• Development of 61TB product based on QLC technology, strengthening synergy with Solidigm in the AI data center SSD market
• Data transfer speed of up to 32GT/s with PCIe 5.0, with doubled sequential read performance compared to PCIe 4.0 products
• SK hynix to build a foundation for growth to become a full-stack AI memory provider with leadership in high-capacity eSSD technology

Seoul, December 18, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has completed development of its high-capacity SSD product, ‘PS1012 U.2¹’, designed for AI data centers.

¹U.2: A type of Form Factor for SSDs, typically 2.5 inches in size, primarily used in servers or high-performance workstations. It is known for large capacity storage and high durability.

As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC² technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61TB product using this technology and introduced it to the market.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.

SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies.

With the latest 5th generation (Gen5) PCIe³, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32GT/s (Giga-transfers per second)⁴, with the sequential read performance of 13GB/s (Gigabyte per second), which is twice that of previous generation products.

³Peripheral Component Interconnect express (PCIe): A high-speed input/output interface with a serial structure used on the main board of a digital device.
⁴Giga-transfers per second (GT/s): Number of operations or information transferred per second

In addition, the company developed this product to support the OCP 2.0 version, enhancing its compatibility with various data center server devices of global AI customers.

⁵Open Compute Project (OCP): An international consultative body that involves major data center companies around the world to discuss hardware, software and eSSD standards for building ultra-high-efficiency data centers.

SK hynix plans to supply the sample of the new product to global server manufacturers within this year for product evaluation, and based on this, it plans to expand its product line to 122TB in the third quarter of next year. The company also aims to lead the SSD market for ultra-high capacity data centers by developing 244TB products based on the world’s highest 321-high 4D NAND developed in November, to overcome the capacity limitations of eSSD.

“SK hynix and Solidigm are strengthening our QLC-based high-capacity SSD lineup to solidify our technological leadership in NAND solutions for AI,” said Ahn Hyun, President and Chief Development Officer of SK hynix. “In the future, we will lay the foundation for growth to become a Full Stack AI memory provider by meeting the diverse needs of AI data center customers based on our high competitiveness in the eSSD field.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

The post SK hynix Develops ‘PS1012 U.2’, High Capacity SSD for AI Data Centers first appeared on SK hynix Newsroom.

• New SSD delivers 2x performance, over 30% greater power efficiency than previous generation by applying 5th-generation PCIe
• Mass production to begin in 2Q next year following customer qualification
• SK hynix to enhance data center SSD portfolio to meet diverse customer needs
• Company to consolidate position as No. 1 global AI memory provider in NAND solutions such as SSDs following success with HBM

Seoul, September 11, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has developed PEB110 E1.S (PEB110), a high-performance solid-state drive (SSD) for data centers.

With the advent of the AI era, customer demand for high-performance NAND solutions such as SSDs for data centers, as well as ultra-fast DRAM chips including high bandwidth memory (HBM), is growing. In line with this trend, the company has developed and introduced a new product with improved data processing speed and power efficiency by applying the fifth-generation (Gen5) PCIe¹ specifications.

SK hynix expects to meet diverse customer needs with a more robust SSD portfolio following successful mass production of PS1010² with the introduction of PEB110.

¹Peripheral Component Interconnect Express (PCle): A serial-structured, high-speed input/output interface used on the motherboard of digital devices.
²PS1010: A data center/server-oriented SSD with ultra-high performance and high capacity that is based on PCIe Gen5 E3.S and U.2/3.

The company is currently in the qualification process with a global data center customer and plans to begin mass production of the product in the second quarter of next year, pending qualification.

PCle Gen5, applied to the new product, provides twice the bandwidth of the fourth generation (Gen4), enabling PEB110 to achieve data transfer rates of up to 32 gigatransfers per second (GT/s). This enables PEB110 to double the performance of the previous generation and improve power efficiency by more than 30%.

SK hynix has also applied the security protocol and data model technology, or SPDM, to PEB110, for the first time for its data-center SSDs to significantly enhance information security features.

SPDM, a key security solution specialized in protecting server systems, offers secure authentication and monitoring of servers. With the recent increase in cyberattacks on data centers, the company expects that PEB110 with SPDM will meet the high information security needs of customers.

The product will be released in three capacity versions—2 terabyte (TB), 4 TB, and 8 TB—and supports the OCP³ version 2.5 specifications for greater compatibility across global data centers.

³Open Compute Project (OCP): An international council of leading data center companies from around the world discussing standards for hardware, software, and eSSDs to build ultra-efficient data centers.

“The new product builds on the company’s best-in-class 238-high 4D NAND, boasting the most competitive standards in the industry in terms of cost, performance and quality,” said Ahn Hyun, Head of the N-S Committee at SK hynix.

“Looking ahead, we are on track to proceed with customer qualification and volume production to solidify our position as the No. 1 global AI memory provider in the ever-growing SSD market for data centers,” said Ahn.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”), and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix Develops PEB110 E1.S for Data Centers first appeared on SK hynix Newsroom.

• Development of PCB01, 5th generation of 8-channel PCIe, to be followed by mass production within this year
• PCB01, industry’s best SSD for PCs, optimized for on-device AI
• Advancement in NAND solution to extend success story of HBM, solidify leadership in AI memory space

Seoul, June 28, 2024

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it developed PCB01, an SSD product with the industry’s best specifications, for on-device AI¹ PCs.

The product marks the first case where the industry adopts the fifth generation of the 8-channel² PCIe³ technology and brings innovation to performance including the data processing speed.

¹On-device AI: a technology that implements AI functions on the device itself, instead of going through computation by a physically separated server. A smartphone’s direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service.
²Channel: a route for the input/output of data between a NAND flash and a controller on the SSD. An increase in the number of channels leads to advancement of the PCIe to the next generations and an improvement in the data processing speed. A 4-channel SSD is typically adopted for the conventional PCs, while an 8-channel SSD is for high-performance PC.
³Peripheral Component Interconnect Express (PCle): a serial-structured, high-speed input/output interface used on the motherboard of digital devices

The company expects the latest advancement in the NAND solution space to add to its success stories in the high-performance DRAM area led by HBM, enhancing its leadership in the overall AI memory space.

With a validation process with a global PC customer underway, SK hynix plans to mass produce and start shipping the products to both corporate customers and general consumers within this year.

PCB01 comes with the capabilities of sequential read and write speeds of 14GB and 12GB per second, respectively, bringing the performance of an SSD to the level unseen before. The speeds allow the operation of a large language model⁴, or LLM, for AI training and inference, in a second.

⁴Large language model (LLM): a language model trained on vast amounts of data, which is essential for performance of generative AI tasks such as creating, summarizing, and translating texts.

The product also comes with an improvement in power efficiency of more than 30% compared with the previous generation, enhancing the stability of the large-scale AI computing tasks.

SK hynix also adopted the SLC⁵ caching for the production of PCB01. With the adoption of the technology that places the single-level cell, or SLC, in some parts of the NAND cell to accelerate performance, a PC user can experience a faster performance for both AI services and conventional computing.

The product is also equipped with the capability aimed at protecting personal data. SK hynix engineers built the root of trust⁶, or ROT, a security solution, in the PCB01 to prevent external cybersecurity attacks and forging and falsification of information, while protecting a user’s password.

⁵Single-level cell (SLC): a type of memory cell used in NAND flash that stores one bit of data in a single cell. As the amount of data stored increases, the memory cell becomes a multi-level cell (MLC), a triple-level cell (TLC), and a quad-level cell (QLC). An increase in the data storage means more data can be stored in the same area, but the speed and stability decreases. An SLC enables faster processing of selected data.
⁶Root of Trust (RoT): an area of the hardware that can always be trusted in terms of security, while enabling prevention of forging and falsification of information.

The company plans to launch PCB01 in three capacities – 512GB, 1TB, and 2TB.

Ahn Hyun, Head of the N-S Committee at SK hynix, said that numerous global providers of CPU for on-device AI PCs are requesting collaboration for compatibility validation process. “We will work towards enhancing our leadership as the global top AI memory provider also in the NAND solution space by successfully completing the customer validation and mass production of PCB01, which will be in the limelight.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Sooyeon Lee
E-Mail: global_newsroom@skhynix.com

The post SK hynix Develops PCB01 for Artificial Intelligence PCs first appeared on SK hynix Newsroom.

• • SK hynix will develop PCB01, a PCIe Gen 5 SSD, in the first half of 2024 and launch the product this year
  • The company also presented the industry’s first volume-produced 12-layer HBM3E at GTC 2024
  • PCB01 strengthens SK hynix’s status as the world’s No. 1 AI memory provider in on-device AI as well as HBM

Figure 1. PCB01, SK hynix’s PCIe Gen 5 SSD, is optimized for PC original equipment manufacturers (OEMs)

SK hynix unveiled a new consumer product based on its latest solid-state drive (SSD), PCB01, which boasts industry-leading performance levels at GPU Technology Conference (GTC) 2024. Hosted by NVIDIA in San Jose, California from March 18–21, GTC is one of the world’s leading conferences for AI developers.

Applied to on-device AI¹ PCs, PCB01 is a PCIe² fifth-generation SSD which recently had its performance and reliability verified by a major global customer. After completing product development in the first half of 2024, SK hynix plans to launch two versions of PCB01 by the end of the year which target both major technology companies and general consumers.

¹On-device AI: The performance of AI computation and inference directly within devices such as smartphones or PCs, unlike cloud-based AI services that require a remote cloud server.
²Peripheral Component Interconnect Express (PCIe): A high-speed input/output interface with a serialization format used on the motherboard of digital devices.

Optimized for AI PCs, Capable of Loading LLMs Within One Second

Offering the industry’s highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 doubles the speed specifications of its previous generation. This enables the loading of LLMs³ required for AI learning and inference in less than one second.

³Large language model (LLM): As language models trained on vast amounts of data, LLMs are essential for performing generative AI tasks as they create, summarize, and translate texts.

To make on-device AIs operational, PC manufacturers create a structure that stores an LLM in the PC’s internal storage and quickly transfers the data to DRAMs for AI tasks. In this process, the PCB01 inside the PC efficiently supports the loading of LLMs. SK hynix expects these characteristics of its latest SSD to greatly increase the speed and quality of on-device AIs.

Figure 2. SK hynix’s PCIe Gen 5 SSD PCB01 is optimized for PC OEMs

PCB01 also offers a 30% improvement in power efficiency compared to its previous generation so it can effectively manage power from large-scale AI computations. In addition, SK hynix has applied single-level cell (SLC)⁴ caching technology to the product which enables some of the cells—the storage areas of NAND—to operate as SLCs with fast processing speeds. The technology allows selected data to be quickly read and written, speeding up the operation of AI services and general PC operations.

⁴Single-level cell (SLC): A type of memory cell used in NAND flash that stores one bit of data in a single cell. As the amount of data stored increases, the memory cell becomes a multi-level cell (MLC), a triple-level cell (TLC), and so on. Even though more data can be stored in the same area, the speed and stability decreases. SLC speeds up the processing of selected data.

Jae-yeun Yun, head of NAND Product Planning and Enablement at SK hynix, stated: “PCB01 will not only be highlighted for its use in AI PCs, but this high-performing product will also receive significant attention in the gaming and high-end PC markets,” he said. “Our much-anticipated product will allow us to solidify our position as the global no.1 AI memory provider not only in the HBM field but also in the on-device AI area.”

Figure 3. The PCB01-based product on display at GTC 2024

Alongside its PCB01-based product, SK hynix also introduced its next-generation flagship technologies and solutions at GTC 2024 including its 36 GB 12-layer HBM3E, CXL⁵, and GDDR7⁶. The display of HBM3E, the industry’s first fifth-generation HBM solution, follows the company’s announcement that it has begun volume production of the product. In addition, GDDR7 attracted much attention for doubling its bandwidth and improving its power efficiency by 40% compared to its predecessor GDDR6.

⁵Compute Express Link (CXL): An integrated interface that connects multiple devices such as memory, CPUs, GPUs, and accelerators all at once.
⁶GDDR7: The 7th generation of graphics memory that supports GPUs to work faster and more efficiently.

On top of presenting its world-class portfolio, SK hynix also held presentation sessions at GTC 2024. Technical Leader Seoyeong Jeong of HBM Marketing gave a talk titled “The Outlook of the HBM Market” where she shared insights on the importance of AI memory and its core technologies.

The post SK hynix Unveils Highest-Performing SSD for AI PCs at NVIDIA GTC 2024 first appeared on SK hynix Newsroom.

Figure 1. The all-new SK hynix Beetle X31 SSD

SK hynix is set to release SK hynix Beetle X31, a portable solid-state drive (SSD) for consumers, in global markets starting with the U.S. later in June. As the company’s first portable SSD, the X31 has been praised for its superior performance, convenient portability, and stylish design following its launch in South Korea in May 2023. In particular, the SSD can reach operating speeds of up to 10 gigabits per second (Gbps) while it also possesses exceptional heat management capabilities. Released amid a growth in the portable SSD market, the X31 meets the rising demand for storage devices to not only rapidly read and write but also store data safely on-the-go.

Figure 2. The high-quality specifications of the X31

The X31 combines SK hynix’s technologies which enabled optimal power consumption in the Gold P31 and the highest specifications for a consumer SSD in the Platinum P41. Moreover, while DRAM-less SSDs have become widespread as part of industry efforts to cut costs, SK hynix opted to maximize the performance of the X31 by applying DRAM as a buffer inside of the SSD. Accordingly, the X31 can deliver a maximum sequential read speed of 1,050 megabytes per second (MB/s) and a maximum sequential write speed of 1,000 MB/s. At these speeds, it is possible to transfer a 1 GB file in just one second. More specifically, the X31 is able to transfer 500 GB of data while maintaining an optimal speed of over 900 MB/s. This is because the X31 strikes a balance between managing heat generated from fast data movement and maximizing write speeds.

The X31 features an aluminum case that enables effective heat dissipation while also protecting the device’s interior. Having passed a two-meter drop test, the product is highly durable against physical impact and it also comes with a three-year warranty for increased customer reliability.

Figure 3. The X31 fits right in the palm of your hand

Able to fit in the palm of your hand and shaped like a beetle, the X31 is optimized for portability with its weight of merely 53 grams and compact dimensions of 74 x 46 x 14.8 mm. It also provides extra grip with its ergonomically designed aluminum body and its smooth, round edges. Additionally, it is compatible with a wide range of devices including IBM PCs and Macs, tablet PCs, Android smartphones, and gaming consoles. Available with 512 GB or 1 TB of storage, the X31 comes standard with two USB cables (C-to-C and C-to-A) and a bumper case.

As a product that combines high-performance, reliability, and a sleek design, the X31 has proved to be exceptionally popular as its first batch of stocks were sold out within a day of its release on online retail sites in South Korea. Riding on this momentum, the company plans to launch the product in the U.S., Europe, and other parts of Asia starting towards the end of June.

“Beginning with the X31, we will continue to set trends in the portable SSD market starting from the Korean market all the way to overseas markets like the U.S.,” said Chan-dong Park, head of NAND marketing at SK hynix.

To find out more about the X31’s distinctive qualities and plans for its release in global markets, read the short Q&A below.

The X31 has been receiving attention for its excellent specifications. What is its biggest advantage over its competitors?

“It is inevitable for SSDs to generate heat when rapidly reading and writing data. Unlike SSDs that are installed inside a PC, users directly touch portable SSDs so safety becomes a much more crucial factor. This is where the X31 shines as it shows great strength in balancing high speed and heat dissipation to maintain its stable performance. Also, in contrast to the many DRAM-less portable SSDs out in the market, the X31 incorporates DRAM as its buffer to maximize performance.”

The X31 has a compact and stylish design which stands out from the crowd. What was the most important aspect when coming up with the design?

“From the onset, the X31 was designed to be incredibly light and ultra-compact. It also shares key component materials with the Gold P31, which features optimal power consumption. So, the X31 was a continuation of the P31’s design with added concepts that are unique to portable SSDs. A lot of effort was spent on enhancing the exterior elements of the product including its color and smooth texture to improve the user experience.”

Along with the launch of the X31, what do you think is the most important factor for SK hynix to continue leading the portable SSD market?

“The portable SSD market is becoming larger due to the products’ ease of use. This has led to the introduction of more upscale portable SSDs that have many added features. However, the X31 focused on the basics: portability, fast data storage, and stability. Therefore, distinguished usability will be the key factor in leading the market in the future.”

Following its launch in the Korean market, the X31 is also planned to make its debut overseas at the end of June. Where will the focus be on for these global markets?

“There are so many competing products in the international market. As such, the name “Beetle” will be emphasized to highlight the most important feature of the product: its portability. We are currently busy preparing to launch the product in many regions across North America, Europe, and Asia through strategic partnerships.”

SK hynix is proud to release a consumer product that meets the needs of everyday tasks. As a global semiconductor company that continues to expand its customer base, SK hynix will always have the goal of developing and investing in technology that makes our lives simpler, faster, and more efficient. Starting with its global launch on Amazon in the U.S., the X31 will make its way to global consumers from June.

The post SK hynix Beetle X31: SK hynix Launches its First Portable SSD for Consumer Market first appeared on SK hynix Newsroom.

• Obtains internationally-recognized ASPICE Level 2 Certification through collaboration with Siemens
• Aims to meet growing demand from automotive chip market, improve profitability with NAND solutions globally recognized

Seoul, June 20, 2023

SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has received the automotive ASPICE¹ Level 2 certification, marking the first case that a Korean semiconductor company wins the recognition.

¹ASPICE (Automotive Software Process Improvement & Capability dEtermination): A guideline for automotive software development that was introduced by European carmakers to evaluate reliability and capabilities of a auto part supplier.

The certification, essential for automotive NAND solution products, is expected to lead to an increased supply and stronger profitability of the company’s NAND solution products such as Universal Flash Memory and Solid State Drive, of which combined market is expected to grow by more than an average 20% every year, the company said.

With introduction and adoption of electric vehicles and autonomous driving system, the importance of technology in the areas of electric and electronic parts of vehicles is also growing.

Particularly, with systems for Advanced Driver Assistance System and Infotainment getting more sophisticated, the importance of software quality management as well as compatibility and stability is growing, requiring auto part suppliers to obtain the ASPICE Level 2 or the equivalent.

To win the certification, SK hynix combined its digital transformation technology with Siemens’ certification solution, which helped result in optimization and success of a stable and efficient system for the overall research and development process ranging from design of software for vehicles and engineering of products to workflow.

The latest achievement follows obtainment of an ISO 26262: 2018 FSM(Functional Safety Management²) in November 2021 as SK hynix continues to deliver accomplishments in the automotive memory business with commitment to safety and reliability.

² ISO 26262: 2018 FSM (Functional Safety Management): An international standard for functional safety in automotive semiconductors set by the International Organization for Standardization.

SK hynix will now aim for the ASPICE Level 3 certification with a more advanced software development process.

“Our achievement comes at a time when product competitiveness of automotive memory solution is more important than ever,” Ahn Hyun, head of solution development, said. “We will aim higher and continue our efforts for development and stronger product competitiveness of automotive memory chips.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Joori Roh
E-Mail: global_newsroom@skhynix.com

The post SK hynix Receives International Certification for Automotive Memory Solution Development first appeared on SK hynix Newsroom.

Together as HPE partners, the duo attended the conference in-person, a welcome change following two years of virtual conferences due to COVID-19. They also attended Dell Technologies World 2022 in May, making HPE Discover their second joint appearance.

The two companies’ partnership solidified after SK hynix acquired Intel’s SSD business and Dalian NAND Flash Manufacturing Facility assets in China. Solidigm was launched as a new company in December 2021.

SK hynix-Solidigm joint booth at HPE Discover 2022

SK hynix was also a platinum sponsor at HPE Discover and showcased its product line under two themes. Products under the first theme, “A New Standard Double Data Rate (DDR) for Green Future”, included the company’s DDR5 Server Dual In-line Memory Module (DIMM) products with various specifications.

Products presented under the second theme, “Storage Technology Innovator for a Better World”, included the Enterprise Solid State Drives (SSD) with various form factors. SK hynix also demonstrated its SATA SE5130 and NVME PCle Gen4 PE8110 SSDs.

For its part, Solidigm showcased its strength in the Solid State Drive (SSD) space at HPE Discover. Its products exhibited under the theme, “New Paradigm of Solid-State Storage”, included those from the SATA/NVMe Enterprise SSD lineup, and the company also demonstrated its NVMe PCle Gen4 P5520 product, which has data storage capacities of up to 15.36TB.

Solidigm also presented on optimizing SSDs’ performance for real-world workloads during a breakout session on June 29. Prior to HPE Discover 2022, the company also held a webinar on June 15 to share details regarding its data center SSDs. The products introduced included D7-P5620 and D7-P5520, the newest additions to Solidigm’s D7 series.

Meanwhile, SK hynix’s DDR5 was on attendees’ radars at HPE Discover 2022. The memory solution, which is widely touted to become the DDR standard in the Data Driven Era, was introduced at the HPE Discover theater session on June 28. SK hynix previously announced the launch of the world’s first DDR5 DRAM in October 2020.

As HPE Discover 2022 draws to a close, SK hynix and Solidigm continue to work towards their goal of capturing a top position in the memory and storage market.

The post SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together first appeared on SK hynix Newsroom.

Seoul, May 20, 2022

SK hynix Inc. (or “the company”, www.skhynix.com) today announced availability of the “Platinum P41” PCIe Gen4 NVMe SSD that distills technical excellence driven by unmatched speeds and reliability. The Platinum series represents the company’s flagship retail lineup geared towards gamers and content creators looking to turbo-boost PC performance.

Launched as SK hynix’s first PCIe 4.0 SSD built with advanced 176-layer NAND flash memory, the Platinum P41 is now available for purchase on Amazon in 500GB, 1TB and 2TB capacity options.

Designed to excel among PCIe 4.0 SSDs, the Platinum P41 offers sequential read speeds up to 7,000 MB/s and sequential write speeds up to 6,500 MB/s with an industry-leading endurance rating of up to 1,200 TBW. The Platinum P41 also provides further assurance of reliability with an SK hynix in-house “Aries” controller, which in itself contributes to the superior read/write speeds.

“We are delighted to introduce the Platinum P41, the first of our Platinum series of SSDs to drive the strongest PCIe Gen4 bandwidth experience for computing needs. P41 also inherits the power efficiency and stability of our existing lineup, keeping with SK hynix’s rich history of delivering excellent solutions for consumer electronics,” Dae Jung Cho, Head of SSD Marketing at SK hynix, said.

Additionally, the Platinum P41 is capable of up to 1,400K IOPS in random reads and up to 1,300K IOPS in random writes, the highest-end throughput on the PCIe 4.0 interface. The P41 undergoes 1,000 hours of high-temperature operating life (HTOL) testing to ensure reliability, where it has achieved an extensive 1.5 million hours in mean time between failures (MTBF).

The Platinum P41 comes with a five-year warranty from SK hynix.

Product image, technical specifications and more information about Platinum P41 are shown below.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Media Contact

SK hynix Inc.
Global Public Relations

Technical Leader
Kanga Kong
E-Mail: global_newsroom@skhynix.com

Technical Leader
Jaehwan Kevin Kim
E-Mail: global_newsroom@skhynix.com

The post SK hynix Launches PCIe 4.0 “Platinum P41” SSD first appeared on SK hynix Newsroom.

Image Download

If you’ve ever owned a digital music player, loaded saved progress on a gaming console, or used a smartphone—you’ve used flash storage. Each of these devices, plus countless others, have the same dependable memory tech at their core.

As the name suggests, flash storage runs extremely fast; it also retains information when a device is powered off and is easily rewriteable. As our devices become smarter and generate more data, fast and flexible memory solutions are in high demand. Set to be the next “big thing” in storage, let’s take a closer look at the ever-evolving, advanced semiconductor memory solution.

Great Things Come in Small Packages

Once considered quite the splurge, flash storage, including both NAND and NOR-based solutions, revolutionized not only the way we live but also how our devices operate. The real tech breakthrough facilitated by flash was the ability to store massive volumes of data in a tiny chip, reducing the size restrictions imposed by earlier storage components.

Recognizing the opportunity early on, SK hynix has been able to bolster its technological leadership by delivering the world’s first NAND flash solutions time and time again. Innovating smaller, faster, and lower energy-consuming storage components solidifies the company’s prime position in the market and provides meaningful solutions for the technological demands and environmentally conscious agendas of the ever-expanding tech sector.

SK hynix’s 176-layer NAND flash increases bit productivity by 35% compared to previous generation

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Each evolution of NAND flash memory has increased storage capacity through the formation of smaller active and gate using lateral scaling. Now developing 4D-NAND, SK hynix hi-gineers formed a peripheral circuit under the 3D-NAND cell, maximizing the chip’s storage capacity and lowering the cost. SK hynix premiered the world’s first 176-layer 4D NAND flash, the third generation of NAND flash product securing the industry’s best number of chips per wafer. This increasingly multi-layered technology supports the development of higher-capacity mobile devices such as terabyte-boasting smartphones and laptop computers with incredible storage capabilities.

More than a “Flash” in the Pan

Increasing the storage capacity of our devices is critical to continue to evolve technology in a manner that meets the needs of today’s society. In response to the recent pandemic, society has become increasingly dependent on digital technology. Retreating to our homes, transitioning to remote work, and relying on digital means to stay connected created a need for smart digital solutions capable of managing data volumes considerably larger than any other time in recent history.

Volume of data/information created, captured, copied, and consumed worldwide from 2010 to 2025

The volume of data globally grew by more than 56% at the onset of the pandemic

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Increased demand for data centers and cloud-based server solutions has been mirrored by increased demand for efficient NAND flash solutions. The applications for NAND flash are also becoming more diverse. The list of possible uses is growing in step with demand; the technology is appearing in more than just mobile devices but enterprise SSDs and automotive technology too.

Flash-Forward to the Future

To truly harness the potential of NAND flash, the industry needs to improve materials and design structures, anticipating the next technical evolution of flash memory. One of SK hynix’s main areas of focus is securing etching technology able to realize the high-density requirements of the industry to capture opportunities like replacing HDDs in data centers with SSDs. It is predicted that it will be possible to stack over 600 layers of NAND in the future, making the application of flash virtually limitless.

SK hynix innovates for a greener future by optimizing technology through the lens of social value

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In addition to rising technological challenges and demands, the industry now faces a new mission of responding to social and environmental concerns, including its consumption of energy and other essential resources. Advancing both the technology and its production methods can lower the industry’s carbon footprint and build a more sustainable product for use in eco-friendly technologies.

Looking to the future, SK hynix predicts a truly smart world will come to fruition alongside semiconductor memory solutions, like NAND flash, that converge storage with logic to overcome performance limitations, allowing ultra-high-speed computation and storage possible in one place with lower energy demand.

SK hynix is committed to continuously evolving and advancing the memory semiconductor industry strategically to better answer the demand of novel technologies. Built better, built smarter, and built greener, advanced semiconductor memory solutions are sure to meet the global community’s needs in a flash.

The post All in a Flash: How Flash Storage Changed the Way We Live first appeared on SK hynix Newsroom.