• Development of 61TB product based on QLC technology, strengthening synergy with Solidigm in the AI data center SSD market
• Data transfer speed of up to 32GT/s with PCIe 5.0, with doubled sequential read performance compared to PCIe 4.0 products
• SK hynix to build a foundation for growth to become a full-stack AI memory provider with leadership in high-capacity eSSD technology

Seoul, December 18, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has completed development of its high-capacity SSD product, ‘PS1012 U.2¹’, designed for AI data centers.

¹U.2: A type of Form Factor for SSDs, typically 2.5 inches in size, primarily used in servers or high-performance workstations. It is known for large capacity storage and high durability.

As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC² technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61TB product using this technology and introduced it to the market.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.

SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies.

With the latest 5th generation (Gen5) PCIe³, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32GT/s (Giga-transfers per second)⁴, with the sequential read performance of 13GB/s (Gigabyte per second), which is twice that of previous generation products.

³Peripheral Component Interconnect express (PCIe): A high-speed input/output interface with a serial structure used on the main board of a digital device.
⁴Giga-transfers per second (GT/s): Number of operations or information transferred per second

In addition, the company developed this product to support the OCP 2.0 version, enhancing its compatibility with various data center server devices of global AI customers.

⁵Open Compute Project (OCP): An international consultative body that involves major data center companies around the world to discuss hardware, software and eSSD standards for building ultra-high-efficiency data centers.

SK hynix plans to supply the sample of the new product to global server manufacturers within this year for product evaluation, and based on this, it plans to expand its product line to 122TB in the third quarter of next year. The company also aims to lead the SSD market for ultra-high capacity data centers by developing 244TB products based on the world’s highest 321-high 4D NAND developed in November, to overcome the capacity limitations of eSSD.

“SK hynix and Solidigm are strengthening our QLC-based high-capacity SSD lineup to solidify our technological leadership in NAND solutions for AI,” said Ahn Hyun, President and Chief Development Officer of SK hynix. “In the future, we will lay the foundation for growth to become a Full Stack AI memory provider by meeting the diverse needs of AI data center customers based on our high competitiveness in the eSSD field.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

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SK hynix’s booth at COMPUTEX Taipei 2024

SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4–7. As one of Asia’s premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme “Connecting AI”. Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

“Connecting AI” With the Industry’s Finest AI Memory Solutions

Themed “Memory, The Power of AI,” SK hynix’s booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products.

SK hynix’s memory solutions with high bandwidth and capacity are optimized for AI servers

HBM3E, the fifth generation of HBM¹, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

Another technology which has become crucial for AI servers is CXL^®2 as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5³ (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM⁴ and MCR DIMM⁵. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
³Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁴Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁵Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.

Visitors to the booth could also see some of the company’s enterprise SSDs (eSSD), including the PS1010 and PE9010. In particular, the PCIe⁶ Gen5-based PS1010 is ideal for AI, big data, and machine learning applications due to its rapid sequential read speed. Additionally, SK hynix’s U.S. subsidiary Solidigm strengthened the eSSD lineup by presenting its flagship products D5-P5430 and D5-P5336 that have ultrahigh capacities of up to 30.72 TB and 61.44 TB, respectively.

⁶Peripheral Component Interconnect Express (PCIe): A high-speed input/output interface with a serialization format used on the motherboard of digital devices.

SK hynix offers leading solutions optimized for on-device AI PCs

In line with the growing on-device AI⁷ trend, SK hynix showcased its groundbreaking memory solutions for on-device AI PCs. These included PCB01, a PCIe Gen5 client SSD for on-device AI which offers the industry’s highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s. Alongside PCB01, SK hynix displayed other products optimized for on-device AI PCs, including the next-generation graphic DRAM GDDR7 and LPCAMM2⁸, a module solution that has the performance effect of replacing two existing DDR5 SODIMMs⁹.

⁷On-device AI: The performance of AI computation and inference directly within devices such as smartphones or PCs, unlike cloud-based AI services that require a remote cloud server.
⁸Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁹Small Outline Dual In-line Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s advanced consumer SSD products are changing the storage device game

Attendees could also get a glimpse of SK hynix’s consumer SSD products. Platinum P51 and Platinum P41, highly reliable consumer SSD solutions which offer excellent speed to boost PC performance, were displayed at the show. Set to be mass-produced later in 2024, Platinum P51 utilizes SK hynix’s “Aries”—the industry’s first high-performance in-house controller. Platinum P51 offers sequential read speeds of up to 14 GB/s and sequential write speeds of up to 12 GB/s, nearly doubling the speed specifications of the previous generation Platinum P41. This enables the loading of LLMs¹⁰ required for AI training and inference in less than one second.

¹⁰Large language model (LLM): As language models trained on vast amounts of data, LLMs are essential for performing generative AI tasks as they create, summarize, and translate texts.

An updated version of the portable SSD Beetle X31 was also unveiled at the event. This compact and stylish SSD uses a USB 3.2 Gen 2 interface to reach a rapid operation speed of 10 gigabits per second (Gbps). In addition to the existing 512 GB and 1 TB versions, SK hynix plans to launch the higher-capacity 2 TB version in the third quarter of 2024.

Earlier in May, the outstanding design of SK hynix’s SSD lineup was highlighted when its stick-type SSD Tube T31 and heat sink for Platinum P41, Haechi H02, both won a prestigious 2024 Red Dot Design Award.

Lastly, SK hynix’s ESG strategy was highlighted at the show, including its efforts to enhance the energy efficiency of its products. The company’s range of energy-efficient solutions are particularly suited for improving the sustainability of AI applications, which require significant amounts of power.

Continuing to Push the Boundaries of AI Memory

In line with the theme of COMPUTEX Taipei 2024, SK hynix continues to advance its technologies to help realize a future where “Connecting AI” becomes an everyday reality. The company will continue to participate in global conferences that present the industry’s latest trends to push its AI memory capabilities to greater heights.

The post “Memory, The Power of AI”: SK hynix Showcases Strength of Its Next-Gen Solutions at COMPUTEX Taipei 2024 first appeared on SK hynix Newsroom.

SK hynix’s booth at DTW 2024

SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024 in the heart of Las Vegas from May 20–23. Hosted annually by Dell Technologies, DTW welcomes some of the world’s biggest tech companies to highlight their latest developments, strategies, and visions. In line with DTW 2024’s theme “Accelerate AI Adoption to Unlock Innovation,” SK hynix is showcasing its advanced AI memory and demonstrating these solutions with Dell Technologies’ systems—underlining its strong partnership with the host.

SK hynix showcasing its next-generation AI memory solutions at the event

AI Solutions Set to Lead the Future Memory Ecosystem

Having participated in DTW since 2019, SK hynix has returned to emphasize the power of its high-performance AI memory products including its SSD, HBM¹, and CXL^®2 solutions.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.

SK hynix’s cSSDs which show good compatibility with Dell PCs

The company is displaying its leading enterprise SSD (eSSD) solutions with Dell Technologies’ systems. These include the PCle³ Gen5-based PS1010 and PEB110, which showed positive results with Dell PowerEdge servers. SK hynix is also presenting its latest power-efficient and rapid server DRAM solutions, MCR DIMM⁴ and RDIMM⁵, which are suited for AI computing in high-performance servers.

Regarding client SSD (cSSD) products, PCB01⁶ boasted strong performance with Dell Alienware gaming PCs. Compared to the previous generations of cSSDs that includes PC801 and PC711, PCB01 offers significant enhancements in speed, quality, and power efficiency.

³Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.
⁴Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁵Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁶PCB01: A PCIe fifth-generation SSD that doubles the speed specifications of its previous generation, enabling the loading of large language models required for AI learning and inference in less than one second.

SK hynix’s latest memory products including LPCAMM2 and HBM3E on display

In addition to demonstrations, SK hynix is displaying some of its other next-generation AI memory products. These include LPCAMM2⁷, a solution optimized for on-device AI which offers performance levels equivalent to two DDR5⁸ SODIMMs⁹. The company’s industry-leading HBM3E, which provides exceptional processing speed, capacity, and heat dissipation, is also being presented alongside its corresponding device—H100 GPU.

⁷Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁸Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁹Small Outline Dual Inline Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s CXL^® product CMM-DDR5 can expand system bandwidth and capacity

As another key technology for the AI era, CXL^® is highlighted through a demonstration of the company’s CXL^® Memory Module-DDR5 (CMM-DDR5) with Intel’s server. CMM-DDR5 has attracted attention for its ability to expand system bandwidth and capacity compared to systems only equipped with DDR5 DRAM.

“Dell Technologies is a strong supporter of the CXL^® ecosystem and an advocate of driving CXL^®-based memory standards throughout the industry,” said a Dell Technologies official. “We believe that CXL^®-based memory will prove to be valuable for systems providers and customers, and we are therefore excited to see the product demonstrations of SK hynix’s CMM-DDR5.”

Additionally, the synergy between SK hynix and its U.S. subsidiary Solidigm is highlighted as Solidigm’s SSD is also on display at the booth, which is operated by both companies.

Eung-bo Shim presenting about the impact of CXL^® memory solutions on the memory ecosystem

On the first day of the conference, Technical Leader Eung-bo Shim of the Next-Gen Memory & Storage team gave a talk on how CXL^® memory solutions will pave the way to the future memory ecosystem infrastructure. Such presentation sessions are expected to further the dialogue between SK hynix, its partners, and fellow industry players as the company aims to realize a memory-centric world in the AI era.

Advancing the Partnership With Dell Technologies in the AI Era

As leaders in their respective fields, SK hynix and Dell Technologies have formed a strong partnership that promises more advanced innovations in the future. Both companies are strengthening their efforts in the AI era, building anticipation for further collaborations that will realize faster AI adoption. Looking ahead, SK hynix remains committed to strengthening partnerships that will solidify its AI memory leadership.

The post DTW 2024: SK hynix & Dell Technologies Present the Future of AI Memory first appeared on SK hynix Newsroom.

SK hynix participated in Dell Technologies World (DTW) 2023 in Las Vegas, USA for four days between May 22-25 to showcase its latest memory technologies and products.

SK hynix’s booth at DTW 2023

DTW is the largest annual event hosted by Dell Technologies that brings together various global IT companies to unveil their latest developments that will drive future technology trends. This year’s slogan from SK hynix “Don’t bet on luck, bet on our Tech!” evokes the spirit of the host city Las Vegas and emphasizes the message that the company will continue creating and exploring diverse technologies for the new era of big data.

SK hynix, which has participated in the event since 2019, presented a variety of its latest technologies and products. First, the company unveiled PS1010, a PCIe¹ Gen5-based eSSD that will be applied to Dell Technologies’ server products. The company also demonstrated the performance of its new cSSD, PC801, in a Dell desktop to showcase the company’s evolving technology.

¹ Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.

SK hynix showcasing its CXL memory and HBM3

In addition, SK hynix displayed its CXL² memory through a demonstration on a real server and held a joint exhibition of its HBM3³ and NVIDIA’s H100 GPU. Used for AI chatbots, NVIDIA’s H100 GPU has adopted HBM3 to realize next-generation performance levels.

² Compute Express Link (CXL): A PCIe-based, next-generation interconnect protocol to effectively establish high-performance computing systems.

³ High Bandwidth Memory (HBM): A high-value, high-performance memory solution that vertically interconnects multiple DRAM chips with TSV to dramatically increase the data processing speed in comparison to traditional DRAM products. HBM3 is the fourth-generation product, succeeding the previous generations HBM, HBM2 and HBM2E.

Throughout the event, SK hynix provided visitors with a look at its diverse portfolio of solutions including several DRAM product lines such as its DDR5 modules for servers and PCs, LPDDR5X for mobile devices, and GDDR6 graphics memory. Other products included eSSDs with various form factors like E1.S, U.2, M.2 22110, and M.2 2280. New cSSDs such as PC801 and BC901 were on display as well, while Consumer SSDs such as P31 and P41 were also featured in the booth. Additionally, SK hynix presented PCIe Gen4 NVMe⁴-based enterprise and cSSDs from its subsidiary company, Solidigm.

⁴ Non-Volatile Memory Express (NVMe): As a communication protocol for storage devices based on the PCIe interface, NVMe can achieve speeds of up to six times or more compared to the existing SATA interface—making it suitable for ultra-high speed, large data processing tasks.

Eung-bo Shim, a technical leader in charge of next-generation memory development, presenting the concept and strengths of CXL memory

SK hynix went on to hold a breakout session that introduced the role and future of its CXL memory technology. “CXL memory is a solution that increases the bandwidth compared to existing DRAM products to improve performance. This technology enables the capacity to be expanded more easily than ever before and will soon become commercially available,” said Eung-bo Shim,  a technical leader responsible for next-generation memory development at SK hynix. “As a product that has strengths in reliability, security and maintenance, it will be used in various servers in the future.”

By attending global events like DTW down the road, SK hynix plans to continue strengthening its partnerships with key customers and introducing its new products on the world stage.

The post SK hynix Showcases Its Next-Generation Technologies at Dell Technologies World 2023 first appeared on SK hynix Newsroom.

Together as HPE partners, the duo attended the conference in-person, a welcome change following two years of virtual conferences due to COVID-19. They also attended Dell Technologies World 2022 in May, making HPE Discover their second joint appearance.

The two companies’ partnership solidified after SK hynix acquired Intel’s SSD business and Dalian NAND Flash Manufacturing Facility assets in China. Solidigm was launched as a new company in December 2021.

SK hynix-Solidigm joint booth at HPE Discover 2022

SK hynix was also a platinum sponsor at HPE Discover and showcased its product line under two themes. Products under the first theme, “A New Standard Double Data Rate (DDR) for Green Future”, included the company’s DDR5 Server Dual In-line Memory Module (DIMM) products with various specifications.

Products presented under the second theme, “Storage Technology Innovator for a Better World”, included the Enterprise Solid State Drives (SSD) with various form factors. SK hynix also demonstrated its SATA SE5130 and NVME PCle Gen4 PE8110 SSDs.

For its part, Solidigm showcased its strength in the Solid State Drive (SSD) space at HPE Discover. Its products exhibited under the theme, “New Paradigm of Solid-State Storage”, included those from the SATA/NVMe Enterprise SSD lineup, and the company also demonstrated its NVMe PCle Gen4 P5520 product, which has data storage capacities of up to 15.36TB.

Solidigm also presented on optimizing SSDs’ performance for real-world workloads during a breakout session on June 29. Prior to HPE Discover 2022, the company also held a webinar on June 15 to share details regarding its data center SSDs. The products introduced included D7-P5620 and D7-P5520, the newest additions to Solidigm’s D7 series.

Meanwhile, SK hynix’s DDR5 was on attendees’ radars at HPE Discover 2022. The memory solution, which is widely touted to become the DDR standard in the Data Driven Era, was introduced at the HPE Discover theater session on June 28. SK hynix previously announced the launch of the world’s first DDR5 DRAM in October 2020.

As HPE Discover 2022 draws to a close, SK hynix and Solidigm continue to work towards their goal of capturing a top position in the memory and storage market.

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The companies’ joint sponsorship of Dell Technologies World underscored their partnership and resolve to pool their capabilities to address customers’ most pressing storage needs and strengthen synergies in the global memory solutions market. This is Solidigm’s first conference appearance. Having launched as a new company at the end of 2021, Solidigm’s name reflects its intent to be a new paradigm in solid-state storage, delivering customer-inspired solutions.

Image 1. Shared booth of SK hynix and Solidigm at Dell Technologies World 2022

At the shared booth (#408), SK hynix highlighted its data center solutions and green technology, displaying an array of HBM3, GDDR, DDR5-based DIMM, PCIe Gen4 NVMe client SSD, and PCIe Gen5 NVMe enterprise SSD.

Image 2. SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022

The booth also showcased SK hynix’s corporate ESG activities and eco-friendly memory lines to enable stronger performance with less power, reflecting a commitment to sustainable business and environmentally responsible products.

Image 3. Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022

Nearby, Solidigm promoted its industry-leading QLC portfolio, spanning client and data center. “Solidigm was honored to share a booth with SK hynix at Dell Technologies World and to showcase our industry-leading products together,” said Paul Obsitnik, Solidigm’s Chief Marketing and Communications Officer. “The joint team educated attendees about our partnership and the strength of our combined portfolio. We heard a lot of enthusiasm for what we will create together going forward.”

Image 4. Jin Lim, Vice President at SK hynix presenting at Dell Technologies World 2022

The companies also took the stage together during breakout sessions. SK hynix presented its Solidigm partnership strategy and ESG journey, and Solidigm explained its vision and technological readiness for meeting the diverse requirements of SSDs tailored to specific workloads.

“It has been a satisfying experience for us to closely collaborate with Solidigm as one team to prepare the joint participation at Dell Technologies World 2022 for the past months,” said SK hynix manager who organized the exhibition of the shared booth. “We are excited and expect to deliver more to our audience in the future, together.”

Together, SK hynix and Solidigm will continue to maximize synergies and forge ahead as leaders of a new memory and storage paradigm.

The post SK hynix and Solidigm Make First Joint Appearance at Dell Technologies World 2022 first appeared on SK hynix Newsroom.

The meeting hosted by the Vice Chairman and Co-Chief Executive Officer Park Jung-ho and the President and Chief Marketing Officer Kevin (Jongwon) Noh was attended by more than 200 employees following recent reopening of the U.S. subsidiary office. Over food and beverages provided outdoor at the campus, the employees were pleased with a rare opportunity to mingle with the top leaders, looking back on the past achievements and hear directly from the leaders on where the company is headed for next.

Also commemorating the 10th anniversary of SK hynix’s inclusion into the broader SK Group and a successful launch of Solidigm following acquisition of Intel’s NAND and SSD business, Park shared his views on the performance and vision of the U.S. operations for the years ahead and awarded teams and individuals with outstanding performance.

The meeting came at a critical time when SK hynix America is preparing for a new chapter in business following a rapid growth in the past decade. With SK hynix planning to expand its presence in the U.S. as part of its Inside America strategy, SK hynix America is expected to serve as the hub for the U.S. operations. By gaining a foothold with potential partners in the local market, the company hopes to gain an edge on industry trends, establish a technology exchange network, and cooperate with U.S. higher-education institutions.

“We’re celebrating our 10-year anniversary, but this is just the beginning. SK hynix America has taken on a meaningful role, especially in the realm of IT innovation,” Vice Chairman Park said. “We shouldn’t limit our role to a hardware (memory chip) provider. We should be proud that we’re providing freedom to software.”

Making Its Presence Felt

SK hynix America was launched in 2012 following rebranding of the U.S. operations of Hyundai Electronics, which started in 1983.

While much of the U.S. business centered around product and component sales and distribution in the past, the company has been solidifying its position in the high-performance memory market more recently by shifting focus to include computer servers and HBM.

SK hynix America has also achieved a quality growth over the past 10 years by diversifying its customer base to include a wide range of top-tier global technology companies. With its leadership in value-added products like HBM expected to grow further, SK hynix America will be given full support from the top management to act like an independent entity instead of being a simple sales arm of the headquarters, Park said.

The post SK hynix Top Leaders Celebrate 10th Anniversary with U.S. Employees first appeared on SK hynix Newsroom.

NEWS HIGHLIGHTS

• SK hynix and Solidigm unveil their first technology and product collaboration, which combines SK hynix’s 128-layer NAND Flash with Solidigm’s SSD controller and firmware expertise.
• Together, SK hynix and Solidigm will continue to optimize both companies’ operations to create synergies and partnership.
• Additionally, the collaboration between SK hynix and Solidigm reflects their commitments to strengthening their investments in US R&D, as part of SK hynix’s “Inside America Strategy.”

San Jose, California, April 4th, 2022, and Seoul, South Korea April 5th, 2022

Today SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel’s NAND and SSD business.

The P5530 combines SK hynix’s 128-layer 4D NAND flash with Solidigm’s SSD controller^* and firmware supporting a PCIe^* Gen 4 interface. The product is offered in 1TB, 2TB, and 4TB capacity options. SK hynix and Solidigm worked together to optimize performance with specific data center use cases and targeted deployments in mind.

Since the launch of Solidigm, the companies have partnered to forge a forward-moving strategy and co-develop products while reinforcing common values across the companies. Through the ongoing partnership and collaboration with Solidigm, SK hynix expects to enhance its NAND flash business competitiveness to the same extent as its DRAM business.

“With in-time demonstration of the collaborative product based on the combined competence of SK hynix and Solidigm, we aim to not only enhance our NAND flash business competitiveness but also speed up our “Inside America” strategy,” said Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO) at SK hynix. “SK hynix and Solidigm will continue to partner in order to optimize both companies’ operations to create greater synergies.”

“In our early days of Solidigm, we’re pleased to be forming a strong collaboration with SK hynix. Together, we’re united in optimizing our products to provide unparalleled solutions for our customers. The P5530 is just the first example of what will come from our industry-defining partnership as we solidify our leadership across the NAND industry and create a new paradigm for solid state storage,” said Rob Crooke, Chief Executive Officer at Solidigm.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”), and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

About Solidigm

Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Our origins reflect Intel’s longstanding innovation in memory products and SK hynix’s international leadership and scale in the semiconductor industry. Solidigm became a standalone U.S. subsidiary under SK hynix in December 2021. Headquartered in San Jose, CA, Solidigm is powered by the inventiveness of more than 2,000 employees in 20 locations worldwide. For more information about Solidigm, please visit https://www.solidigm.com and follow us on Twitter at @Solidigm and on LinkedIn.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Jaehwan Kevin Kim
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Solidigm
Corporate Affairs

Rhonda Foxx
press@solidigmtechnology.com

Catherine Roberts
press@solidigmtechnology.com

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Check out the career opportunities which SK hynix intends to bring as part of our “Inside America” strategy.

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