SK hynix participated in SEMICON^® Korea 2025, held at COEX in Seoul from February 19–21, sharing insights into semiconductor technology trends and reinforcing its AI memory leadership.

Organized by SEMI¹, SEMICON Korea has grown to become the country’s largest semiconductor exhibition since its launch in 1987. The event brings together semiconductor manufacturers, along with materials, components, and equipment companies, to exchange the latest technologies and trends. This year’s exhibition, themed “Lead the Edge to the New Era,” featured various exhibits and presentations which explored the technological edge needed to drive AI innovation.

¹SEMI: The global industry association with over 3,000 member companies worldwide across the semiconductor and electronics design and manufacturing supply chain.

Sharing Industry Expertise & Strengthening Collaboration

At the event, SK hynix experts provided insights on various topics ranging from next-generation memory to sustainable manufacturing technology.

These presentations covered emerging memory² technologies such as SOM³, HBM⁴ stacking technology, and advanced manufacturing methods. The employees also gave talks on fab automation, digital twin⁵ applications, and the company’s net zero initiatives, highlighting SK hynix’s commitment to innovation and sustainability.

²Emerging memory: A new class of memory technologies that differ from traditional DRAM and NAND flash, including RRAM, MRAM, PCM, and FeRAM.
³Selector-Only Memory (SOM): A cross-point memory device that integrates both selector and memory functions using a dual-function material (DFM).
⁴High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
⁵Digital twin: A technology that creates a virtual replica of a physical object, allowing simulations to predict real-world outcomes.

Meanwhile, SK hynix CEO Kwak Noh-Jung, in his capacity as Chairman of the Korea Semiconductor Industry Association (KSIA), attended the leadership dinner on the first day of the exhibition. Kwak engaged with global semiconductor leaders and executives at the dinner, fostering stronger industry collaboration and partnerships.

During his congratulatory speech, Kwak emphasized the growing need for the semiconductor industry to adapt in the AI era and meet future challenges and opportunities.

“Semiconductors are a crucial resource that drives both the global economy and national security. Their importance has grown even further in the AI era,” he said.

“In line with this year’s theme, Lead the Edge to the New Era, companies across the industry need to continue expanding new technologies and possibilities to prepare for the future.”

Leading the New Era

At SEMICON Korea 2025, SK hynix underscored its pivotal role in shaping the future of semiconductor technology. By sharing insights on cutting-edge memory technologies and sustainable practices, the company not only reinforced its AI memory leadership but also demonstrated its commitment to driving industry-wide innovation. As the industry continues to evolve, SK hynix is poised to lead the charge toward a more advanced and sustainable era.

The post SK hynix at SEMICON Korea 2025: Addressing the Future of Semiconductors first appeared on SK hynix Newsroom.

HEI received LG Semicon shares on July 7 in exchange of 1 trillion Won promissory note according to its equity transfer contract with LG Semicon. (The total due payment for the equity transfer was 2.56 trillion won.) Thus, LG Semicon will now be operated as a subsidiary of Hyundai Electronics. HEI CEO Kim Young-hwan will also assume the position of CEO of LG Semicon, together with Sun Byung-don, who is currently the vice president of LG Semicon. The U.S. Federal Trade Commission (FTC) and U.S. Justice Department recently decided that the merger between HEI and LG Semicon does not violate U.S. Fair Trade Laws. The European Union also made a similar ruling, thereby giving its approval for the merger. HEI is expecting the official launch of the new merged corporation to be in October this year. Until then, both HEI and LG Semicon will independently maintain their current operation policies, while immediately integrating such operations necessary to realize early synergy effects as research & development. Due diligence has been done since mid-June, presided by Chang, Dong-kook, senior executive vice president of HEI. The merger policies for the two companies and operation plans for the new merged company are being established by “Merger Implementation Team” led by Jeon, In-baik, executive vice president. The “Merger Implementation Team” will be operated by the members equally selected from both HEI and LG Semicon. The semiconductor merger between Hyundai and LG has been the biggest focus in the Korean business world, since the Korean government initiated plans for overall corporate restructuring. The merger has also gained much worldwide attention because of its potential to completely change the order of the global memory chip market. HEI president, Kim Young-hwan said about the merger, “The most important synergistic effects attainable from this semiconductor merger will come from the R&D field. If both companies can successfully combine their research workforce, then the newly merged company will become the best in the world in terms of memory chip development capacity.” In 1997 and 1998, HEI was chosen by IBM and Compaq as the world’s best DRAM company. HEI has developed and introduced the world’s smallest 256M SDRAM chip, the world’s fastest 128M SDRAM chip and the 16M/64M SD chip used for graphics, and it has succeeded in developing the world’s first 16 GIGA DRAM-level circuit. As HEI already possesses such world-class technology, it is easy to expect that its merger with LG Semicon will enable it to become one of the world’s best companies in terms of R&D capacity. Such reinforcements in R&D are also expected to lead to increases in profits. It is expected that the merger will accelerate the development and introduction of new products by 6~12 months, thereby enabling early market entry and high-priced sales of products. “Chip shrink” plans, which play an important role in saving initial costs, will also be reduced by 3~6 months, and will therefore help increase profits and improve cost competitiveness. Experts predict that the semiconductor market, which has been in recession since 1995, will start to improve this year and grow 10~20% each year until the year 2002. Therefore, the merged company between Hyundai and LG will most likely become the largest beneficiary of this future market boom, especially since the new company will be equipped with world-class technology and the world’s largest memory chip production capacity (producing 300,000 eight-inch wafers per month). In terms of production facility investment, each production line, starting from the 256M SDRAM chip and up, requires an investment of US$2.5 billion. Since the merger will prevent overlapping facility investments and the reduction of R&D and SG&A costs, a total cost cut of about $6 billion over 5 years is expected.

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