flash storage⁵ (UFS) products was on display, including those based on UFS 2.2, UFS 3.1, and UFS 4.0—the latest specification which offers enhanced bandwidth speed and efficiency. Additionally, the company’s universal multichip package⁶ (uMCP), which combines its mobile DRAM LPDDR and UFS, was also presented at the booth.

Moving to solutions for the automotive market, SK hynix’s LPDDR5X mobile DRAM and HBM2E DRAM were among the products displayed as they are essential components of Advanced Driver Assistance Systems (ADAS)⁷. The HBM2E highlights SK hynix’s strength in the automotive sector as it is the only company to develop HBM products specifically for the industry. As well as ADAS, SK hynix’s automotive solutions support other functions. For example, its eMMC 5.1 embedded multimedia card is utilized for in-car connectivity, while its UFS 3.1-based and SSD products are applied for in-vehicle infotainment and storage, respectively.

⁵Universal Flash Storage (UFS): A breakthrough type of flash memory that can simultaneously read and write data. Due to its low-power consumption, high-performance and reliability, UFS is widely applied in mobile devices.

⁶Universal multichip package (uMCP): A multi-chip package that combines DRAM and NAND flash into one product.

⁷Advanced Driver Assistance Systems (ADAS): A system that utilizes various technologies to help drivers in routine navigation and parking without fully automating the process.

Never Standing Still

SK hynix always has one eye on the future, and this was exemplified during its successful time at FMS 2023. Despite already offering a range of industry-leading solutions, the company will not rest on its laurels as it aims to further improve it line-up of NAND and other high-performance memories in the future.

The post FMS 2023: SK hynix Showcases World’s First 321-Layer NAND Samples & Storage Solutions first appeared on SK hynix Newsroom.

The Open Compute Project (OCP) is an initiative that proposes a new direction in which both software and hardware disciplines are tightly connected in order to efficiently address the increasing requirements of compute infrastructure. It gathers major decision-makers, technologists, engineer developers, and suppliers to exchange insights, discuss challenges, and provide solutions in and around the data center.

The OCP is also characterized by open source and open collaboration, with a global committee covering everywhere from the telecommunications industry to edge infrastructure, and everything in between.

The OCP Global Summit, held in the Fall each year, provides a unique opportunity to see and explore the various ways in which the data center industry is innovating and evolving. SK hynix attended the 2022 OCP Global Summit in San Jose, California, from October 18 to 20, to demonstrate its latest products, technologies, and ideas.

SK hynix, a Proud Supporter of OCP

Image 1. SK hynix’s booth at OCP Global Summit 2022 drew enthusiasm from participants and visitors

As a Ruby Sponsor, SK hynix set up a booth at OCP with the theme “Driving New Level of Performance for your Ultimate Data Experience,” showcasing latest research developments in next-generation memory technologies. Having attended every year since 2016, this year’s event was particularly memorable as it reverted to a face-to-face format for the first time since the Covid pandemic began.

At the event, the company unveiled the PCIe Gen5 PS1010 for the first time as well as highlighted offerings such as the DDR5 DRAM-based CXL (Compute Express Link) memory solution and next-generation intelligent semiconductor GDDR6-AiM, demonstrating how the company has truly become a total solution provider.

Demonstrating a Complete Solution Portfolio

Image 2. SK hynix demonstrated a portfolio of products on-site at the OCP Global Summit 2022 including a first look at PS1010

Four products were demonstrated by SK hynix at the OCP Global Summit 2022, starting with the PS1010. The PS1010 is a PCle (Peripheral Component Interconnect Express) Gen5 total solution product that handles all SoC/DRAM/NAND and operations in-house, with data transfer speeds more than doubling over the previous generation due to the usage of the PCIe Gen5 interface. It was the first time SK hynix unveiled the product, emphasizing its use of industry-leading V7 NAND to ensure cost and performance competitiveness.

Second to be featured was the company’s DDR5 DRAM-based CXL memory solution that integrates computational functions into CXL memory for the first time in the industry. The solution is expected to be installed on next-generation server platforms in order to improve system performance and energy efficiency.

Third, a sample of the EDSFF (Enterprise & Data Center Standard Form Factor) E3.S was demonstrated following the announcement of the development of the latest DDR5 24Gb DRAM-based 96GB CXL memory sample. The combination of DDR5 and CXL memory was shown to reduce memory execution time by 20% and increase bandwidth by 50%, resulting in a 60% memory capacity expansion impact.

Finally, a sample of GDDR6-AiM (Accelerator in Memory) demonstrated the behavior of a huge AI model aimed at memory-centric computing. GDDR6-AiM combines processing function onto a typical DRAM, and can reduce energy consumption by up to 80% while providing up to 16 times the performance and lower operating voltage.

Thought Leadership in Memory Solutions

Image 3. Thomas Won Ha Choi sharing SK hynix’s perspective on the value of its new CXL memory

Besides the demonstrations that attracted a great deal of attention, SK hynix also participated in three session discussions at the OCP Global Summit. Thomas Won Ha Choi, Director of DRAM Product Planning at SK hynix, shared the company’s perspective on the new value of CXL memory, as well as its vision for planning and enabling the future development of robust CXL memory. He presented SK hynix’s various memory solutions to provide examples of how CXL devices can enhance memory system values.

Image 4. Donguk Moon introduces SK hynix’s CXL-based CMS at his session discussion

Donguk Moon, SK hynix’s Senior Technical Program Manager for Memory System Research, also introduced SK hynix’s CXL-based CMS, as well as collaboration with SK Telecom, one of Korea’s major telecommunications companies, to improve their Lightning DB real-time data management system by incorporating CMS into it.

A Future-Oriented Approach to Data Center Research

While SK hynix has concluded its successful participation in the OCP Global Summit this year, the company’s research continues, beyond the contents presented in the last few days. Next year, SK hynix looks forward to continuing to present important development achievements and new products for the future.

Observing the enthusiasm and passion shown by participants and visitors was inspiring, and further motivates SK hynix’s determination to serve as the ultimate total solution provider for the data center industry.

The post SK hynix Successfully Establishes Itself as a Total Solution Provider at OCP Global Summit 2022 first appeared on SK hynix Newsroom.