SK hynix participated in Dell Technologies World (DTW) 2023 in Las Vegas, USA for four days between May 22-25 to showcase its latest memory technologies and products.

SK hynix’s booth at DTW 2023

DTW is the largest annual event hosted by Dell Technologies that brings together various global IT companies to unveil their latest developments that will drive future technology trends. This year’s slogan from SK hynix “Don’t bet on luck, bet on our Tech!” evokes the spirit of the host city Las Vegas and emphasizes the message that the company will continue creating and exploring diverse technologies for the new era of big data.

SK hynix, which has participated in the event since 2019, presented a variety of its latest technologies and products. First, the company unveiled PS1010, a PCIe¹ Gen5-based eSSD that will be applied to Dell Technologies’ server products. The company also demonstrated the performance of its new cSSD, PC801, in a Dell desktop to showcase the company’s evolving technology.

¹ Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.

SK hynix showcasing its CXL memory and HBM3

In addition, SK hynix displayed its CXL² memory through a demonstration on a real server and held a joint exhibition of its HBM3³ and NVIDIA’s H100 GPU. Used for AI chatbots, NVIDIA’s H100 GPU has adopted HBM3 to realize next-generation performance levels.

² Compute Express Link (CXL): A PCIe-based, next-generation interconnect protocol to effectively establish high-performance computing systems.

³ High Bandwidth Memory (HBM): A high-value, high-performance memory solution that vertically interconnects multiple DRAM chips with TSV to dramatically increase the data processing speed in comparison to traditional DRAM products. HBM3 is the fourth-generation product, succeeding the previous generations HBM, HBM2 and HBM2E.

Throughout the event, SK hynix provided visitors with a look at its diverse portfolio of solutions including several DRAM product lines such as its DDR5 modules for servers and PCs, LPDDR5X for mobile devices, and GDDR6 graphics memory. Other products included eSSDs with various form factors like E1.S, U.2, M.2 22110, and M.2 2280. New cSSDs such as PC801 and BC901 were on display as well, while Consumer SSDs such as P31 and P41 were also featured in the booth. Additionally, SK hynix presented PCIe Gen4 NVMe⁴-based enterprise and cSSDs from its subsidiary company, Solidigm.

⁴ Non-Volatile Memory Express (NVMe): As a communication protocol for storage devices based on the PCIe interface, NVMe can achieve speeds of up to six times or more compared to the existing SATA interface—making it suitable for ultra-high speed, large data processing tasks.

Eung-bo Shim, a technical leader in charge of next-generation memory development, presenting the concept and strengths of CXL memory

SK hynix went on to hold a breakout session that introduced the role and future of its CXL memory technology. “CXL memory is a solution that increases the bandwidth compared to existing DRAM products to improve performance. This technology enables the capacity to be expanded more easily than ever before and will soon become commercially available,” said Eung-bo Shim,  a technical leader responsible for next-generation memory development at SK hynix. “As a product that has strengths in reliability, security and maintenance, it will be used in various servers in the future.”

By attending global events like DTW down the road, SK hynix plans to continue strengthening its partnerships with key customers and introducing its new products on the world stage.

The post SK hynix Showcases Its Next-Generation Technologies at Dell Technologies World 2023 first appeared on SK hynix Newsroom.

• Core and brand-new products introduced under the theme of “Green Digital Solution”
• Introduction of eSSD with ultrahigh-performance to solidify SK hynix’s leadership in server memory market
• Solution to solve customers’ pain point proposed

Seoul, December 27, 2022

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan 5^th through Jan 8^th.

The products, introduced under the theme of the “Green Digital Solution,” as part of the SK Group’s “Carbon-Free Future” campaign, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES2023 will meet customers’ such needs with outstanding performance per watt* and performance.

* Performance per watt: an indicator of how much computation is performed per watt of power consumed.

The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe* interface.

*PCIe (Peripheral Component Interconnect Express): a high-speed input/output series interface used in the mainboard of digital devices. PCIe’s data-tranfer speed doubles in accordance with a generation shift.

SK hynix said that the introduction of the PS1010, a combination of the company’s industry-leading technologies, was made timely as the server chip market continues to grow despite the current industry downturn.

The PS1010 product shows improvement both in reading and writing speed by 130% and 49%, respectively, compared with the previous generation. Its performance-per-watt is also improved by more than 75%, helping customers reduce costs to run servers and carbon emission.

“We’re proud to launch PS1010, an ultrahigh-performance product with self-developed controller and firmware, at the CES 2023, the world’s largest technology show,” Yun Jae Yeun, Head of NAND Product Planning, said. “This product will solve pain point of our server-chip customers, while paving the way for a stronger competitiveness in NAND business for us.”

Other products to be introduced at the show are HBM3*, a memory product with the world’s best specification for high performance computing, GDDR6-AiM that adopts the PIM* technology and CXL* memory capable of flexible expansion of memory capacity and performance.

* HBM (High Bandwidth Memory): High-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.

* PIM (Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI and big data by adding computational functions to semiconductor memory

* CXL (Compute Express Link): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based

SK hynix will also present the immersion cooling* technology of SK enmove, which specializes in energy efficiency. The technology, designed to help cool down the heat of the servers generated during the operation, marks a successful case where SK hynix cooperated with other SK companies or external business partners to create new values in the semiconductor business.

* Immersion Cooling: A next-generation thermal-management technology that cools down temperature by submerging data servers into cooling oil. This way, the total electricity consumption can be reduced by 30% compared with the existing technology that uses air to cool down temperature.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Jaehwan Kevin Kim
E-Mail: global_newsroom@skhynix.com

The post SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023 first appeared on SK hynix Newsroom.

The Open Compute Project (OCP) is an initiative that proposes a new direction in which both software and hardware disciplines are tightly connected in order to efficiently address the increasing requirements of compute infrastructure. It gathers major decision-makers, technologists, engineer developers, and suppliers to exchange insights, discuss challenges, and provide solutions in and around the data center.

The OCP is also characterized by open source and open collaboration, with a global committee covering everywhere from the telecommunications industry to edge infrastructure, and everything in between.

The OCP Global Summit, held in the Fall each year, provides a unique opportunity to see and explore the various ways in which the data center industry is innovating and evolving. SK hynix attended the 2022 OCP Global Summit in San Jose, California, from October 18 to 20, to demonstrate its latest products, technologies, and ideas.

SK hynix, a Proud Supporter of OCP

Image 1. SK hynix’s booth at OCP Global Summit 2022 drew enthusiasm from participants and visitors

As a Ruby Sponsor, SK hynix set up a booth at OCP with the theme “Driving New Level of Performance for your Ultimate Data Experience,” showcasing latest research developments in next-generation memory technologies. Having attended every year since 2016, this year’s event was particularly memorable as it reverted to a face-to-face format for the first time since the Covid pandemic began.

At the event, the company unveiled the PCIe Gen5 PS1010 for the first time as well as highlighted offerings such as the DDR5 DRAM-based CXL (Compute Express Link) memory solution and next-generation intelligent semiconductor GDDR6-AiM, demonstrating how the company has truly become a total solution provider.

Demonstrating a Complete Solution Portfolio

Image 2. SK hynix demonstrated a portfolio of products on-site at the OCP Global Summit 2022 including a first look at PS1010

Four products were demonstrated by SK hynix at the OCP Global Summit 2022, starting with the PS1010. The PS1010 is a PCle (Peripheral Component Interconnect Express) Gen5 total solution product that handles all SoC/DRAM/NAND and operations in-house, with data transfer speeds more than doubling over the previous generation due to the usage of the PCIe Gen5 interface. It was the first time SK hynix unveiled the product, emphasizing its use of industry-leading V7 NAND to ensure cost and performance competitiveness.

Second to be featured was the company’s DDR5 DRAM-based CXL memory solution that integrates computational functions into CXL memory for the first time in the industry. The solution is expected to be installed on next-generation server platforms in order to improve system performance and energy efficiency.

Third, a sample of the EDSFF (Enterprise & Data Center Standard Form Factor) E3.S was demonstrated following the announcement of the development of the latest DDR5 24Gb DRAM-based 96GB CXL memory sample. The combination of DDR5 and CXL memory was shown to reduce memory execution time by 20% and increase bandwidth by 50%, resulting in a 60% memory capacity expansion impact.

Finally, a sample of GDDR6-AiM (Accelerator in Memory) demonstrated the behavior of a huge AI model aimed at memory-centric computing. GDDR6-AiM combines processing function onto a typical DRAM, and can reduce energy consumption by up to 80% while providing up to 16 times the performance and lower operating voltage.

Thought Leadership in Memory Solutions

Image 3. Thomas Won Ha Choi sharing SK hynix’s perspective on the value of its new CXL memory

Besides the demonstrations that attracted a great deal of attention, SK hynix also participated in three session discussions at the OCP Global Summit. Thomas Won Ha Choi, Director of DRAM Product Planning at SK hynix, shared the company’s perspective on the new value of CXL memory, as well as its vision for planning and enabling the future development of robust CXL memory. He presented SK hynix’s various memory solutions to provide examples of how CXL devices can enhance memory system values.

Image 4. Donguk Moon introduces SK hynix’s CXL-based CMS at his session discussion

Donguk Moon, SK hynix’s Senior Technical Program Manager for Memory System Research, also introduced SK hynix’s CXL-based CMS, as well as collaboration with SK Telecom, one of Korea’s major telecommunications companies, to improve their Lightning DB real-time data management system by incorporating CMS into it.

A Future-Oriented Approach to Data Center Research

While SK hynix has concluded its successful participation in the OCP Global Summit this year, the company’s research continues, beyond the contents presented in the last few days. Next year, SK hynix looks forward to continuing to present important development achievements and new products for the future.

Observing the enthusiasm and passion shown by participants and visitors was inspiring, and further motivates SK hynix’s determination to serve as the ultimate total solution provider for the data center industry.

The post SK hynix Successfully Establishes Itself as a Total Solution Provider at OCP Global Summit 2022 first appeared on SK hynix Newsroom.